EPF10K50VQC240-1

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP

Quantity 1,179 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VQC240-1 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP

The EPF10K50VQC240-1 is an Intel FLEX 10K family embedded programmable logic device optimized for mid-density system integration. As a FLEX 10K device, it combines a logic array and embedded memory blocks to implement general-purpose logic and dedicated megafunctions for embedded systems and SOPC-style integration.

This part targets applications that require a balance of logic capacity, on-chip RAM and flexible I/O in a surface-mount 240-pin BFQFP package, with commercial-grade operating range and RoHS compliance.

Key Features

  • Logic Capacity — 2,880 logic elements and 360 logic array blocks provide mid-density programmable logic resources for glue logic, control functions and custom datapaths.
  • Embedded Memory — 20,480 total RAM bits implemented across embedded array blocks, enabling efficient on-chip storage for buffers, FIFOs and state machines.
  • System Gates — Up to 116,000 maximum system gates for combined logic and RAM usage as indicated by the FLEX 10K family data.
  • I/O and Interfaces — 189 user I/O pins with per-pin features available in the FLEX 10K family such as individual tri-state control, open-drain option and programmable output slew-rate.
  • Clocking and Performance — Family-level clock features include low-skew clock distribution, multiple global clock signals, and options such as ClockLock™ and ClockBoost™ for reduced clock delay/skew and clock multiplication.
  • Reconfiguration and Test — In-circuit reconfigurability via external configuration device or JTAG port and built-in IEEE 1149.1 JTAG boundary-scan test circuitry (family feature).
  • Power and Supply — Rated for operation from 3.0 V to 3.6 V per part data.
  • Package and Mounting — 240-BFQFP surface-mount package (supplier device package: 240-PQFP 32×32) for board-level placement and compact layouts.
  • Operating Range and Compliance — Commercial-grade device with operating temperature 0 °C to 70 °C and RoHS compliant status.

Typical Applications

  • Embedded Systems — Implement SOPC-style integration, combining custom logic and on-chip memory to consolidate functions in compact embedded designs.
  • Interface Bridging & Glue Logic — Use available logic elements and plentiful I/O to bridge buses, translate signals and implement board-level control logic.
  • Memory-Intensive Functions — Leverage 20,480 bits of embedded RAM across EABs for buffering, FIFOs and local scratch storage.
  • Prototyping and Development — Mid-density resource set supports rapid development of custom logic and functional prototypes requiring programmable I/O and reconfiguration.

Unique Advantages

  • Balanced mid-density resources: 2,880 logic elements and 20,480 bits of embedded RAM enable a broad range of control and data-path functions without excessive device overhead.
  • Rich I/O capability: 189 user I/Os with per-pin control options support flexible interfacing to peripherals and external logic.
  • On-board configurability and test: In-circuit reconfigurability and IEEE 1149.1 JTAG support simplify development, field updates and boundary-scan testing.
  • Family-level clock features: Low-skew clock distribution plus ClockLock™/ClockBoost™ options help manage timing for multi-clock designs.
  • Compact surface-mount package: 240-pin BFQFP (240-PQFP 32×32) provides a space-efficient footprint for PCB layouts.
  • Commercial-grade compliance: Operates across 0 °C to 70 °C and is RoHS compliant to meet standard commercial product requirements.

Why Choose EPF10K50VQC240-1?

The EPF10K50VQC240-1 positions itself as a practical mid-density FPGA solution for designers who need a combination of programmable logic, embedded memory and flexible I/O in a compact surface-mount package. Its resources support control logic, interface bridging and embedded storage while family-level features—such as in-circuit reconfiguration, JTAG test support and advanced clock options—help streamline development and system integration.

This device is well suited to teams building commercial embedded products, prototypes and systems that require scalable logic capacity with on-chip RAM and robust I/O count, while maintaining RoHS compliance and standard commercial temperature operation.

Request a quote or submit a sales inquiry to evaluate the EPF10K50VQC240-1 for your next mid-density FPGA design.

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