EPF10K50VQC240-2N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP |
|---|---|
| Quantity | 650 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VQC240-2N – FLEX-10K Field Programmable Gate Array (FPGA) IC, 240-BFQFP
The EPF10K50VQC240-2N is a FLEX 10K family field programmable gate array offering embedded programmable logic and on-chip memory for mid-density system integration. This device combines 2,880 logic elements and approximately 20,480 bits of embedded RAM to support implementation of megafunctions, custom logic, and I/O-rich designs in commercial-grade applications.
Designed for 3.0 V–3.6 V supply operation and surface-mount deployment in a 240-pin BFQFP package, the part targets embedded system designers who require reconfigurable logic, substantial on-chip memory, and a high count of user I/O pins within a compact package and commercial temperature range.
Key Features
- FLEX 10K architecture 2,880 logic elements and 360 LABs provide mid-density programmable logic resources for implementing combinational and sequential functions.
- Embedded memory Total on-chip RAM of 20,480 bits distributed across embedded array blocks for efficient megafunction and buffer implementation.
- Logic capacity Up to 116,000 system gates (maximum) for scaling logic and system-level integration within the FLEX 10K family.
- I/O resources 189 user I/O pins to support diverse peripheral interfacing and high pin-count connectivity in I/O‑intensive designs.
- Power and voltage Operates from 3.0 V to 3.6 V, suitable for 3.3 V system rails used in many commercial embedded applications.
- Package and mounting Available in a 240-BFQFP (supplier device package: 240‑PQFP, 32×32) surface-mount package for PCB assembly and compact board layouts.
- Commercial temperature grade Rated for operation from 0 °C to 70 °C and designated as commercial grade for typical commercial product environments.
- Reconfigurability and test support Family-level features include in-circuit reconfigurability and built-in JTAG boundary-scan support for device configuration and board-level testability.
- RoHS compliant Conforms to RoHS environmental requirements for lead-free assembly and regulatory compliance.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) integration Implement embedded megafunctions and combine memory and logic to consolidate system functions onto a single programmable device.
- Interface bridging and I/O expansion Use the device’s 189 I/O pins to implement protocol bridging, bus interfacing, or GPIO-rich peripheral controllers.
- Memory‑backed logic functions Leverage approximately 20,480 bits of embedded RAM for FIFOs, buffers, and other memory-intensive logic blocks.
- Arithmetic and high fan‑in logic Deploy dedicated carry and cascade chains (family features) for efficient adders, counters, and complex combinational logic functions.
Unique Advantages
- Integrated logic and memory: Combines 2,880 logic elements with 20,480 bits of embedded RAM to reduce external component count and board complexity.
- High effective gate count: Maximum system gates up to 116,000 enable designs that require substantial programmable resources without moving to higher-density parts.
- Robust I/O capacity: 189 user I/O pins accommodate multiple peripherals and parallel interfaces, simplifying board-level connectivity.
- Commercial-grade readiness: Rated for 0 °C to 70 °C operation and RoHS compliance, suitable for a wide range of commercial embedded products.
- Flexible packaging: 240-pin BFQFP surface-mount package offers a balance of pin count and board footprint for many PCB layouts.
- On-board test and configuration support: Family-level JTAG/boundary-scan and in-circuit reconfigurability options assist in board bring-up, production test, and field configuration.
Why Choose EPF10K50VQC240-2N?
The EPF10K50VQC240-2N delivers a balanced combination of programmable logic, on-chip memory, and abundant I/O in a commercial-grade, surface-mount 240-pin package. Its FLEX 10K family architecture and reconfigurability make it a practical choice for mid-density embedded systems that require integration of Megafunctions, flexible interface support, and in-field configurability.
This device is well suited for design teams looking to consolidate functions, reduce BOM, and accelerate time-to-market while maintaining the flexibility to update logic post-deployment. Manufacturer-backed family features and RoHS compliance support long-term procurement and production planning for commercial applications.
Request a quote or submit an RFQ to receive pricing and availability details for the EPF10K50VQC240-2N.

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