EPF10K50VQC240-2N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP

Quantity 650 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VQC240-2N – FLEX-10K Field Programmable Gate Array (FPGA) IC, 240-BFQFP

The EPF10K50VQC240-2N is a FLEX 10K family field programmable gate array offering embedded programmable logic and on-chip memory for mid-density system integration. This device combines 2,880 logic elements and approximately 20,480 bits of embedded RAM to support implementation of megafunctions, custom logic, and I/O-rich designs in commercial-grade applications.

Designed for 3.0 V–3.6 V supply operation and surface-mount deployment in a 240-pin BFQFP package, the part targets embedded system designers who require reconfigurable logic, substantial on-chip memory, and a high count of user I/O pins within a compact package and commercial temperature range.

Key Features

  • FLEX 10K architecture  2,880 logic elements and 360 LABs provide mid-density programmable logic resources for implementing combinational and sequential functions.
  • Embedded memory  Total on-chip RAM of 20,480 bits distributed across embedded array blocks for efficient megafunction and buffer implementation.
  • Logic capacity  Up to 116,000 system gates (maximum) for scaling logic and system-level integration within the FLEX 10K family.
  • I/O resources  189 user I/O pins to support diverse peripheral interfacing and high pin-count connectivity in I/O‑intensive designs.
  • Power and voltage  Operates from 3.0 V to 3.6 V, suitable for 3.3 V system rails used in many commercial embedded applications.
  • Package and mounting  Available in a 240-BFQFP (supplier device package: 240‑PQFP, 32×32) surface-mount package for PCB assembly and compact board layouts.
  • Commercial temperature grade  Rated for operation from 0 °C to 70 °C and designated as commercial grade for typical commercial product environments.
  • Reconfigurability and test support  Family-level features include in-circuit reconfigurability and built-in JTAG boundary-scan support for device configuration and board-level testability.
  • RoHS compliant  Conforms to RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) integration  Implement embedded megafunctions and combine memory and logic to consolidate system functions onto a single programmable device.
  • Interface bridging and I/O expansion  Use the device’s 189 I/O pins to implement protocol bridging, bus interfacing, or GPIO-rich peripheral controllers.
  • Memory‑backed logic functions  Leverage approximately 20,480 bits of embedded RAM for FIFOs, buffers, and other memory-intensive logic blocks.
  • Arithmetic and high fan‑in logic  Deploy dedicated carry and cascade chains (family features) for efficient adders, counters, and complex combinational logic functions.

Unique Advantages

  • Integrated logic and memory: Combines 2,880 logic elements with 20,480 bits of embedded RAM to reduce external component count and board complexity.
  • High effective gate count: Maximum system gates up to 116,000 enable designs that require substantial programmable resources without moving to higher-density parts.
  • Robust I/O capacity: 189 user I/O pins accommodate multiple peripherals and parallel interfaces, simplifying board-level connectivity.
  • Commercial-grade readiness: Rated for 0 °C to 70 °C operation and RoHS compliance, suitable for a wide range of commercial embedded products.
  • Flexible packaging: 240-pin BFQFP surface-mount package offers a balance of pin count and board footprint for many PCB layouts.
  • On-board test and configuration support: Family-level JTAG/boundary-scan and in-circuit reconfigurability options assist in board bring-up, production test, and field configuration.

Why Choose EPF10K50VQC240-2N?

The EPF10K50VQC240-2N delivers a balanced combination of programmable logic, on-chip memory, and abundant I/O in a commercial-grade, surface-mount 240-pin package. Its FLEX 10K family architecture and reconfigurability make it a practical choice for mid-density embedded systems that require integration of Megafunctions, flexible interface support, and in-field configurability.

This device is well suited for design teams looking to consolidate functions, reduce BOM, and accelerate time-to-market while maintaining the flexibility to update logic post-deployment. Manufacturer-backed family features and RoHS compliance support long-term procurement and production planning for commercial applications.

Request a quote or submit an RFQ to receive pricing and availability details for the EPF10K50VQC240-2N.

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