EPF10K50VQC240-3N

The EPF10K50VQC240-3N is an Intel FLEX-10K series field programmable gate array designed for embedded programmable logic applications. It combines a logic array with embedded memory blocks to implement system-level functions and megafunctions on a single device.

Targeted at commercial designs, this surface-mount device delivers 2,880 logic elements, approximately 20,480 bits of embedded RAM, up to 189 user I/O pins in the 240-BFQFP package, and operates from a 3.0 V to 3.6 V supply across a 0 °C to 70 °C temperature range.

Key Features

• Logic Capacity – 2,880 logic elements and up to 116,000 maximum system gates provide the compute fabric for glue logic, state machines, and custom datapaths.
• Embedded Memory – Approximately 20,480 bits of on-chip RAM implemented via embedded array blocks to support FIFOs, buffers, and small on-chip data storage without consuming logic element capacity.
• I/O and Packaging – 189 user I/O pins in a 240-BFQFP (supplier package: 240-PQFP 32×32) surface-mount package for flexible board-level integration and package-level I/O routing.
• Supply and Commercial Grade – Designed for 3.0 V to 3.6 V operation and specified for commercial temperature operation from 0 °C to 70 °C.
• Reconfiguration and Test – In-circuit reconfigurability via external configuration devices and JTAG boundary-scan support for device programming and board-level testability.
• Clocking and Performance – Built-in low-skew clock distribution trees and options such as ClockLock and ClockBoost to manage clock delay and support high-performance internal timing.
• Fast Interconnect and Arithmetic Support – FastTrack continuous routing structure plus dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic implementations.
• Programmable I/O Controls – Per-pin tri-state output enable, open-drain option, and programmable output slew-rate control to manage interfacing and switching noise.
• Standards & Reliability Features – Built-in IEEE 1149.1 JTAG boundary-scan for board-level test and debug without consuming device logic.
• Compliance – RoHS compliant.

Typical Applications

• Embedded Control – Implement custom control logic, state machines, and peripheral glue in commercial embedded systems using the device’s logic elements and on-chip RAM.
• Interface Bridging – Provide protocol adaptation and bus bridging between subsystems with flexible I/O control and dedicated routing resources.
• Prototyping and Development – Use in hardware prototypes or low- to mid-density programmable designs that require reconfigurability and in-circuit programming via JTAG or external configuration devices.
• Data Buffering and Small Memories – Take advantage of embedded RAM blocks for FIFOs, packet buffers, and temporary storage without consuming additional logic cells.

Unique Advantages

• Balanced Logic and Memory: The combination of 2,880 logic elements and approximately 20,480 bits of embedded RAM lets you implement control, combinational logic, and local data storage within the same device.
• Flexible I/O in a Compact Package: 189 user I/Os in a 240-pin BFQFP package provide a dense I/O count for board designs that require many external interfaces while remaining surface-mount friendly.
• Reconfigurability and Testability: In-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan support simplify firmware updates and board-level diagnostics.
• Deterministic Routing and Arithmetic Support: FastTrack routing and dedicated carry/cascade chains reduce routing uncertainty and accelerate arithmetic implementations.
• Programmable I/O Behavior: Per-pin tri-state enable, open-drain option, and slew-rate control allow precise signal integrity and interfacing adjustments without additional components.
• Standards-Conscious Design: RoHS compliance and commercial-grade specifications align the device with common electronics manufacturing and environmental requirements.

Why Choose EPF10K50VQC240-3N?

The EPF10K50VQC240-3N provides a well-rounded programmable logic option for commercial embedded designs that need a mix of logic resources, on-chip RAM, and flexible I/O in a 240-pin surface-mount package. Its built-in reconfiguration, JTAG support, deterministic interconnect, and dedicated arithmetic resources make it suitable for applications requiring in-field updates, prototyping, or medium-complexity system glue logic.

This part is appropriate for teams seeking a commercially graded FPGA solution with explicit on-chip memory, a clear voltage and temperature specification, and features that simplify board-level integration and test.

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