EPF10K50VRC240-1

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad

Quantity 182 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VRC240-1 – FLEX-10K® Field Programmable Gate Array (FPGA) IC · 189 I/O · 20,480 bits · 2,880 logic elements · 240-BFQFP Exposed Pad

The EPF10K50VRC240-1 is an Intel FLEX 10K family embedded programmable logic device configured for 3.3 V systems. It pairs a dedicated logic array with embedded memory blocks to implement custom logic, megafunctions and memory-intensive functions for system-level integration.

Designed for commercial applications, the device offers 2,880 logic elements, approximately 20,480 bits of on-chip RAM, and up to 189 user I/O pins in a 240-pin BFQFP package with exposed pad, making it suitable for mid-density configurable designs that require substantial I/O and embedded memory.

Key Features

  • Core Logic  2,880 logic elements (LEs) and a maximum system gate capacity of 116,000, enabling implementation of complex custom logic functions within the FLEX 10K architecture.
  • Embedded Memory  20,480 total RAM bits provided via embedded array blocks (EABs); datasheet indicates 2,048 bits per EAB and device support for multiple EABs for megafunctions and efficient on-chip storage.
  • I/O Capacity  Up to 189 user I/O pins to support dense interfacing and mixed-signal board designs; each pin includes programmable output controls as part of the FLEX 10K feature set.
  • Supply and Temperature  Operates from 3.0 V to 3.6 V and is specified for commercial temperature range 0 °C to 70 °C.
  • Configuration and Test  Supports in-circuit reconfigurability (ICR) via external configuration devices, intelligent controllers, or the JTAG port; includes JTAG boundary-scan test circuitry per the FLEX 10K family documentation.
  • Clock and Interconnect  FLEX 10K family features such as dedicated carry and cascade chains and low-skew global clock distribution are available for high-speed arithmetic and wide fan-in logic implementations.
  • Package and Mounting  240-BFQFP with exposed pad (supplier device package: 240-RQFP 32×32) in a surface-mount form factor suitable for standard PCB assembly.
  • Compliance  RoHS compliant and specified as a commercial-grade device.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC)  Integrate memory and specialized logic megafunctions alongside general-purpose logic to consolidate system-level functions on a single device.
  • Memory-Intensive Logic  Implement embedded FIFOs, small on-chip buffers, and other data-path elements using the device’s EABs and 20,480 bits of RAM.
  • I/O and Interface Bridging  Use the 189 available I/O pins for high-density peripheral interfacing, protocol translation, and custom glue-logic between subsystems.
  • Mid-Density Custom Logic  Deploy the device for control, timing, and logic functions where 2,880 logic elements and the FLEX 10K architecture meet project requirements.

Unique Advantages

  • Balanced Logic and Memory: 2,880 logic elements combined with approximately 20,480 bits of embedded RAM (EABs) provide a practical balance for designs that mix control logic and local storage.
  • High I/O Count in a Compact Package: 189 user I/Os in a 240-pin BFQFP (240-RQFP 32×32) surface-mount package enable dense board-level connectivity without moving to larger BGA footprints.
  • Flexible Configuration and Test: In-circuit reconfigurability and built-in JTAG boundary-scan support simplify development, in-system updates, and manufacturing test.
  • 3.3 V System Compatibility: Voltage supply range of 3.0 V to 3.6 V aligns with common 3.3 V digital systems for straightforward integration.
  • Commercial-Grade Specification: Specified for 0 °C to 70 °C operation and RoHS compliance for standard commercial deployments.

Why Choose EPF10K50VRC240-1?

The EPF10K50VRC240-1 brings FLEX 10K family capabilities—embedded memory blocks, a dedicated logic array, and a broad set of architectural features—into a mid-density, commercially rated device. Its combination of 2,880 logic elements, ~20.5 Kbits of on-chip RAM, and 189 I/O pins makes it well suited for designs that require significant I/O and local memory without scaling to the largest FLEX 10K devices.

Choose this device when you need a configurable, reprogrammable solution for system-level integration in 3.3 V designs, packaged in a 240-pin surface-mount BFQFP with exposed pad. The FLEX 10K family feature set—clock distribution, dedicated carry/cascade chains, and in-system configurability—helps streamline implementation and testing for commercial embedded applications.

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