EPF10K50VRC240-1
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 182 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VRC240-1 – FLEX-10K® Field Programmable Gate Array (FPGA) IC · 189 I/O · 20,480 bits · 2,880 logic elements · 240-BFQFP Exposed Pad
The EPF10K50VRC240-1 is an Intel FLEX 10K family embedded programmable logic device configured for 3.3 V systems. It pairs a dedicated logic array with embedded memory blocks to implement custom logic, megafunctions and memory-intensive functions for system-level integration.
Designed for commercial applications, the device offers 2,880 logic elements, approximately 20,480 bits of on-chip RAM, and up to 189 user I/O pins in a 240-pin BFQFP package with exposed pad, making it suitable for mid-density configurable designs that require substantial I/O and embedded memory.
Key Features
- Core Logic 2,880 logic elements (LEs) and a maximum system gate capacity of 116,000, enabling implementation of complex custom logic functions within the FLEX 10K architecture.
- Embedded Memory 20,480 total RAM bits provided via embedded array blocks (EABs); datasheet indicates 2,048 bits per EAB and device support for multiple EABs for megafunctions and efficient on-chip storage.
- I/O Capacity Up to 189 user I/O pins to support dense interfacing and mixed-signal board designs; each pin includes programmable output controls as part of the FLEX 10K feature set.
- Supply and Temperature Operates from 3.0 V to 3.6 V and is specified for commercial temperature range 0 °C to 70 °C.
- Configuration and Test Supports in-circuit reconfigurability (ICR) via external configuration devices, intelligent controllers, or the JTAG port; includes JTAG boundary-scan test circuitry per the FLEX 10K family documentation.
- Clock and Interconnect FLEX 10K family features such as dedicated carry and cascade chains and low-skew global clock distribution are available for high-speed arithmetic and wide fan-in logic implementations.
- Package and Mounting 240-BFQFP with exposed pad (supplier device package: 240-RQFP 32×32) in a surface-mount form factor suitable for standard PCB assembly.
- Compliance RoHS compliant and specified as a commercial-grade device.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) Integrate memory and specialized logic megafunctions alongside general-purpose logic to consolidate system-level functions on a single device.
- Memory-Intensive Logic Implement embedded FIFOs, small on-chip buffers, and other data-path elements using the device’s EABs and 20,480 bits of RAM.
- I/O and Interface Bridging Use the 189 available I/O pins for high-density peripheral interfacing, protocol translation, and custom glue-logic between subsystems.
- Mid-Density Custom Logic Deploy the device for control, timing, and logic functions where 2,880 logic elements and the FLEX 10K architecture meet project requirements.
Unique Advantages
- Balanced Logic and Memory: 2,880 logic elements combined with approximately 20,480 bits of embedded RAM (EABs) provide a practical balance for designs that mix control logic and local storage.
- High I/O Count in a Compact Package: 189 user I/Os in a 240-pin BFQFP (240-RQFP 32×32) surface-mount package enable dense board-level connectivity without moving to larger BGA footprints.
- Flexible Configuration and Test: In-circuit reconfigurability and built-in JTAG boundary-scan support simplify development, in-system updates, and manufacturing test.
- 3.3 V System Compatibility: Voltage supply range of 3.0 V to 3.6 V aligns with common 3.3 V digital systems for straightforward integration.
- Commercial-Grade Specification: Specified for 0 °C to 70 °C operation and RoHS compliance for standard commercial deployments.
Why Choose EPF10K50VRC240-1?
The EPF10K50VRC240-1 brings FLEX 10K family capabilities—embedded memory blocks, a dedicated logic array, and a broad set of architectural features—into a mid-density, commercially rated device. Its combination of 2,880 logic elements, ~20.5 Kbits of on-chip RAM, and 189 I/O pins makes it well suited for designs that require significant I/O and local memory without scaling to the largest FLEX 10K devices.
Choose this device when you need a configurable, reprogrammable solution for system-level integration in 3.3 V designs, packaged in a 240-pin surface-mount BFQFP with exposed pad. The FLEX 10K family feature set—clock distribution, dedicated carry/cascade chains, and in-system configurability—helps streamline implementation and testing for commercial embedded applications.
Request a quote or submit an inquiry to get pricing, availability, and lead-time information for EPF10K50VRC240-1.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018