EPF10K50VQI240-2

The EPF10K50VQI240-2 is a FLEX 10K family FPGA / embedded programmable logic device designed for high-density, configurable logic and memory integration. It combines 2,880 logic elements and approximately 20,480 bits of embedded RAM with a 189-pin I/O count to support complex control, glue-logic, and system integration tasks in industrial applications.

Built for system-level flexibility, the device supports in-circuit reconfigurability and family-level features such as on-chip boundary-scan and advanced clocking options, making it well suited for industrial controls, communications peripherals, and embedded system prototyping where integration and reliability are important.

Key Features

• Core density  Contains 2,880 logic elements and 360 logic array blocks, delivering the capacity for multi-function logic implementations.
• Gate capacity  Provides up to 116,000 system gates for combined logic and memory resources.
• Embedded memory  Approximately 20,480 bits of on-chip RAM to implement buffers, small FIFOs, and state storage without external memory.
• I/O resources  189 user I/O pins to interface with sensors, buses, and peripherals in medium-complexity designs.
• System and test features  Family-level built-in JTAG boundary-scan (IEEE Std. 1149.1) and support for in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG.
• Clock and routing  Family features include low-skew clock distribution, dedicated carry and cascade chains, and FastTrack interconnect for predictable routing performance.
• Package & mounting  240-BFQFP package (supplier device package: 240-PQFP 32×32) in a surface-mount footprint for high pin-count board designs.
• Power supply  Operates from a 3 V to 3.6 V supply range, suitable for 3.3 V system domains.
• Industrial temperature grade  Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
• RoHS compliant  Meets RoHS environmental requirements.

Typical Applications

• Industrial control and automation  Implement motor control logic, protocol bridging, and deterministic I/O handling using on-chip logic and memory.
• Embedded systems and SoC integration  Integrate custom peripherals, glue logic and interface adaptation in compact system designs with in-circuit reconfigurability for updates.
• Communications and peripherals  Protocol translation, bus interfacing, and timing-critical datapath functions leveraging dedicated carry/cascade and clock resources.
• Test and measurement equipment  Use JTAG boundary-scan and programmable logic to implement test access, control state machines, and acquisition front-ends.

Unique Advantages

• High integration density: 2,880 logic elements and 20,480 bits of embedded RAM reduce the need for external glue logic and memory, simplifying BOM and board area.
• Rich I/O capability: 189 user I/Os provide flexible interfacing options for diverse peripherals and sensors in medium-complexity systems.
• Industrial robustness: Surface-mount 240-pin BFQFP package and −40 °C to 85 °C rating support deployment in industrial environments.
• Built-in testability: JTAG boundary-scan circuitry supports board-level test and in-system programming without consuming user logic resources.
• Flexible system integration: Family-level features such as dedicated carry chains, clock distribution, and in-circuit reconfigurability enable efficient implementation of arithmetic, timing, and reprogrammable functions.

Why Choose EPF10K50VQI240-2?

The EPF10K50VQI240-2 positions itself as a versatile, industrial-grade programmable logic device that balances logic capacity, embedded memory, and I/O density for system integration tasks. Its combination of 2,880 logic elements, approximately 20,480 bits of on-chip RAM, and 189 I/Os makes it suitable for designers needing a configurable, tested building block in industrial and embedded applications.

With family-level support for JTAG boundary-scan, in-circuit reconfigurability, and dedicated routing/clock resources, this device delivers a practical path to reduce external components and accelerate prototype-to-production development while maintaining qualification for industrial operating conditions.

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