EPF10K50VQC240-3
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP |
|---|---|
| Quantity | 1,252 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VQC240-3 – FLEX-10K Field Programmable Gate Array (FPGA)
The EPF10K50VQC240-3 is a FLEX-10K series FPGA in a 240-pin BFQFP surface-mount package optimized for commercial embedded designs. It pairs a dedicated logic array with embedded memory arrays to support megafunction integration and system-level programmable logic.
Typical use cases include embedded systems, communications and consumer electronics where mid-range logic density, substantial on-chip RAM, and flexible I/O are required. The device delivers a balance of integration and configurability for custom logic, interface bridging, and prototype-to-production designs.
Key Features
- Logic Capacity – 2,880 logic elements (LEs) and 360 logic array blocks (LABs) to implement mid-range combinational and sequential logic functions.
- System Gates – Up to 116,000 maximum system gates for designs combining logic and embedded resources.
- Embedded Memory – 20,480 total RAM bits (approximately 0.020 Mbits) of on-chip embedded memory for buffering, small lookup tables, and megafunction storage.
- I/O and Interfaces – 189 user I/O pins to support a broad set of external peripherals and interface requirements while enabling flexible board-level connectivity.
- Power Supply – Designed for a 3.0 V to 3.6 V supply range suitable for 3.3 V system domains.
- Package & Mounting – 240-BFQFP (240-PQFP 32×32) surface-mount package for PCB designs prioritizing accessible pinout and thermal performance.
- Commercial Temperature Grade – Rated for 0 °C to 70 °C operation for standard commercial applications.
- In-Circuit Reconfigurability & JTAG – Supports in-circuit reconfigurability via external configuration devices or JTAG boundary-scan circuitry, enabling field updates and board-level test.
- Series-Level System Features – FLEX 10K family features such as dedicated carry and cascade chains, low-skew clock distribution, ClockLock/ClockBoost options, and FastTrack interconnect to simplify high-speed arithmetic and routed designs.
- Compliance – RoHS compliant to meet environmental and regulatory requirements for lead-free assemblies.
Typical Applications
- Embedded Systems – Implement custom control logic, peripheral interfaces, and data-path functions with integrated memory and flexible I/O.
- Communications Equipment – Bridge interfaces, implement protocol logic and packet buffering with the device’s logic/memory mix and extensive I/O.
- Consumer Electronics – Enable application-specific control, user-interface handling, and feature integration in 3.3 V consumer platforms.
- Prototyping & Development – Rapidly iterate designs and validate custom logic using in-circuit reconfiguration and JTAG boundary-scan support.
- Test & Measurement – Implement timing-critical logic, data capture, and preprocessing tasks using dedicated carry/cascade chains and multiple global clocks.
Unique Advantages
- Balanced Logic and Memory – 2,880 logic elements paired with 20,480 bits of RAM allow integrated megafunctions without external SRAM for many applications.
- High I/O Count – 189 user I/Os provide flexibility to connect multiple peripherals and interfaces while minimizing external glue logic.
- Field Reconfigurability – Support for in-circuit reconfiguration and JTAG boundary-scan enables updates, debugging, and board-level testing without removing the device.
- Package Accessibility – 240-pin BFQFP footprint facilitates easy access to signals for development and production layouts where pin visibility matters.
- Commercial Temperature Fit – 0 °C to 70 °C rating aligns with consumer and many embedded deployments that operate in standard environments.
- Design Ecosystem Support – FLEX 10K family design support for common development platforms simplifies synthesis, place-and-route, and megafunction implementation.
Why Choose EPF10K50VQC240-3?
The EPF10K50VQC240-3 delivers a practical mid-range FPGA option for commercial embedded and consumer applications that require a mix of logic, embedded RAM, and a high I/O count in a 240-pin surface-mount package. Its support for in-circuit reconfiguration and JTAG, combined with family-level features like dedicated arithmetic chains and clock options, help accelerate system integration and shorten development cycles.
This device is well suited to teams designing custom logic functions, interface bridging, or prototype platforms that benefit from on-chip memory and flexible connectivity. Its RoHS compliance and commercial temperature rating make it appropriate for standard production deployments.
Request a quote to check availability and pricing for the EPF10K50VQC240-3 or to discuss how this FLEX-10K FPGA can fit your next design.

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