EPF10K50VQI240-2N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP

Quantity 912 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VQI240-2N – FLEX-10K FPGA IC, 2,880 Logic Elements, 20,480 RAM bits, 189 I/O, 240-BFQFP

The EPF10K50VQI240-2N is an Intel FLEX-10K family field programmable gate array (FPGA) offering a balance of logic density, embedded memory and flexible I/O in a 240-pin BFQFP package. Designed for industrial-grade applications, this device targets system-level integration tasks that require on-chip RAM, dedicated arithmetic resources and configurable I/O.

With 2,880 logic elements, approximately 20,480 bits of embedded RAM and 189 user I/O pins, the EPF10K50VQI240-2N is suited to embedded control, custom logic, and interface bridging where reconfigurability and compact board-level packaging are important.

Key Features

  • Core Density and Architecture — 2,880 logic elements and 360 logic array blocks (LABs) provide structured programmable logic for combinational and sequential functions. The family supports up to 116,000 maximum system gates for scalable designs.
  • Embedded Memory — 20,480 total RAM bits of on-chip embedded memory for lookup tables, FIFOs and small data buffers without external memory.
  • I/O and Interface Flexibility — 189 user I/O pins support a variety of board-level interfaces; family-level MultiVolt I/O interface support is available for mixed-voltage designs.
  • Clock and Interconnect — Built-in low-skew clock distribution trees, ClockLock™ and ClockBoost™ options, plus up to six global clock signals and four global clear signals to support multi-clock designs and reduced clock skew.
  • Arithmetic and Logic Support — Dedicated carry chain and cascade chain resources accelerate adders, counters and high fan-in logic functions for efficient arithmetic implementations.
  • Reconfiguration and Test — In-circuit reconfigurability via external configuration devices, intelligent controllers or the JTAG port; built-in IEEE 1149.1 JTAG boundary-scan test circuitry is available without consuming device logic.
  • Package, Power and Mounting — Surface-mount 240-BFQFP package (supplier package: 240-PQFP 32×32). Voltage supply range: 3.0 V to 3.6 V. RoHS compliant.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C, suitable for industrial embedded systems.

Typical Applications

  • Embedded control and automation — Implement custom control logic, timing and state machines using on-chip logic and RAM to reduce external components.
  • Communications and protocol bridging — Use the device’s flexible I/O and embedded logic to implement protocol converters, interface controllers or peripheral bridging.
  • Signal conditioning and preprocessing — Offload preprocessing tasks such as data packing, formatting and arithmetic using dedicated carry chains and on-chip memory.
  • Prototyping and system integration — Reconfigurability and JTAG-based programming support rapid iteration during development and integration of megafunctions.

Unique Advantages

  • Balanced integration: Combines 2,880 logic elements with 20,480 bits of embedded RAM to consolidate logic and small memory needs on a single device, reducing BOM and board complexity.
  • Flexible timing resources: Low-skew clock trees, ClockLock and ClockBoost options simplify multi-clock designs and improve timing predictability.
  • Dedicated arithmetic paths: Built-in carry and cascade chains accelerate adders and high-fan-in logic, enabling efficient implementation of datapath functions.
  • Industry-grade robustness: Industrial operating temperature range (−40 °C to 85 °C) and surface-mount package choices support deployment in industrial embedded systems.
  • In-system programmability and testability: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan test reduce development time and simplify board-level test strategies.

Why Choose EPF10K50VQI240-2N?

The EPF10K50VQI240-2N provides a practical balance of logic capacity, embedded memory and configurable I/O in a compact 240-BFQFP package. Its combination of 2,880 logic elements, approximately 20,480 bits of on-chip RAM and 189 user I/Os makes it a strong option for industrial embedded designs that require reconfigurability, integrated memory and dedicated arithmetic resources.

Designed for engineers who need system-level integration without excessive board-level complexity, this FLEX-10K device benefits from family-level features such as low-skew clock distribution, dedicated carry/cascade chains and JTAG-based configuration and test. These capabilities support scalable designs and help shorten development cycles while maintaining predictable behavior across industrial temperature ranges.

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