EPF10K50VQC240-2
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP |
|---|---|
| Quantity | 1,292 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VQC240-2 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP
The EPF10K50VQC240-2 is a FLEX 10K family embedded programmable logic device from Intel, delivered in a 240-pin BFQFP package. It combines a logic array and embedded memory to implement megafunctions, general logic, and I/O-rich designs for commercial applications.
This device targets mid-range density designs that require a balance of logic capacity, on-chip RAM, and a substantial number of I/O pins. Key on-board capabilities include 2,880 logic elements, approximately 20,480 bits of embedded RAM, and 189 user I/O pins, with a 3 V to 3.6 V supply and commercial temperature grading.
Key Features
- Logic Capacity 2,880 logic elements distributed across 360 LABs provide a mid-range programmable logic fabric suitable for complex control and glue-logic functions.
- Embedded Memory Approximately 20,480 bits of on-chip RAM support storage for FIFOs, small buffers, and megafunctions without consuming logic capacity.
- I/O Density 189 user I/O pins enable broad external interfacing and system connectivity for multi-signal applications.
- Gate Scale Typical maximum system gate count up to 116,000, allowing integration of sizable logic blocks alongside embedded memory.
- Configuration & Test In-circuit reconfigurability via external configuration device or JTAG boundary-scan (IEEE 1149.1) enables device programming and board-level test without using device logic.
- Clock and Timing Built‑in low-skew clock distribution and options such as ClockLock™ and ClockBoost™ (as provided in the FLEX 10K family) help control clock delay and skew for synchronous designs.
- Flexible Routing FastTrack® interconnect and dedicated carry/cascade chains simplify implementation of arithmetic and high‑fan‑in logic functions using automatic tool support.
- Power Operates from a 3 V to 3.6 V supply range; designed for low-power standby behavior as described for the FLEX 10K family.
- Package & Mounting Surface-mount 240-BFQFP package (supplier device package listed as 240-PQFP 32×32) suitable for standard PCB assembly processes.
- Commercial Grade & Compliance Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) integration Embedded array and logic array structure make this device suitable for integrating megafunctions and custom logic in compact SOPC designs.
- Memory and buffering On-chip RAM (approximately 20,480 bits) supports buffering, FIFOs, and memory-intensive megafunctions without external SRAM.
- I/O-rich control systems With 189 user I/O pins, the device can serve as an interface hub for sensor aggregation, peripheral control, and multi-channel digital I/O tasks.
- Custom logic and glue logic 2,880 logic elements accommodate state machines, protocol handling, and data-path logic that glue heterogeneous system components together.
Unique Advantages
- Balanced mid-range capacity: 2,880 logic elements and up to 116,000 gates deliver a practical compromise between density and cost for many commercial designs.
- Integrated on-chip RAM: Approximately 20,480 bits of embedded memory reduce external component count and simplify board-level memory requirements.
- High I/O count: 189 user I/O pins enable complex interfacing without resorting to external I/O expanders.
- In-circuit reconfiguration and JTAG: Supports field programming and boundary-scan testing for easier deployment and manufacturing test flows.
- Deterministic routing primitives: Dedicated carry and cascade chains, plus the FastTrack interconnect architecture, simplify implementation of arithmetic and high‑fan‑in logic using automated tools.
- Vendor ecosystem support: FLEX 10K family features and documented tool support help accelerate design entry, synthesis, and place-and-route workflows.
Why Choose EPF10K50VQC240-2?
The EPF10K50VQC240-2 is positioned for designers who need a commercially graded, mid-range FPGA with a combination of logic, embedded RAM, and substantial I/O in a 240-pin BFQFP package. Its blend of 2,880 logic elements, approximately 20,480 bits of on-chip RAM, and 189 I/Os makes it well suited to SOPC integration, memory‑assisted megafunctions, and control/interface applications.
Backed by FLEX 10K family features such as in-circuit reconfigurability, JTAG boundary-scan, dedicated routing primitives, and documented tool support, this device offers a practical, scalable platform for commercial embedded designs that require modularity and in-field programmability.
Request a quote or submit a purchase inquiry to check availability and lead times for EPF10K50VQC240-2.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018