EPF10K50VFC484-3N

IC FPGA 291 I/O 484FBGA
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 291 20480 2880 484-BBGA

Quantity 772 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O291Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VFC484-3N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 484-BBGA

The EPF10K50VFC484-3N is an Intel FLEX 10K family field programmable gate array (FPGA) provided in a 484-ball BGA surface-mount package. It combines a high-density logic array with embedded memory blocks to enable system-level programmable logic and on-chip resources for custom digital designs.

Targeted at commercial embedded applications, this device offers 2,880 logic elements, 360 logic array blocks (LABs), approximately 20,480 bits of on-chip RAM, and a wide I/O count, delivering integration and reconfigurability for SOPC-style system designs and peripheral logic functions.

Key Features

  • Logic Capacity  2,880 logic elements and 360 LABs supporting up to 116,000 maximum system gates as listed for this family.
  • Embedded Memory  Approximately 20,480 bits of total RAM available in embedded array blocks for on-chip storage and megafunctions.
  • I/O and Connectivity  291 device I/O pins to support a variety of external interfaces and system connections; individual pin control options are supported at the family level.
  • Supply Voltage  Operates from 3.0 V to 3.6 V, matching 3.3 V system domains.
  • Package and Mounting  484-ball BGA (484-FBGA, 23×23) surface-mount package optimized for compact board integration.
  • Commercial Temperature Grade  Specified for 0 °C to 70 °C operation, suitable for commercial embedded equipment.
  • Reconfiguration and Test  Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; family includes IEEE 1149.1 JTAG boundary-scan support.
  • Family-Level System Features  FLEX 10K family capabilities include dedicated carry and cascade chains, low-skew clock distribution options (ClockLock/ClockBoost at the family level), and configurable output slew and open-drain options.
  • Environmental Compliance  RoHS compliant, meeting common lead-free requirements for commercial products.

Typical Applications

  • System Integration / SOPC  Implement system-on-a-programmable-chip architectures and megafunctions that combine logic and embedded RAM for custom system functions.
  • Peripheral and Interface Logic  Use as custom peripheral controllers or interface glue logic where reconfigurable I/O and moderate logic density are required.
  • Embedded Memory Functions  On-chip RAM blocks support buffer, lookup-table, and small data-storage tasks inside embedded designs.
  • PCI and Bus-Based Designs  Applicable to PCI Local Bus (family-level support noted in FLEX 10K documentation) and other bus-interface logic implementations.

Unique Advantages

  • Balanced Logic and Memory:  Combines 2,880 logic elements with roughly 20,480 bits of embedded RAM, enabling compact implementations of control and data functions without external memory for many use cases.
  • High I/O Count:  291 device I/Os provide flexibility to connect multiple peripherals, buses, and sensors directly to the FPGA package.
  • Flexible Reconfiguration:  Supports in-circuit reconfiguration and JTAG boundary-scan for development flexibility, field updates, and test access.
  • Compact BGA Packaging:  484-ball BGA (23×23) offers a small PCB footprint for space-constrained commercial products while maintaining high pin density.
  • Commercial-Grade Specification:  Rated for 0 °C to 70 °C operation and RoHS compliance for standard commercial applications and supply-chain requirements.
  • Family-Level Design Features:  Leverages FLEX 10K family capabilities such as dedicated carry/cascade chains and clock distribution features to simplify arithmetic and timing-critical designs.

Why Choose EPF10K50VFC484-3N?

The EPF10K50VFC484-3N is positioned for commercial embedded designs that require a balance of programmable logic, on-chip RAM, and a high I/O count in a compact BGA package. Its integration of logic elements, LABs, and embedded RAM supports SOPC-style system architectures and mid-density custom logic implementations.

Engineers selecting this device gain access to FLEX 10K family features—reconfigurability, JTAG testability, and architecture elements that simplify arithmetic and bus interfacing—making it suitable for a wide range of commercial applications where board space, reprogrammability, and integration matter.

Request a quote or submit your procurement inquiry today to evaluate EPF10K50VFC484-3N for your next embedded FPGA design.

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