EPF10K50VFC484-3N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 291 20480 2880 484-BBGA |
|---|---|
| Quantity | 772 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 291 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VFC484-3N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 484-BBGA
The EPF10K50VFC484-3N is an Intel FLEX 10K family field programmable gate array (FPGA) provided in a 484-ball BGA surface-mount package. It combines a high-density logic array with embedded memory blocks to enable system-level programmable logic and on-chip resources for custom digital designs.
Targeted at commercial embedded applications, this device offers 2,880 logic elements, 360 logic array blocks (LABs), approximately 20,480 bits of on-chip RAM, and a wide I/O count, delivering integration and reconfigurability for SOPC-style system designs and peripheral logic functions.
Key Features
- Logic Capacity 2,880 logic elements and 360 LABs supporting up to 116,000 maximum system gates as listed for this family.
- Embedded Memory Approximately 20,480 bits of total RAM available in embedded array blocks for on-chip storage and megafunctions.
- I/O and Connectivity 291 device I/O pins to support a variety of external interfaces and system connections; individual pin control options are supported at the family level.
- Supply Voltage Operates from 3.0 V to 3.6 V, matching 3.3 V system domains.
- Package and Mounting 484-ball BGA (484-FBGA, 23×23) surface-mount package optimized for compact board integration.
- Commercial Temperature Grade Specified for 0 °C to 70 °C operation, suitable for commercial embedded equipment.
- Reconfiguration and Test Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; family includes IEEE 1149.1 JTAG boundary-scan support.
- Family-Level System Features FLEX 10K family capabilities include dedicated carry and cascade chains, low-skew clock distribution options (ClockLock/ClockBoost at the family level), and configurable output slew and open-drain options.
- Environmental Compliance RoHS compliant, meeting common lead-free requirements for commercial products.
Typical Applications
- System Integration / SOPC Implement system-on-a-programmable-chip architectures and megafunctions that combine logic and embedded RAM for custom system functions.
- Peripheral and Interface Logic Use as custom peripheral controllers or interface glue logic where reconfigurable I/O and moderate logic density are required.
- Embedded Memory Functions On-chip RAM blocks support buffer, lookup-table, and small data-storage tasks inside embedded designs.
- PCI and Bus-Based Designs Applicable to PCI Local Bus (family-level support noted in FLEX 10K documentation) and other bus-interface logic implementations.
Unique Advantages
- Balanced Logic and Memory: Combines 2,880 logic elements with roughly 20,480 bits of embedded RAM, enabling compact implementations of control and data functions without external memory for many use cases.
- High I/O Count: 291 device I/Os provide flexibility to connect multiple peripherals, buses, and sensors directly to the FPGA package.
- Flexible Reconfiguration: Supports in-circuit reconfiguration and JTAG boundary-scan for development flexibility, field updates, and test access.
- Compact BGA Packaging: 484-ball BGA (23×23) offers a small PCB footprint for space-constrained commercial products while maintaining high pin density.
- Commercial-Grade Specification: Rated for 0 °C to 70 °C operation and RoHS compliance for standard commercial applications and supply-chain requirements.
- Family-Level Design Features: Leverages FLEX 10K family capabilities such as dedicated carry/cascade chains and clock distribution features to simplify arithmetic and timing-critical designs.
Why Choose EPF10K50VFC484-3N?
The EPF10K50VFC484-3N is positioned for commercial embedded designs that require a balance of programmable logic, on-chip RAM, and a high I/O count in a compact BGA package. Its integration of logic elements, LABs, and embedded RAM supports SOPC-style system architectures and mid-density custom logic implementations.
Engineers selecting this device gain access to FLEX 10K family features—reconfigurability, JTAG testability, and architecture elements that simplify arithmetic and bus interfacing—making it suitable for a wide range of commercial applications where board space, reprogrammability, and integration matter.
Request a quote or submit your procurement inquiry today to evaluate EPF10K50VFC484-3N for your next embedded FPGA design.

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