EPF10K50VBI356-4N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA |
|---|---|
| Quantity | 1,015 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 274 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VBI356-4N – FLEX-10K FPGA, 2,880 logic elements, 20,480-bit RAM, 274 I/O, 356-LBGA
The EPF10K50VBI356-4N is a FLEX 10K family field-programmable gate array (FPGA) device in a 356-LBGA package, optimized for industrial applications requiring reconfigurable logic and embedded memory. It combines a dedicated logic array and embedded array blocks to implement megafunctions, on-chip RAM, and general-purpose logic within a single programmable device.
Suited for embedded control, system integration, and interface-intensive designs, this device delivers substantial I/O density and on-chip resources while operating from a 3.0 V to 3.6 V supply and across an industrial temperature range.
Key Features
- Logic Capacity Provides 2,880 logic elements and 360 logic array blocks, supporting up to 116,000 maximum system gates for complex logic implementations.
- Embedded Memory Approximately 20,480 bits of embedded RAM provided via the FLEX 10K EAB architecture for buffering, lookup tables, and megafunctions.
- I/O Density 274 user I/O pins enable broad connectivity for parallel interfaces, sensor networks, and multi‑domain signal routing.
- Package 356-LBGA (356-BGA, 35×35) surface-mount package for compact board integration and high pin count in a small footprint.
- Voltage and Power Operates from 3.0 V to 3.6 V supply, compatible with 3.3 V system domains.
- Industrial Temperature Grade Rated for operation from −40 °C to 85 °C to meet industrial-environment requirements.
- On-board Test and Configuration Built-in JTAG boundary-scan (IEEE Std. 1149.1) supports device programming and board-level test without consuming user logic.
- Reconfigurability and System Integration Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; enables System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Industrial Control Implement motor control logic, I/O aggregation and real-time sequencing where on-chip RAM and reconfigurable logic simplify board-level design.
- Embedded Systems Use as a central programmable fabric for protocol bridging, custom peripherals, and system integration tasks that benefit from reprogrammability and high I/O counts.
- Data Buffering and Processing Leverage the device’s embedded RAM and logic elements for packet buffering, FIFO implementations, and small data-path processing functions.
- Prototyping and Development Flexible logic resources and JTAG-based configuration make this device suitable for iterative hardware development and functional prototyping.
Unique Advantages
- High I/O Count 274 I/O pins enable direct connection to multiple peripherals and parallel buses, reducing the need for external interface components.
- Integrated On-chip Memory About 20,480 bits of embedded RAM across EABs provide local storage for buffering and megafunctions, reducing external memory dependencies.
- Industrial Qualification Rated for −40 °C to 85 °C operation, supporting deployment in industrial environments where temperature resilience is required.
- Compact, High-density Package 356-LBGA package offers a high pin count in a compact form factor for space-constrained designs.
- Design and Test Convenience On-chip JTAG boundary-scan and support for in-circuit reconfiguration streamline programming, verification, and field updates.
Why Choose EPF10K50VBI356-4N?
The EPF10K50VBI356-4N positions itself as a flexible, industrial-grade FPGA option within the FLEX 10K family, balancing logic capacity, embedded memory, and high I/O density in a compact 356-LBGA package. Its on-chip resources and in-circuit reconfigurability make it suitable for embedded system integrators and industrial designers who need programmable logic with reliable temperature and voltage characteristics.
Choosing this device supports scalable designs that benefit from the FLEX 10K architecture’s embedded array blocks, boundary-scan programming, and family-level software design support described in the datasheet, enabling efficient development and long-term maintainability.
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