EPF10K50VBI356-3

IC FPGA 274 I/O 356BGA
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA

Quantity 546 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case356-LBGANumber of I/O274Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VBI356-3 – FLEX-10K FPGA (356-LBGA)

The EPF10K50VBI356-3 is a FLEX-10K family field programmable gate array (FPGA) from Intel, supplied in a 356-ball low-profile BGA (35 × 35 mm) package for surface-mount assembly. This industrial-grade device delivers moderate-density programmable logic with 2,880 logic elements, approximately 20,480 bits of embedded RAM, and 274 user I/O pins for versatile embedded and industrial designs.

Designed for applications that need reconfigurable logic, significant I/O count, and on-chip memory, the device provides system-level integration and configurability while operating from a 3.0 V to 3.6 V supply and across an industrial temperature range of −40 °C to 85 °C.

Key Features

  • Core Logic 2,880 logic elements delivering programmable logic resources suitable for moderate-complexity designs and custom logic functions.
  • Memory Approximately 20,480 bits of embedded RAM for implementing FIFOs, buffers, and small on-chip data stores.
  • Density and Gates Up to 116,000 system gates providing headroom for combined logic and RAM implementations.
  • I/O and Interfaces 274 user I/O pins on a 356-LBGA package, providing flexible external connectivity for parallel buses, peripheral interfaces, and board-level I/O routing.
  • Configuration and Test Supports in-circuit reconfigurability and JTAG boundary-scan for device programming and board-level testability (per FLEX 10K family features).
  • Clocking and Performance Family-level features include low-skew clock distribution and options such as ClockLock/ClockBoost to address timing and clocking requirements.
  • Package and Mounting 356-ball BGA (35 × 35 mm) surface-mount package to maximize board area efficiency and support dense PCB layouts.
  • Industrial Operation and Compliance Rated for industrial temperature operation (−40 °C to 85 °C) and RoHS compliant.
  • Power Supply Operates from a 3.0 V to 3.6 V supply, matching common 3.3 V system domains.

Typical Applications

  • Industrial Control Implement motor control logic, I/O aggregation, and deterministic control paths using reconfigurable logic and on-chip memory.
  • Embedded Systems Integrate custom peripheral interfaces, protocol bridging, and glue logic in compact system-on-board designs.
  • Communications and Networking Perform packet buffering, customizable protocol handling, and interface adaptation with available RAM and high I/O count.
  • Test & Measurement Create application-specific data processing, timing, and capture functions with reprogrammable logic and peripheral I/O.

Unique Advantages

  • Moderate-density, production-ready logic: 2,880 logic elements and up to 116,000 system gates provide a balance of capacity for control and data-path functions.
  • On-chip embedded memory: Approximately 20,480 bits of RAM reduce external memory dependence for small buffers and state storage.
  • High I/O count in a compact BGA: 274 user I/Os in a 356-LBGA package enable rich peripheral connectivity while conserving PCB area.
  • Industrial-grade operation: Specified for −40 °C to 85 °C and RoHS compliant for deployment in industrial environments.
  • Flexible configuration and testability: In-circuit reconfigurability and JTAG support simplify field updates and board-level testing.
  • Vendor family ecosystem: FLEX 10K family features support system-level integration options such as embedded arrays and clocking optimizations (as documented for the family).

Why Choose EPF10K50VBI356-3?

The EPF10K50VBI356-3 positions itself as a practical, industrial-grade FPGA choice when designers require a reconfigurable device with a solid balance of logic resources, embedded RAM, and a high I/O count in a BGA package. Its operating voltage range and temperature rating make it suitable for 3.3 V system domains and industrial environments.

For teams building embedded controllers, protocol bridges, and I/O-intensive modules, this FLEX-10K family device offers familiar family-level features—such as in-circuit reconfigurability, JTAG testability, and flexible clocking—together with available software design support noted for the FLEX 10K family, helping reduce development time and integrate into existing design flows.

If you would like pricing, availability, or a formal quote for EPF10K50VBI356-3, submit a request and our team will provide a prompt response with tailored ordering information.

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