EPF10K50VBI356-3N

The EPF10K50VBI356-3N is a FLEX 10K family embedded programmable logic device from Intel. It combines a dedicated logic array and embedded memory resources to support system-on-a-programmable-chip (SOPC) integration for embedded and industrial designs.

With 2,880 logic elements, 20,480 bits of on-chip RAM, and 274 user I/O, this surface-mount 356-LBGA device delivers a balance of logic density, embedded memory, and I/O capacity for connectivity-rich applications operating from 3.0 V to 3.6 V and across an industrial temperature range.

Key Features

• Logic Capacity  Approximately 2,880 logic elements and a typical system gate count up to 116,000 provide mid-range programmable logic density for control and glue-logic tasks.
• Embedded Memory  About 20,480 total RAM bits of embedded memory support on-chip buffering, small data tables, and state storage without consuming logic elements.
• I/O Density  274 user I/O pins offer flexible external connectivity for multi-interface designs and peripheral control.
• Voltage and Temperature  Operates from 3.0 V to 3.6 V and rated for industrial operation from −40 °C to 85 °C.
• Package and Mounting  356-ball LBGA package (356-BGA, 35×35) in a surface-mount form-factor for compact board integration.
• In-System Reconfigurability  Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port for iterative development and field updates.
• Boundary-Scan Test  Built-in JTAG boundary-scan test circuitry (IEEE 1149.1) enables board-level test without consuming device logic.
• I/O Flexibility  Per-pin features described for the FLEX 10K family include individual tri-state control, open-drain option, and programmable output slew-rate control to manage signal integrity and drive behavior.
• Clock and Interconnect  Family-level features include low-skew clock distribution, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and a continuous routing structure for predictable interconnect delays.
• Compliance and Mounting  RoHS compliant and supplied in a surface-mount BGA package suited for modern PCB assembly processes.

Typical Applications

• Embedded Control  Use as the programmable logic engine for embedded controllers requiring moderate logic density and on-chip RAM for state machines and buffering.
• Industrial Automation  Industrial-grade temperature range and robust I/O count make it suitable for sensor interfacing, motor-control glue logic, and industrial communication endpoints.
• Communications & I/O Bridging  High I/O capacity supports protocol bridging, custom interface logic, and peripheral aggregation in communications equipment.
• Prototyping and SOPC Integration  Embedded array and logic resources support system-on-a-programmable-chip architectures for rapid prototyping and integration of specialized functions.

Unique Advantages

• Balanced Logic and Memory:  2,880 logic elements combined with 20,480 bits of embedded RAM let you implement mixed logic and data-handling functions on a single device.
• High I/O Count:  274 user I/O pins reduce the need for external IO expanders and simplify board-level connectivity for multi-interface designs.
• Industrial Readiness:  Rated from −40 °C to 85 °C and packaged in a 356-LBGA, the device meets the thermal and mounting demands of industrial applications.
• Field Reconfigurability:  In-circuit reconfiguration and JTAG boundary-scan support enable flexible updates, debug, and production test strategies.
• Signal Integrity Controls:  Per-pin slew-rate control, tri-state enable, and open-drain options help manage switching noise and interface requirements without extra components.
• Compact, Surface-Mount Package:  The 356-ball BGA (35×35) package delivers a compact footprint for dense PCB layouts while providing ample I/O.

Why Choose EPF10K50VBI356-3N?

The EPF10K50VBI356-3N delivers a practical combination of programmable logic, embedded memory, and extensive I/O in a compact 356-LBGA package. Its FLEX 10K family capabilities—including in-system reconfigurability and built-in JTAG—support development cycles that require iterative updates, debug, and board-level test.

This device is suited for engineers building embedded systems and industrial equipment that demand moderate logic density, on-chip RAM, and a large number of external interfaces while operating across industrial temperature ranges. Its Intel FLEX 10K heritage provides a predictable feature set for mid-range programmable logic designs.

If you would like pricing, availability, or to request a quote for EPF10K50VBI356-3N, submit an RFQ or request a quote through your usual procurement channel and include the full part number.