EPF10K50STC144-3
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP |
|---|---|
| Quantity | 539 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50STC144-3 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP
The EPF10K50STC144-3 is a FLEX 10K family field programmable gate array (FPGA) optimized for commercial embedded logic applications. It combines an embedded array architecture with a separate logic array to deliver on-chip memory and programmable logic resources for system-on-a-programmable-chip (SOPC) designs.
Targeted at embedded systems, communications and consumer electronics, the device provides a balance of logic capacity, on-chip RAM and flexible I/O in a compact 144-pin surface-mount package.
Key Features
- Programmable logic core — 2,880 logic elements provide the configurable fabric for implementing custom logic and state machines.
- On-chip memory — Total RAM bits: 40,960 available for embedded data storage and buffering.
- I/O resources — 102 user I/O pins to interface with peripherals, sensors and external devices.
- Gate capacity — 199,000 gates to support complex designs combining logic and memory.
- Power and supply — Operates from a supply range of 2.375 V to 2.625 V, suitable for designs with defined voltage rails.
- Package and mounting — Supplied in a 144-LQFP package (supplier package: 144-TQFP 20×20); surface-mount for PCB assembly.
- Commercial temperature grade — Rated for operation from 0 °C to 70 °C for standard commercial applications.
- Manufacturing and compliance — RoHS compliant and provided in a fully test-qualified device family.
- Series-level system features — Series documentation highlights in-circuit reconfigurability, built-in JTAG boundary-scan, FastTrack interconnect for predictable routing, and dedicated carry/cascade chains for arithmetic and high fan-in logic.
- Clock and I/O flexibility — Series options include ClockLock and ClockBoost for clock management, low-skew clock distribution, programmable I/O slew-rate control, tri-state and open-drain options to adapt signal behavior.
Typical Applications
- Embedded controllers — Implement custom control logic, state machines and peripheral glue logic using the device’s logic elements and on-chip RAM.
- Communications and networking — Use the available logic fabric and RAM for packet buffering, protocol handling and interface bridging.
- Consumer electronics — Drive display controllers, user interface logic and device orchestration where compact package and flexible I/O are required.
- Prototyping and development — Rapidly iterate hardware designs with reconfigurable logic and JTAG boundary-scan support for debug.
Unique Advantages
- Balanced integration: Combines 2,880 logic elements with 40,960 bits of on-chip RAM to consolidate logic and memory functions on a single device, reducing external components.
- Flexible I/O and signaling: 102 user I/Os with programmable slew-rate, tri-state and open-drain options simplify interfacing to a variety of peripherals.
- Configurable system features: In-circuit reconfigurability and JTAG boundary-scan provide deployment flexibility and streamlined debug and programming workflows.
- Clock and arithmetic support: Dedicated carry and cascade chains plus low-skew clock trees enable efficient implementation of high-speed arithmetic and synchronized logic.
- Commercial-grade reliability: Designed for standard commercial temperature ranges (0 °C to 70 °C) and supplied RoHS compliant for contemporary manufacturing.
Why Choose EPF10K50STC144-3?
The EPF10K50STC144-3 delivers a practical mix of configurable logic, embedded memory and flexible I/O in a compact 144-pin surface-mount package for commercial embedded designs. Its series-level capabilities—such as in-circuit reconfigurability, JTAG support, predictable interconnect and dedicated arithmetic chains—make it suitable for teams seeking a programmable building block that reduces external component count while maintaining clear deployment and debug paths.
This device is well suited to engineers and procurement teams designing cost-sensitive embedded systems, communications modules and consumer electronics where a proven programmable fabric and on-chip RAM provide long-term design flexibility and scalability.
Request a quote or submit a request for pricing and availability to start integrating EPF10K50STC144-3 into your next design.

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