EPF10K50STC144-3

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 539 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50STC144-3 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

The EPF10K50STC144-3 is a FLEX 10K family field programmable gate array (FPGA) optimized for commercial embedded logic applications. It combines an embedded array architecture with a separate logic array to deliver on-chip memory and programmable logic resources for system-on-a-programmable-chip (SOPC) designs.

Targeted at embedded systems, communications and consumer electronics, the device provides a balance of logic capacity, on-chip RAM and flexible I/O in a compact 144-pin surface-mount package.

Key Features

  • Programmable logic core — 2,880 logic elements provide the configurable fabric for implementing custom logic and state machines.
  • On-chip memory — Total RAM bits: 40,960 available for embedded data storage and buffering.
  • I/O resources — 102 user I/O pins to interface with peripherals, sensors and external devices.
  • Gate capacity — 199,000 gates to support complex designs combining logic and memory.
  • Power and supply — Operates from a supply range of 2.375 V to 2.625 V, suitable for designs with defined voltage rails.
  • Package and mounting — Supplied in a 144-LQFP package (supplier package: 144-TQFP 20×20); surface-mount for PCB assembly.
  • Commercial temperature grade — Rated for operation from 0 °C to 70 °C for standard commercial applications.
  • Manufacturing and compliance — RoHS compliant and provided in a fully test-qualified device family.
  • Series-level system features — Series documentation highlights in-circuit reconfigurability, built-in JTAG boundary-scan, FastTrack interconnect for predictable routing, and dedicated carry/cascade chains for arithmetic and high fan-in logic.
  • Clock and I/O flexibility — Series options include ClockLock and ClockBoost for clock management, low-skew clock distribution, programmable I/O slew-rate control, tri-state and open-drain options to adapt signal behavior.

Typical Applications

  • Embedded controllers — Implement custom control logic, state machines and peripheral glue logic using the device’s logic elements and on-chip RAM.
  • Communications and networking — Use the available logic fabric and RAM for packet buffering, protocol handling and interface bridging.
  • Consumer electronics — Drive display controllers, user interface logic and device orchestration where compact package and flexible I/O are required.
  • Prototyping and development — Rapidly iterate hardware designs with reconfigurable logic and JTAG boundary-scan support for debug.

Unique Advantages

  • Balanced integration: Combines 2,880 logic elements with 40,960 bits of on-chip RAM to consolidate logic and memory functions on a single device, reducing external components.
  • Flexible I/O and signaling: 102 user I/Os with programmable slew-rate, tri-state and open-drain options simplify interfacing to a variety of peripherals.
  • Configurable system features: In-circuit reconfigurability and JTAG boundary-scan provide deployment flexibility and streamlined debug and programming workflows.
  • Clock and arithmetic support: Dedicated carry and cascade chains plus low-skew clock trees enable efficient implementation of high-speed arithmetic and synchronized logic.
  • Commercial-grade reliability: Designed for standard commercial temperature ranges (0 °C to 70 °C) and supplied RoHS compliant for contemporary manufacturing.

Why Choose EPF10K50STC144-3?

The EPF10K50STC144-3 delivers a practical mix of configurable logic, embedded memory and flexible I/O in a compact 144-pin surface-mount package for commercial embedded designs. Its series-level capabilities—such as in-circuit reconfigurability, JTAG support, predictable interconnect and dedicated arithmetic chains—make it suitable for teams seeking a programmable building block that reduces external component count while maintaining clear deployment and debug paths.

This device is well suited to engineers and procurement teams designing cost-sensitive embedded systems, communications modules and consumer electronics where a proven programmable fabric and on-chip RAM provide long-term design flexibility and scalability.

Request a quote or submit a request for pricing and availability to start integrating EPF10K50STC144-3 into your next design.

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