EPF10K50STC144-2

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 985 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50STC144-2 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

The EPF10K50STC144-2 is a FLEX 10K family field programmable gate array (FPGA) packaged in a 144-pin LQFP surface-mount case. It delivers a balance of programmable logic capacity, on-chip memory, and I/O resources for commercial embedded designs that require in-system configurability and custom logic integration.

Built on the FLEX 10K embedded programmable logic device architecture, the device targets system-level integration tasks such as embedded memory functions and specialized logic megafunctions, while offering configurability and system-level features drawn from the FLEX 10K family.

Key Features

  • Logic Capacity — Provides 2,880 logic elements supporting approximately 199,000 gates, enabling mid-density custom logic implementations.
  • Embedded Memory — Includes 40,960 bits of on-chip RAM for local buffering, ROM emulation, or small data structures required by embedded functions.
  • I/O Resources — 102 user I/O pins for interfacing with peripherals, sensors, and supporting board-level connectivity in commercial systems.
  • Programmability & Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; boundary-scan (JTAG) support is provided at the family level for device test and configuration.
  • Clocking & Interconnect — FLEX 10K family features such as low-skew clock distribution and dedicated carry/cascade chains are part of the family architecture to support fast arithmetic and high-fan-in logic structures.
  • Power & Supply — Operates from a specified supply range of 2.375 V to 2.625 V and is supplied in a surface-mount package for typical commercial board assemblies.
  • Package & Thermal — Available in a 144-LQFP (supplier listing: 144-TQFP 20×20) surface-mount package; rated for commercial operating temperatures from 0 °C to 70 °C.
  • Compliance — RoHS compliant, meeting common lead-free environmental requirements for commercial electronic assemblies.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) integration — Use the device to integrate specialized logic blocks and embedded memory for compact, reconfigurable system designs.
  • Embedded control and glue logic — Implement protocol bridges, state machines, and custom control logic where moderate logic density and reconfigurability are required.
  • Memory-centric embedded functions — Leverage the 40,960 bits of on-chip RAM for buffering, small lookup tables, or memory-backed megafunctions in embedded applications.
  • Commercial electronics — Suited for commercial-grade products and prototypes that operate within the specified 0 °C to 70 °C temperature range and defined supply voltage window.

Unique Advantages

  • Mid-range logic density: 2,880 logic elements and ~199,000 gates provide a practical balance of capacity and cost for many embedded designs.
  • Integrated on-chip memory: 40,960 bits of RAM reduce external memory needs for small buffers and state storage, simplifying board-level design.
  • Ample I/O count: 102 user I/O pins allow flexible interfacing to peripherals and system buses without immediate need for external I/O expanders.
  • Family-level system features: FLEX 10K family capabilities—such as JTAG configuration/test support, low-skew clocking, and dedicated arithmetic chains—help accelerate implementation of common digital functions.
  • Commercial-ready packaging: 144-LQFP surface-mount package and RoHS compliance ease integration into standard commercial product assemblies.

Why Choose EPF10K50STC144-2?

The EPF10K50STC144-2 combines mid-range programmable logic capacity, on-chip RAM, and a substantial I/O complement in a compact 144-LQFP surface-mount package, making it well suited for commercial embedded projects that need in-field configurability and compact system integration. Its inclusion in the FLEX 10K family provides access to family-level features such as in-system reconfiguration and industry-standard JTAG support for test and programming.

This device is appropriate for engineers and teams building commercial-grade embedded systems that require moderate logic density, local memory resources, and flexible I/O. The combination of programmable resources and family-level design support helps simplify prototyping and short-run production where reconfigurability and compact integration are priorities.

Request a quote or submit a sales inquiry to check availability and pricing for EPF10K50STC144-2 for your next design.

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