EPF10K50SQC240-2N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

Quantity 531 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O189Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SQC240-2N – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

The EPF10K50SQC240-2N is a FLEX-10KS family field programmable gate array from Intel designed for embedded programmable-logic applications. It combines a logic array with embedded memory resources and system-level features intended for System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as efficient memory and specialized logic.

With 2,880 logic elements, 40,960 bits of embedded RAM, and 189 I/O pins in a 240-BFQFP package, this commercial-grade FPGA targets designs that require on-chip memory, flexible I/O and in-circuit reconfigurability within a 0 °C to 70 °C operating range.

Key Features

  • Core Capacity — 2,880 logic elements and approximately 199,000 system gates provide the programmable logic resources for custom digital functions and control logic.
  • Embedded Memory — Approximately 40,960 bits of on-chip RAM support storage-intensive functions and megafunction implementation without reducing logic capacity.
  • I/O and Interfacing — 189 user I/O pins provide broad external connectivity suitable for parallel buses, control signals, and peripheral interfaces.
  • Reconfiguration & Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan test circuitry complies with IEEE Std. 1149.1.
  • Dedicated Routing & Arithmetic Support — Dedicated carry and cascade chains and a flexible continuous routing structure support high-speed arithmetic and high-fan-in logic implementations.
  • Clocking — Up to six global clock signals and four global clear signals, plus low-skew clock distribution, facilitate reliable synchronous design and multi-clock domains.
  • Power and Supply — Specified supply voltage range: 2.375 V to 2.625 V; designed for surface-mount PCB assembly.
  • Package & Temperature — Supplied in a 240-BFQFP (240-PQFP 32×32) package; commercial operating temperature range 0 °C to 70 °C.
  • Standards & Support — Family-level features include software design support and automatic place-and-route tools for development-system integration.
  • Compliance — RoHS status: Compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate control logic, memory and peripheral interfaces on a single device to consolidate board-level components and simplify system architecture.
  • Embedded Memory Functions — Use embedded RAM to implement FIFOs, small buffers, and lookup tables for data-paths and protocol handling without external memory.
  • PCI and Peripheral Interfaces — Implement custom peripheral logic and bus-interface glue with abundant I/O and on-chip resources for PCI or local-bus style applications referenced in family documentation.
  • Prototyping and Custom Logic — Rapidly iterate custom digital designs and megafunctions using in-circuit reconfigurability and JTAG-based programming.

Unique Advantages

  • Highly Integrated Logic and Memory: 2,880 logic elements paired with approximately 40,960 bits of embedded RAM reduce external component count and support compact, efficient designs.
  • Flexible I/O Count: 189 user I/O pins enable broad interfacing options for mixed-signal front-ends, parallel buses or multiple peripherals.
  • On-Board Reconfiguration and Test: JTAG boundary-scan and multiple configuration options simplify programming, debug and in-system updates.
  • Dedicated Arithmetic & Routing Resources: Carry and cascade chains plus a continuous routing structure support efficient implementation of adders, counters and high-fan-in logic.
  • Commercial Temperature and RoHS Compliance: Designed for commercial-temperature deployments (0 °C to 70 °C) with RoHS-compliant materials.
  • Package Density: 240-BFQFP packaging provides a balance of pin count and board-level footprint for medium-density FPGA deployments.

Why Choose EPF10K50SQC240-2N?

The EPF10K50SQC240-2N delivers a balanced combination of logic elements, embedded RAM, and I/O density in a commercial-grade FLEX-10KS FPGA package. Its on-chip memory and dedicated routing features enable designers to consolidate functions that would otherwise require multiple components, while JTAG and in-circuit reconfiguration support streamline development and field updates.

This device is well suited for embedded system designers and teams implementing SOPC, memory-centric logic, or custom bus interfaces who need a medium-density, RoHS-compliant FPGA option with clear electrical and thermal limits for commercial applications.

If you would like pricing, availability, or a formal quote for EPF10K50SQC240-2N, submit an inquiry to request a quote or further technical information.

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