EPF10K50SQC208-3

The EPF10K50SQC208-3 is a FLEX 10K series FPGA offering programmable logic and embedded memory in a 208-BFQFP surface-mount package. As part of the FLEX 10K family, it combines a logic array and embedded array resources intended for system-level integration in commercial applications.

This device targets designs requiring moderate I/O count, on-chip RAM, and reconfigurable logic—delivering 2,880 logic elements, 40,960 bits of embedded RAM, and 147 user I/O pins in a 208-pin package.

Key Features

• Logic Capacity — 2,880 logic elements and 360 logic array blocks (LABs) provide programmable logic resources for control, glue logic, and mid-density custom functions.
• Embedded Memory — 40,960 bits of on-chip RAM (approximately 0.04 Mbits) suitable for embedded data buffers, small FIFOs, and parameter storage.
• I/O and I/O Count — 147 user I/O pins support a range of peripheral interfacing needs in a single-package solution.
• Package and Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB space-efficient assembly.
• Power and Supply — Operates from a 2.375 V to 2.625 V supply range as specified for the device.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 70 °C.
• Family-Level System Features — FLEX 10K family features include embedded arrays for megafunctions, in-circuit reconfigurability, built-in JTAG boundary-scan (IEEE 1149.1), low-skew clock distribution, and flexible interconnect structures.
• Regulatory — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement control logic, state machines, and peripheral interfacing where reconfigurable logic and on-chip RAM simplify board-level design.
• Consumer Electronics — Manage custom glue logic, user interfaces, and data buffering in compact, surface-mount designs.
• Communications and Networking — Support protocol handling, packet buffering, and I/O interfacing functions using the device's logic and embedded memory.
• Test and Measurement — Provide configurable processing blocks, timing control, and boundary-scan access for prototype systems and instrument front-ends.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 2,880 logic elements paired with 40,960 bits of on-chip RAM enable mixed logic and data-storage functions without external memory for many mid-density tasks.
• Integrated System-Level Features: Family-level capabilities such as in-circuit reconfigurability and JTAG boundary-scan simplify development, configuration, and test workflows.
• Compact, Surface-Mount Package: The 208-BFQFP/208-PQFP (28×28) footprint supports high-density PCB layouts while maintaining a high I/O count.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C operation to match typical commercial product requirements.
• RoHS Compliant: Supports lead-free manufacturing and regulatory requirements for many global markets.

Why Choose EPF10K50SQC208-3?

The EPF10K50SQC208-3 positions itself as a mid-density FLEX 10K FPGA option for designs that need a blend of reconfigurable logic, embedded RAM, and moderate I/O in a compact surface-mount package. Its combination of 2,880 logic elements, 40,960 bits of RAM, and family-level features such as JTAG and in-circuit reconfigurability make it suitable for commercial embedded systems, data buffering, and peripheral interfacing tasks.

For development teams and procurement teams seeking a commercially graded FPGA with clear, verifiable specifications for supply voltage, temperature range, package type, and RoHS compliance, this device offers a predictable, documented option within the FLEX 10K family.

If you would like pricing, availability, or a quote for EPF10K50SQC208-3, submit a request or inquiry and our team will respond with the details you need.