EPF10K50SQC208-2X

The EPF10K50SQC208-2X is a FLEX-10KS® field programmable gate array (FPGA) offered in a 208-pin BFQFP package. It combines 2,880 logic elements with approximately 40,960 bits of on-chip RAM and 147 user I/O pins to support a broad range of system integration and custom logic tasks in commercial-temperature applications.

Designed for embedded logic, memory megafunctions and system-level integration, this device targets applications that require reconfigurable logic, local embedded memory and flexible I/O in a surface-mount 28 × 28 PQFP footprint.

Key Features

• Core logic density — 2,880 logic elements and a stated gate count of 199,000 provide capacity for medium-complexity logic designs and glue‑logic consolidation.
• Embedded memory — Approximately 0.04 Mbits (40,960 bits) of total on-chip RAM suitable for local buffering, small FIFOs and megafunction implementations.
• I/O capability — 147 user I/O pins for interfacing with peripherals, sensors and bus-level signals in mixed-signal or digital systems.
• Configuration and test — In-circuit reconfigurability options and JTAG boundary-scan support as described for the FLEX 10K family enable board-level debug and device programming.
• Power supply — Device voltage supply specified at 2.375 V to 2.625 V to match system power rails documented for this part.
• Commercial temperature range — Rated for 0 °C to 70 °C operation, suitable for commercial electronics and consumer applications.
• Package and mounting — 208-BFQFP (208-PQFP, 28 × 28) surface-mount package for board-level integration where a low-profile PQFP is preferred.
• Series-level architecture — FLEX 10K family features such as embedded arrays for megafunctions, dedicated carry/cascade chains, and a flexible interconnect topology are available in the device family.

Typical Applications

• System integration and SOPC — Use the FPGA to implement system-on-a-programmable-chip functions and consolidate discrete logic and small memory blocks.
• Embedded control — Implement control logic, state machines and interface timing for appliances, instrumentation and consumer devices within the commercial temperature range.
• Interface bridging and protocol glue — Leverage the device’s logic and I/O count to translate, buffer or combine peripheral interfaces and custom buses.
• Prototyping and development — Medium-density reconfigurable logic for proof-of-concept designs, evaluation of custom logic functions and iterative firmware/hardware co-design.

Unique Advantages

• Balanced logic and memory — 2,880 logic elements paired with ~40,960 bits of embedded RAM enable compact implementations of control logic with local buffering.
• Generous I/O — 147 user I/Os allow flexible board-level interfacing without immediate need for external I/O expanders.
• Surface-mount PQFP footprint — The 208-pin BFQFP (28 × 28) package supports compact PCB layouts while maintaining accessible lead routing for prototyping and production boards.
• Commercial-grade suitability — Specified for 0 °C to 70 °C operation and commercial grade usage where that temperature range is required.
• Configurable and testable — Family features such as JTAG boundary-scan and in-circuit reconfigurability support board-level test, programming and iterative development.
• Supported design flow — The FLEX 10K family includes vendor-provided design tools and automatic place-and-route support as part of the documented series capabilities.

Why Choose EPF10K50SQC208-2X?

The EPF10K50SQC208-2X provides a practical balance of logic capacity, embedded memory and I/O in a commercial-grade, surface-mount PQFP package. Its combination of 2,880 logic elements, approximately 40,960 bits of onboard RAM and 147 I/Os makes it well suited for medium-complexity embedded systems, interface bridging and SOPC-style integration where board space and reconfigurability are important.

Backed by FLEX 10K family architecture and associated design tool support, this device is appropriate for engineers and procurement teams seeking a reconfigurable solution that maps to existing development flows and standard commercial-temperature applications.

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