EPF10K50SFC484-3
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA |
|---|---|
| Quantity | 677 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 220 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50SFC484-3 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA
The EPF10K50SFC484-3 is a FLEX 10K series field programmable gate array (FPGA) offering embedded programmable logic and on-chip memory for system-level integration. Designed for commercial applications, it provides a balance of logic capacity, embedded RAM and I/O density for custom digital functions and megafunction integration.
As a member of the FLEX 10K family, this device targets designs that require reconfigurable logic, embedded memory blocks and a substantial number of user I/O pins, enabling tasks such as custom control logic, data buffering and system interfacing within a single programmable device.
Key Features
- Logic Capacity Approximately 199,000 gates with 2,880 logic elements and 360 logic array blocks, providing capacity for medium-density programmable logic designs.
- Embedded Memory 40,960 bits of on-chip RAM suitable for implementing embedded memories and megafunctions without reducing logic capacity.
- I/O Density Up to 220 user I/O pins to support multiple external interfaces and peripheral connections.
- Configuration & Test Family-level support for in-circuit reconfigurability and built-in JTAG boundary-scan (IEEE 1149.1) for programming and board-level testability.
- Clocking and Interconnect FLEX 10K family features include low-skew clock distribution, dedicated carry and cascade chains, and a continuous routing structure for predictable interconnect delays.
- Power Supply Specified supply range: 2.375 V to 2.625 V for core operation as listed in the product data.
- Package 484-ball BGA package (484-BBGA / supplier package 484-FBGA, 23×23) for compact board footprint and high pin count routing.
- Operating Range Commercial-grade operating temperature from 0 °C to 70 °C.
- Compliance RoHS compliant.
Typical Applications
- System Integration System-on-a-programmable-chip implementations where embedded memory and reconfigurable logic are used to combine multiple functions into one device.
- Custom Control and Glue Logic Intermediate-complexity digital control, state machines and glue logic between processors, peripherals and sensors.
- Memory-Mapped Functions On-chip RAM supports buffering, small data tables and other memory-backed megafunctions within the FPGA fabric.
- High-Pin-Count Interfaces Designs requiring a large number of user I/O signals and flexible pin control for interfacing to multiple external devices.
Unique Advantages
- Balanced Logic and Memory: Combines 2,880 logic elements with 40,960 bits of embedded RAM to implement both stateful logic and memory-heavy functions on the same device.
- High I/O Count: 220 user I/O pins provide flexibility for multiple external interfaces without additional bridging components.
- Reconfigurability and Testability: Supports in-circuit reconfigurability and includes JTAG boundary-scan for simplified programming and board-level diagnostics.
- Predictable Performance: Family-level architectural features such as dedicated carry/cascade chains and low-skew clock distribution help achieve consistent timing for arithmetic and high-fan-in logic functions.
- Compact Packaging: 484-ball BGA (23×23) package enables a dense, compact board layout while maintaining high pin count.
- Standards-Based Design Flow: Part of the FLEX 10K family and supported by documented family features for megafunctions, interconnect and clocking.
Why Choose EPF10K50SFC484-3?
EPF10K50SFC484-3 is positioned for commercial designs that need a middle-ground FPGA with a mix of logic, embedded RAM and plenty of I/O in a compact BGA package. Its FLEX 10K family capabilities—embedded arrays for megafunctions, dedicated arithmetic chains and JTAG support—make it suitable for designs needing on-device memory and reprogrammable logic without adding external components.
This device is well suited to teams building system integration, custom control, or interface-rich applications that benefit from a reconfigurable platform supported by the FLEX 10K family architecture and documented device-level specifications.
If you would like pricing, availability or to request a quote for EPF10K50SFC484-3, please submit a quote request or RFQ referencing the full part number.

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