EPF10K50SFC484-3

IC FPGA 220 I/O 484FBGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA

Quantity 677 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O220Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SFC484-3 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA

The EPF10K50SFC484-3 is a FLEX 10K series field programmable gate array (FPGA) offering embedded programmable logic and on-chip memory for system-level integration. Designed for commercial applications, it provides a balance of logic capacity, embedded RAM and I/O density for custom digital functions and megafunction integration.

As a member of the FLEX 10K family, this device targets designs that require reconfigurable logic, embedded memory blocks and a substantial number of user I/O pins, enabling tasks such as custom control logic, data buffering and system interfacing within a single programmable device.

Key Features

  • Logic Capacity  Approximately 199,000 gates with 2,880 logic elements and 360 logic array blocks, providing capacity for medium-density programmable logic designs.
  • Embedded Memory  40,960 bits of on-chip RAM suitable for implementing embedded memories and megafunctions without reducing logic capacity.
  • I/O Density  Up to 220 user I/O pins to support multiple external interfaces and peripheral connections.
  • Configuration & Test  Family-level support for in-circuit reconfigurability and built-in JTAG boundary-scan (IEEE 1149.1) for programming and board-level testability.
  • Clocking and Interconnect  FLEX 10K family features include low-skew clock distribution, dedicated carry and cascade chains, and a continuous routing structure for predictable interconnect delays.
  • Power Supply  Specified supply range: 2.375 V to 2.625 V for core operation as listed in the product data.
  • Package  484-ball BGA package (484-BBGA / supplier package 484-FBGA, 23×23) for compact board footprint and high pin count routing.
  • Operating Range  Commercial-grade operating temperature from 0 °C to 70 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • System Integration  System-on-a-programmable-chip implementations where embedded memory and reconfigurable logic are used to combine multiple functions into one device.
  • Custom Control and Glue Logic  Intermediate-complexity digital control, state machines and glue logic between processors, peripherals and sensors.
  • Memory-Mapped Functions  On-chip RAM supports buffering, small data tables and other memory-backed megafunctions within the FPGA fabric.
  • High-Pin-Count Interfaces  Designs requiring a large number of user I/O signals and flexible pin control for interfacing to multiple external devices.

Unique Advantages

  • Balanced Logic and Memory:  Combines 2,880 logic elements with 40,960 bits of embedded RAM to implement both stateful logic and memory-heavy functions on the same device.
  • High I/O Count:  220 user I/O pins provide flexibility for multiple external interfaces without additional bridging components.
  • Reconfigurability and Testability:  Supports in-circuit reconfigurability and includes JTAG boundary-scan for simplified programming and board-level diagnostics.
  • Predictable Performance:  Family-level architectural features such as dedicated carry/cascade chains and low-skew clock distribution help achieve consistent timing for arithmetic and high-fan-in logic functions.
  • Compact Packaging:  484-ball BGA (23×23) package enables a dense, compact board layout while maintaining high pin count.
  • Standards-Based Design Flow:  Part of the FLEX 10K family and supported by documented family features for megafunctions, interconnect and clocking.

Why Choose EPF10K50SFC484-3?

EPF10K50SFC484-3 is positioned for commercial designs that need a middle-ground FPGA with a mix of logic, embedded RAM and plenty of I/O in a compact BGA package. Its FLEX 10K family capabilities—embedded arrays for megafunctions, dedicated arithmetic chains and JTAG support—make it suitable for designs needing on-device memory and reprogrammable logic without adding external components.

This device is well suited to teams building system integration, custom control, or interface-rich applications that benefit from a reconfigurable platform supported by the FLEX 10K family architecture and documented device-level specifications.

If you would like pricing, availability or to request a quote for EPF10K50SFC484-3, please submit a quote request or RFQ referencing the full part number.

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