EPF10K50SFC484-1N

The EPF10K50SFC484-1N is a member of the FLEX 10K embedded programmable logic device family. It combines a dedicated logic array and embedded memory resources to enable System-on-a-Programmable-Chip (SOPC) integration for compact, reconfigurable digital designs.

With 2,880 logic elements, 40,960 bits of embedded RAM, and 220 user I/O pins in a 484-BBGA surface-mount package, this device targets commercial applications requiring high-density logic, substantial on-chip memory, and flexible I/O in a space-efficient package.

Key Features

• Core / Logic – 2,880 logic elements providing the programmable logic resources needed for combinational and sequential functions; the device is specified with 199,000 gates.
• Embedded Memory – 40,960 total RAM bits of on-chip embedded memory suitable for local buffering, LUTs, and megafunctions.
• I/O & Interfaces – 220 user I/O pins to support wide-ranging peripheral and interface requirements in board-level designs.
• Power – Device supply range specified at 2.375 V to 2.625 V for the core supply.
• Package & Mounting – 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting type for compact PCB implementations.
• Temperature & Compliance – Commercial operating temperature range from 0 °C to 70 °C; RoHS compliant.
• FLEX 10K Family Capabilities – Family features include an embedded array for implementing megafunctions, in-circuit reconfigurability (ICR), JTAG boundary-scan (IEEE 1149.1), configurable clock resources including ClockLock and ClockBoost options, dedicated carry and cascade chains, and low-skew clock distribution trees.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) designs – Use the embedded array and logic array to consolidate functions that would otherwise require multiple components.
• Embedded memory-intensive logic – Local RAM (40,960 bits) supports buffering, small data stores, and megafunction implementations without external memory.
• High-density I/O bridging – 220 user I/O pins enable interface aggregation and protocol bridging on compact PCBs.
• Prototyping and mid-range digital systems – Reconfigurable logic and JTAG boundary-scan support iterative development and board-level testability.

Unique Advantages

• Balanced logic-to-memory ratio: 2,880 logic elements paired with 40,960 bits of embedded RAM lets designers implement logic and memory-intensive functions on a single device.
• High I/O count in a compact package: 220 user I/Os in a 484-BBGA footprint enable dense connectivity while conserving PCB area.
• Reconfigurability for design flexibility: In-circuit reconfigurability and JTAG boundary-scan simplify iterative development and enable field updates.
• Family-level system features: Dedicated carry and cascade chains, low-skew clock trees, and megafunction support accelerate arithmetic and high-fan-in implementations.
• Commercial-grade operating range and compliance: Commercial temperature range (0 °C to 70 °C) and RoHS compliance align with standard commercial product requirements.

Why Choose EPF10K50SFC484-1N?

The EPF10K50SFC484-1N is positioned for commercial applications that require a mid-density programmable logic device with significant embedded memory and extensive I/O in a space-conscious BGA package. Its combination of 2,880 logic elements, 40,960 bits of RAM, and family-level FPGA features supports compact SOPC implementations, interface aggregation, and iterative development workflows.

Design teams focused on reducing board-level component count, increasing integration, and maintaining flexibility in firmware and hardware updates will find this FLEX 10K device suitable for a range of commercial embedded systems. RoHS compliance and standard commercial thermal ratings support mainstream product manufacturing and deployment scenarios.

Request a quote or submit an inquiry today to evaluate how the EPF10K50SFC484-1N can fit into your next design.