EPF10K50SFC256-3

The EPF10K50SFC256-3 is a FLEX 10K family FPGA designed for embedded programmable logic applications. It combines a dedicated logic array with embedded memory resources to implement megafunctions, custom logic and system-level integration for commercial designs.

This surface-mount device provides 2.375 V to 2.625 V supply operation, 191 user I/O pins in a compact 256‑FBGA (17×17) package, and commercial operating range (0 °C to 70 °C), making it suitable for a wide range of embedded and board-level programmable logic tasks.

Key Features

• Core logic — 2,880 logic elements and 360 logic array blocks (LABs) for implementing custom combinational and sequential logic functions.
• On-chip memory — 40,960 bits of total embedded RAM to support buffering, lookup tables and small memory structures without external RAM.
• I/O capacity — 191 user I/O pins to interface with peripherals, sensors and parallel/serial buses in board-level systems.
• Logic density — Device-level gate count reported as 199,000 gates for system-level planning and partitioning.
• Package & mounting — 256‑FBGA (17×17) package in surface-mount format for high-density PCB implementations.
• Supply & temperature — Voltage supply range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 70 °C.
• Reconfiguration & test — Series-level support for in-circuit reconfigurability via external configuration device, intelligent controller or JTAG; built-in JTAG boundary-scan available.
• RoHS compliant — Device meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• SOPC and system integration — Implement system-on-a-programmable-chip functions that combine logic and embedded memory for control and glue logic.
• Interface bridging — Create protocol translators, bus interfaces and custom I/O handling using the device's 191 user I/Os and embedded logic.
• Embedded memory functions — Use the 40,960 bits of on-chip RAM for FIFOs, small buffers, lookup tables and state storage without external memory.
• Custom peripheral control — Implement motor control, sensor conditioning or user-interface logic where compact, reconfigurable logic is required.

Unique Advantages

• Balanced logic and memory — Combines 2,880 logic elements with 40,960 bits of embedded RAM to support mixed logic-and-memory designs on a single device.
• High I/O count in compact package — 191 user I/Os in a 256‑FBGA (17×17) package enables dense board routing and flexible peripheral connections.
• Reconfigurability and test support — Series-level in-circuit reconfigurability and built-in JTAG facilitate iterative development and boundary-scan testing.
• Clear supply requirements — Defined supply range (2.375 V–2.625 V) simplifies power-supply design and integration planning.
• Commercial-grade suitability — Specified commercial operating range (0 °C–70 °C) and RoHS compliance for mainstream embedded applications.

Why Choose EPF10K50SFC256-3?

The EPF10K50SFC256-3 offers a practical balance of logic capacity, embedded RAM and I/O density in a compact 256‑FBGA package, tailored for commercial embedded designs that require on-chip memory and flexible interfacing. Its series-level features for reconfigurability and JTAG-based boundary-scan help streamline development and production test workflows.

This device is well suited for engineers building board-level programmable logic solutions where modest logic density, significant on-chip RAM and a high I/O count in a surface-mount FBGA package are key selection criteria.

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