EPF10K50SFC256-1X

The EPF10K50SFC256-1X is a FLEX-10KS® family FPGA from Intel, delivered in a 256-ball fine-pitch BGA package for surface-mount applications. It provides a balance of logic density, embedded RAM, and I/O count suitable for embedded systems, control logic, and programmable glue-logic tasks.

Built for commercial-grade applications, this device combines programmable logic (2,880 logic elements across 360 LABs), substantial on-chip RAM, and a 191-pin I/O footprint to support system-level integration and flexible interfacing.

Key Features

• Logic Capacity — 2,880 logic elements organized across 360 LABs, enabling implementation of moderate-complexity digital functions and control logic.
• On-chip Memory — 40,960 total RAM bits of embedded memory for buffering, state storage, and memory-based functions within your logic design.
• I/O Count — 191 user I/O pins to support a wide range of peripheral and bus connections in embedded designs.
• Package & Mounting — 256-BGA (256-FBGA, 17 × 17) fine-pitch BGA package; surface-mount for compact PCB layouts and automated assembly.
• Power Supply — Core/primary supply range specified at 2.375 V to 2.625 V to match system power rails.
• Operating Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C for standard electronics environments.
• Compliance — RoHS compliant for global electronics manufacturing requirements.
• Family Capabilities — As part of the FLEX 10K family, the device benefits from family-level features such as embedded programmable logic architecture and system-on-a-programmable-chip integration noted for FLEX 10K devices.

Typical Applications

• Embedded Control — Implement finite-state machines, peripheral sequencers, and custom control logic with available logic elements and on-chip RAM.
• Interface Bridging — Use the 191 I/O pins to connect and adapt between multiple digital buses and peripheral interfaces on compact PCBs.
• Prototype and Development — Leverage the FLEX 10K family architecture for rapid prototyping of system logic and iterative hardware/software co-design.
• Signal Conditioning and Glue Logic — Integrate custom combinatorial and sequential logic to consolidate discrete components and reduce BOM count.

Unique Advantages

• Balanced Logic and Memory: 2,880 logic elements paired with 40,960 RAM bits provide a useful mix of compute and storage for mid-range designs.
• High I/O Density: 191 user I/Os enable flexible board-level interfacing without immediate need for external I/O expanders.
• Compact, Production-Ready Package: 256-FBGA (17 × 17) allows high-density placement and is compatible with surface-mount assembly workflows.
• Commercial Availability: Commercial grade (0 °C to 70 °C) supports mainstream consumer and industrial-product development cycles.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for modern electronics supply chains.
• Family Ecosystem: Being part of the FLEX 10K family provides access to documented family-level features and design methodologies that aid system integration.

Why Choose EPF10K50SFC256-1X?

The EPF10K50SFC256-1X targets designers who need a mid-density, commercial-grade FPGA with a strong balance between logic, embedded RAM, and I/O. Its 256-BGA package and surface-mount form factor make it suitable for space-constrained PCBs where consolidating logic and interfaces reduces BOM complexity.

This device suits engineering teams developing embedded control, interface bridging, and prototype systems that benefit from the FLEX 10K family architecture and documented family capabilities. Its combination of logic elements, RAM, and I/O delivers flexibility for evolving designs while remaining aligned with standard commercial production environments.

If you would like pricing or availability, request a quote or submit a procurement inquiry for EPF10K50SFC256-1X and include your required quantities and delivery timeframe.