EPF10K50SFC256-1

The EPF10K50SFC256-1 is a FLEX-10KS® field programmable gate array supplied in a 256-BGA (256-FBGA, 17×17) surface-mount package for commercial applications. It combines a dense logic array, a significant embedded RAM resource, and flexible I/O to support custom logic, peripheral interfacing, and system-level integration.

Designed for designers needing on-chip memory and programmable logic in a compact package, this device targets embedded control, communications, and general-purpose FPGA tasks while providing RoHS compliance and commercial-grade operating characteristics.

Key Features

• Logic Capacity — 2,880 logic elements and approximately 199,000 gates enable implementation of medium-complexity logic functions and custom peripheral logic.
• Logic Array Blocks (LABs) — 360 LABs provide a structured fabric for mapping combinatorial and sequential logic.
• Embedded RAM — Approximately 40,960 bits of on-chip RAM for buffers, FIFOs, and small data storage requirements.
• I/O Density — 191 user I/O pins to support multiple external interfaces and board-level connectivity.
• Package & Mounting — 256-BGA (256-FBGA, 17×17) surface-mount package for compact board integration and high pin density.
• Supply & Temperature — Operates from 2.375 V to 2.625 V with a commercial operating range of 0 °C to 70 °C.
• Programmability & Test — Family-level features include in-circuit reconfigurability and built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990 for device programming and board-level test.
• RoHS Compliance — Device is RoHS-compliant for environmental and regulatory requirements.

Typical Applications

• Embedded Control — Implement custom control logic, glue logic, and protocol handling in compact embedded systems.
• Communications Equipment — Use the device for interface bridging, packet buffering, and protocol adaptation requiring flexible I/O and on-chip memory.
• Test & Measurement — Create configurable signal processing blocks, timing controllers, and data capture logic for bench and production-test equipment.
• Consumer & Commercial Electronics — Integrate peripheral controllers, display/interface logic, and custom feature sets in space-constrained product boards.

Unique Advantages

• Balanced Logic and Memory — Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM to implement both control and data-path functions on a single device.
• High I/O Count in a Compact Package — 191 I/O pins in a 256-FBGA (17×17) package enable dense external connectivity while preserving board real estate.
• Commercial-Grade Reliability — Designed for commercial temperature operation (0 °C to 70 °C) and supplied in a standard surface-mount package for mainstream product deployment.
• Testability and In-System Reconfigurability — Built-in JTAG boundary-scan and support for in-circuit reconfiguration simplify development, programming, and board-level testing.
• Regulatory Compliance — RoHS-compliant construction supports environmental and regulatory requirements for many commercial products.

Why Choose EPF10K50SFC256-1?

The EPF10K50SFC256-1 offers a pragmatic combination of logic density, embedded memory, and flexible I/O in a compact 256-BGA package suited to commercial embedded designs. Its array of LABs and substantial logic element count make it a good fit for projects that require integrated programmable logic alongside on-chip RAM without moving to larger, more costly devices.

This device is appropriate for design teams building communication interfaces, custom peripheral controllers, and embedded control systems who value a balance of integration, testability, and RoHS-compliant supply chain compatibility.

Request a quote or contact our sales team to check availability, pricing, and lead times for the EPF10K50SFC256-1.