EPF10K50RI240-4N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,906 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50RI240-4N – FLEX-10K Field Programmable Gate Array (FPGA), 2,880 Logic Elements, 20,480-bit RAM, 189 I/O
The EPF10K50RI240-4N is an Intel FLEX-10K family field programmable gate array supplied in a 240-pin BFQFP package with exposed pad. It provides a mid-range programmable logic solution combining 2,880 logic elements, embedded memory, and substantial I/O density for industrial embedded designs.
Ideal for industrial control and embedded processing tasks, this device delivers reconfigurable logic, on-chip RAM, and a robust I/O complement while supporting a 4.5 V to 5.5 V supply and industrial temperature operation from −40 °C to 85 °C.
Key Features
- Logic Capacity 2,880 logic elements and 360 logic-array blocks provide a flexible fabric for implementing custom logic and state machines.
- On-chip Memory Approximately 20,480 bits of embedded RAM organized across embedded array blocks (EABs) to support FIFOs, small buffers, and lookup tables.
- Gate Density Up to 116,000 maximum system gates, enabling complex logic integration within a single device.
- I/O Density 189 user I/O pins to interface with sensors, actuators, memory, and peripheral devices.
- Power and Temperature Designed for a 4.5 V to 5.5 V supply range and rated for industrial operation from −40 °C to 85 °C.
- Package and Mounting Surface-mount 240-BFQFP with exposed pad (supplier package 240-RQFP, 32 × 32) for thermal performance and board-level mounting.
- Reconfiguration and Test Supports in-circuit reconfigurability and includes JTAG boundary-scan test capability as part of the FLEX 10K family features for configuration and test access.
- Architecture-Level Features Family-level capabilities include dedicated carry and cascade chains, low-skew clock distribution, and advanced interconnect structures to simplify implementation of arithmetic, wide logic, and high-speed signals.
- RoHS Compliant Device is RoHS compliant for regulated environmental requirements.
Typical Applications
- Industrial Control Implement motor control logic, process sequencing, and I/O aggregation where industrial temperature range and robust I/O count are required.
- Embedded Systems Integrate glue logic, protocol bridging, and small on-chip buffers for embedded controllers and custom processing blocks.
- Communication Interface Realize parallel and serial interface logic, timing-critical glue, and protocol handling using the device’s I/O resources and dedicated arithmetic chains.
- Machine and Instrumentation Use for sensor interfacing, data conditioning, and local decision logic that benefit from reconfigurable hardware and on-chip RAM.
Unique Advantages
- Reconfigurable integration: In-circuit reconfigurability lets you update logic in-system to iterate designs or add features without board changes.
- Balanced resources: Combination of 2,880 logic elements and ~20,480 bits of embedded RAM supports both control logic and data buffering in one device.
- High I/O count: 189 user I/O pins simplify direct interfacing to a wide range of peripherals and external devices, reducing the need for external multiplexers or expanders.
- Industrial readiness: Rated for −40 °C to 85 °C and supplied in a thermally enhanced BFQFP exposed-pad package suitable for industrial applications.
- Proven family capabilities: FLEX 10K family features such as dedicated carry/cascade chains and low-skew clock distribution help accelerate implementation of arithmetic and timing-sensitive designs.
- Standards-driven testability: JTAG boundary-scan support eases board-level test and diagnostics during manufacturing and service.
Why Choose EPF10K50RI240-4N?
The EPF10K50RI240-4N positions itself as a durable, reconfigurable solution for industrial and embedded designs that need balanced logic capacity, embedded RAM, and substantial I/O in a single programmable device. Its combination of 2,880 logic elements, approximately 20,480 bits of on-chip RAM, and family-level architecture features provide designers with the flexibility to consolidate logic, reduce external components, and adapt functionality in the field.
This part is suited for engineers and procurement teams building industrial controllers, interface modules, and embedded systems that require mid-range programmable logic with industrial temperature range and a robust package option.
Request a quote or submit a procurement inquiry today to evaluate the EPF10K50RI240-4N for your next design.

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