EPF10K40RC208-4
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 16384 2304 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 122 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-RQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 147 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 288 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 93000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16384 |
Overview of EPF10K40RC208-4 – FLEX-10K Field Programmable Gate Array (FPGA) IC — 147 I/O, 16,384 RAM bits, 2,304 logic elements, 208-BFQFP Exposed Pad
The EPF10K40RC208-4 is a FLEX 10K family field programmable gate array (FPGA) from Intel, delivered in a 208-BFQFP exposed pad surface-mount package. It provides a mid-density programmable logic fabric with embedded memory and a substantial I/O complement for commercial embedded designs.
Designed for system-level integration, the device targets commercial embedded systems, communications modules, instrumentation, and consumer electronics that require configurable logic, integrated RAM, and flexible interfacing at a 5.0 V supply level.
Key Features
- Logic Capacity — 2,304 logic elements (LEs) and approximately 93,000 gates enable implementation of medium-complexity digital functions and state machines.
- Embedded Memory — 16,384 total RAM bits of on-chip embedded memory to support buffers, FIFOs, and small data structures without external SRAM.
- I/O and Connectivity — 147 user I/O pins provide broad interfacing options for sensors, peripherals, buses, and external devices.
- Package and Mounting — 208-BFQFP exposed pad (supplier package 208-RQFP, 28×28) in a surface-mount format to support thermal management and PCB assembly requirements.
- Supply and Temperature — Operates from 4.75 V to 5.25 V with an operating temperature range of 0 °C to 70 °C, appropriate for commercial-grade applications.
- Reconfiguration and Test — Supports in-circuit reconfigurability via external configuration devices, intelligent controllers, or JTAG; includes built-in IEEE 1149.1 JTAG boundary-scan test circuitry without consuming device logic.
- Routing and Arithmetic Support — Family features include a FastTrack interconnect structure and dedicated carry/cascade chains for efficient arithmetic and high-fan-in logic implementations.
- RoHS Compliance — Device is RoHS compliant, supporting environmental compliance requirements for commercial products.
Typical Applications
- Commercial Embedded Systems — Implement control logic, custom peripherals, and protocol bridges in consumer and commercial products using the device’s logic and on-chip RAM.
- Interface and I/O Bridging — Use the 147 user I/O pins to connect multiple peripherals, translate between bus standards, or concentrate signals for system controllers.
- Prototyping and Custom Logic — Rapidly iterate custom logic designs and finite-state machines with in-circuit reconfigurability and JTAG for development and test.
- Communications and Instrumentation — Implement data buffering, simple packet processing, or glue logic using embedded RAM and dedicated carry chains for arithmetic functions.
Unique Advantages
- Highly Integrated Logic and Memory: 2,304 logic elements combined with 16,384 bits of embedded RAM reduce the need for external components and simplify board-level designs.
- Broad I/O Count: 147 user I/Os provide flexibility to interface with multiple peripherals and subsystems without multiplexing compromises.
- 5 V System Compatibility: Designed for a 4.75 V to 5.25 V supply range, allowing straightforward integration into established 5 V commercial platforms.
- Design-for-Test and Reconfiguration: Built-in IEEE 1149.1 JTAG boundary-scan and support for in-circuit reconfiguration streamline board bring-up, programming, and field updates.
- Thermal and Assembly-Friendly Package: The 208-BFQFP exposed pad package supports surface-mount assembly and board-level thermal management for sustained operation in commercial environments.
- Vendor Design Support: FLEX 10K family documentation and tool support facilitate design entry, automatic place-and-route, and implementation workflows.
Why Choose EPF10K40RC208-4?
The EPF10K40RC208-4 positions itself as a versatile, mid-density programmable logic device for commercial embedded applications that require a balance of logic resources, on-chip RAM, and a substantial I/O count. Its surface-mount 208-BFQFP package and 5.0 V supply compatibility make it a practical option for established commercial platforms.
For engineering teams designing communications modules, instrumentation, consumer products, or custom control logic, this FLEX 10K device offers reconfigurability, testability, and integrated memory to reduce system BOM and accelerate development cycles while relying on documented family-level design resources.
Request a quote or submit an inquiry to receive pricing, availability, and qualification details for the EPF10K40RC208-4.

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