EPF10K30RC208-4N

IC FPGA 147 I/O 208RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP Exposed Pad

Quantity 465 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O147Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30RC208-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 1,728 logic elements, 12,288-bit RAM, 147 I/Os, 208-BFQFP

The EPF10K30RC208-4N is an Intel FLEX 10K family field programmable gate array (FPGA) device that integrates programmable logic and embedded memory for system-level integration. Designed for reconfigurable digital designs, it delivers 1,728 logic elements and 12,288 bits of on-chip RAM in a 208-BFQFP exposed-pad surface-mount package.

This device targets applications that require moderate logic density, on-chip memory and flexible I/O in a commercial-temperature, 5.0 V supply environment. It combines reconfigurability and system features from the FLEX 10K family to simplify implementation of embedded control, bus interfacing and glue-logic functions.

Key Features

  • Core Logic 1,728 logic elements and 216 LABs provide the programmable logic capacity needed for mid-density designs, equivalent to approximately 69,000 gates.
  • Embedded Memory 12,288 total RAM bits of embedded memory support buffers, FIFOs and small lookup tables for on-chip data storage.
  • I/O and Interface Capability 147 user I/O pins with programmable output controls. Family features include individual tri-state output enable, open-drain option and programmable slew-rate control for signal integrity management.
  • Reconfigurability and Test In-circuit reconfigurability via external configuration device or JTAG port is supported by the FLEX 10K family; built-in IEEE 1149.1 JTAG boundary-scan test circuitry enables board-level testing without consuming device logic.
  • System-Level Features FLEX 10K family capabilities such as embedded array blocks for megafunctions, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and low-skew global clock trees support complex system functions.
  • Package and Mounting 208-BFQFP exposed pad (supplier package 208-RQFP, 28×28) in a surface-mount form factor for PCB assembly and thermal management.
  • Power and Temperature Operates from 4.75 V to 5.25 V and is specified for commercial operation from 0 °C to 70 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Embedded control and glue logic — Implement custom control functions, protocol conversion and glue logic between peripherals using the device’s logic elements and on-chip RAM.
  • Bus and peripheral interfacing — Leverage FLEX 10K family system features and JTAG support for implementing bus interfaces and board-level peripherals.
  • Memory buffering and data handling — Use the 12,288 bits of embedded RAM for small FIFOs, lookup tables and buffering in data-path designs.
  • Prototyping and reconfigurable designs — In-circuit reconfigurability makes the device suitable for prototyping and designs that require field updates.

Unique Advantages

  • Balanced mid-range capacity: 1,728 logic elements and approximately 69,000 gates deliver a practical balance of logic and routing for moderate-complexity designs.
  • On-chip memory for tighter integration: 12,288 bits of embedded RAM reduce external memory requirements for small buffers and lookup tables, simplifying board-level BOM.
  • Flexible I/O controls: 147 user I/Os with programmable output options provide adaptability to a range of signaling and interface needs.
  • Reconfigurable system capability: Support for in-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan enables design iteration and board test without consuming user logic.
  • Proven design tool support: The FLEX 10K family is supported by vendor development systems for design entry, automatic place-and-route and simulation.
  • Surface-mount exposed-pad package: The 208-BFQFP exposed-pad package aids thermal performance and PCB assembly in space-constrained layouts.

Why Choose EPF10K30RC208-4N?

The EPF10K30RC208-4N offers a compact, reconfigurable platform that combines mid-range logic capacity, embedded RAM and a high I/O count in a 208-BFQFP surface-mount package. Its 5.0 V supply operation and commercial temperature rating make it suitable for a wide range of commercial embedded applications where system-level integration and in-field reconfiguration are important.

Engineers and procurement teams will find this device appropriate for designs that need moderate logic density, built-in memory resources and flexible I/O, backed by the FLEX 10K family’s system features and development tool support for streamlined implementation and testing.

Request a quote or submit an inquiry for EPF10K30RC208-4N to evaluate how this FLEX 10K FPGA fits your next design.

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