EPF10K30RC208-4N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 465 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-RQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 147 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30RC208-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 1,728 logic elements, 12,288-bit RAM, 147 I/Os, 208-BFQFP
The EPF10K30RC208-4N is an Intel FLEX 10K family field programmable gate array (FPGA) device that integrates programmable logic and embedded memory for system-level integration. Designed for reconfigurable digital designs, it delivers 1,728 logic elements and 12,288 bits of on-chip RAM in a 208-BFQFP exposed-pad surface-mount package.
This device targets applications that require moderate logic density, on-chip memory and flexible I/O in a commercial-temperature, 5.0 V supply environment. It combines reconfigurability and system features from the FLEX 10K family to simplify implementation of embedded control, bus interfacing and glue-logic functions.
Key Features
- Core Logic 1,728 logic elements and 216 LABs provide the programmable logic capacity needed for mid-density designs, equivalent to approximately 69,000 gates.
- Embedded Memory 12,288 total RAM bits of embedded memory support buffers, FIFOs and small lookup tables for on-chip data storage.
- I/O and Interface Capability 147 user I/O pins with programmable output controls. Family features include individual tri-state output enable, open-drain option and programmable slew-rate control for signal integrity management.
- Reconfigurability and Test In-circuit reconfigurability via external configuration device or JTAG port is supported by the FLEX 10K family; built-in IEEE 1149.1 JTAG boundary-scan test circuitry enables board-level testing without consuming device logic.
- System-Level Features FLEX 10K family capabilities such as embedded array blocks for megafunctions, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and low-skew global clock trees support complex system functions.
- Package and Mounting 208-BFQFP exposed pad (supplier package 208-RQFP, 28×28) in a surface-mount form factor for PCB assembly and thermal management.
- Power and Temperature Operates from 4.75 V to 5.25 V and is specified for commercial operation from 0 °C to 70 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded control and glue logic — Implement custom control functions, protocol conversion and glue logic between peripherals using the device’s logic elements and on-chip RAM.
- Bus and peripheral interfacing — Leverage FLEX 10K family system features and JTAG support for implementing bus interfaces and board-level peripherals.
- Memory buffering and data handling — Use the 12,288 bits of embedded RAM for small FIFOs, lookup tables and buffering in data-path designs.
- Prototyping and reconfigurable designs — In-circuit reconfigurability makes the device suitable for prototyping and designs that require field updates.
Unique Advantages
- Balanced mid-range capacity: 1,728 logic elements and approximately 69,000 gates deliver a practical balance of logic and routing for moderate-complexity designs.
- On-chip memory for tighter integration: 12,288 bits of embedded RAM reduce external memory requirements for small buffers and lookup tables, simplifying board-level BOM.
- Flexible I/O controls: 147 user I/Os with programmable output options provide adaptability to a range of signaling and interface needs.
- Reconfigurable system capability: Support for in-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan enables design iteration and board test without consuming user logic.
- Proven design tool support: The FLEX 10K family is supported by vendor development systems for design entry, automatic place-and-route and simulation.
- Surface-mount exposed-pad package: The 208-BFQFP exposed-pad package aids thermal performance and PCB assembly in space-constrained layouts.
Why Choose EPF10K30RC208-4N?
The EPF10K30RC208-4N offers a compact, reconfigurable platform that combines mid-range logic capacity, embedded RAM and a high I/O count in a 208-BFQFP surface-mount package. Its 5.0 V supply operation and commercial temperature rating make it suitable for a wide range of commercial embedded applications where system-level integration and in-field reconfiguration are important.
Engineers and procurement teams will find this device appropriate for designs that need moderate logic density, built-in memory resources and flexible I/O, backed by the FLEX 10K family’s system features and development tool support for streamlined implementation and testing.
Request a quote or submit an inquiry for EPF10K30RC208-4N to evaluate how this FLEX 10K FPGA fits your next design.

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