EPF10K30RC208-3

The EPF10K30RC208-3 is a FLEX 10K series field programmable gate array (FPGA) optimized for system-level programmable logic integration. It combines 1,728 logic elements, 216 logic array blocks, and 6 embedded array blocks to deliver programmable logic and embedded memory in a single surface-mount device.

Designed for commercial 5.0 V systems, this device provides 12,288 bits of on-chip RAM, 147 user I/O pins, and a 208-BFQFP exposed-pad package, making it suitable for SOPC-style integration, interface bridging, and custom logic implementations where dense on-chip memory and flexible I/O are required.

Key Features

• Core density — 1,728 logic elements and 216 logic array blocks provide a programmable fabric capable of implementing complex logic functions; total gate count listed as 69,000.
• Embedded memory — Six embedded array blocks (EABs) delivering approximately 12,288 bits of on-chip RAM for efficient megafunction and buffer implementations.
• I/O and system voltage — 147 user I/O pins and a specified supply range of 4.75 V to 5.25 V for direct integration into 5.0 V platform environments.
• Package and mounting — 208-BFQFP with exposed pad (supplier package: 208-RQFP, 28×28) in a surface-mount form factor for board-level assembly and thermal management.
• Commercial temperature grade — Rated for operation from 0 °C to 70 °C to match commercial embedded applications.
• Series-level system features — FLEX 10K family capabilities such as embedded array for megafunctions, JTAG boundary-scan, and options like ClockLock and ClockBoost (as described in FLEX 10K family documentation).
• RoHS compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) integration — Implement embedded logic and memory blocks to consolidate multiple functions into a single programmable device.
• Interface and protocol bridging — Use the device’s plentiful I/O and 5.0 V supply compatibility to bridge and adapt signals between legacy 5 V peripherals and modern logic.
• Custom logic and prototyping — Rapidly prototype and iterate custom logic functions and megafunctions using the on-chip RAM and logic element resources.
• User interface and peripheral control — Manage multiple I/O-driven peripherals, front-panel logic, and control tasks within commercial electronic products.

Unique Advantages

• Balanced logic and memory — The combination of 1,728 logic elements and six EABs (approximately 12,288 RAM bits) reduces the need for external memory in many designs.
• Direct 5 V system integration — Specified 4.75 V–5.25 V supply range aligns with 5.0 V platforms for straightforward board-level integration.
• Generous I/O count — 147 user I/O pins provide flexibility for parallel interfaces, bus connections, and mixed-signal front ends.
• Package optimized for assembly — 208-BFQFP exposed-pad surface-mount package supports board-level thermal dissipation and compact footprint requirements.
• RoHS compliance — Meets lead-free assembly requirements for commercial production environments.
• Family-level development support — FLEX 10K family documentation and design tools provide a known development path for place-and-route and megafunction use.

Why Choose EPF10K30RC208-3?

The EPF10K30RC208-3 positions itself as a practical, commercially rated FPGA for designers needing a mix of logic density, embedded RAM, and extensive I/O in a 5.0 V environment. Its combination of 1,728 logic elements, six embedded array blocks, and 147 I/O pins makes it well suited to consolidating multiple discrete functions into a single programmable device.

This part is appropriate for commercial embedded systems, prototype platforms, and applications that benefit from on-chip memory and flexible interfacing. As a member of the FLEX 10K family, it aligns with the family’s documented system features and development tooling, offering a predictable path from design to production.

Request a quote or submit an inquiry to receive pricing and availability details for EPF10K30RC208-3 and to discuss how this device fits your next design.