EPF10K30RC240-3
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,218 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30RC240-3 – FLEX-10K® FPGA IC, 1,728 Logic Elements, 12,288-bit RAM, 240-BFQFP
The EPF10K30RC240-3 is an Intel FLEX 10K family field-programmable gate array (FPGA) offered in a 240-pin BFQFP exposed-pad package. It combines a dedicated logic array and embedded memory resources to enable System-on-a-Programmable-Chip (SOPC) integration for embedded and control applications.
With 1,728 logic elements, 12,288 bits of on-chip RAM, and 189 user I/O pins, this commercial-grade, surface-mount device targets designs that require flexible logic/memory partitioning, in-circuit reconfigurability, and standard 5.0 V supply operation.
Key Features
- Core architecture FLEX 10K embedded programmable logic family architecture with a separate logic array and embedded array blocks for implementing both general logic and megafunctions.
- Logic capacity Approximately 1,728 logic elements and a maximum system gate count of 69,000 provide a balance of density for medium-complexity designs.
- Embedded memory Total on-chip RAM of 12,288 bits and embedded array blocks (EABs) for efficient implementation of memory and specialized functions.
- I/O and package 189 user I/O pins in a 240-BFQFP exposed-pad package (supplier package 240-RQFP 32×32), surface-mount mounting type suited to standard PCB assembly.
- Power and temperature Designed for 5.0 V operation with a specified supply range of 4.75 V to 5.25 V and an operating temperature range of 0 °C to 70 °C (commercial grade).
- Configuration and test Series features include in-circuit reconfigurability (ICR) via external configuration device, intelligent controller, or JTAG; built-in JTAG boundary-scan test (IEEE Std. 1149.1-1990) available without consuming device logic.
- System-level features FLEX 10K series capabilities include FastTrack interconnect, dedicated carry and cascade chains for arithmetic and high-fan-in functions, multiple global clock and clear signals, and programmable I/O options such as slew-rate control and open-drain outputs.
- Regulatory status RoHS compliant.
Typical Applications
- Embedded control systems Use the EPF10K30RC240-3 to consolidate glue logic, state machines, and interface control in mid-density embedded products.
- Peripheral and bus interfaces Implement custom bus controllers or protocol bridges leveraging the device’s I/O count and series support for PCI Local Bus Specification where applicable.
- Memory and buffering functions Deploy embedded array blocks and on-chip RAM for FIFOs, buffering, and small on-chip storage to simplify external memory requirements.
- User interface and I/O aggregation Aggregate multiple peripheral signals, handle debouncing, and implement interface logic across the device’s 189 I/O pins.
Unique Advantages
- Balanced logic and memory The combination of 1,728 logic elements and 12,288 bits of RAM supports mixed logic-plus-memory functions without offloading to external devices.
- Flexible package options Available in a 240-BFQFP exposed-pad package suitable for compact board designs requiring a high pin count.
- In-system reprogrammability ICR and JTAG support permit field updates and boundary-scan testing without consuming user logic resources.
- Comprehensive I/O control Programmable output slew-rate, open-drain option, and per-pin tri-state enable give precise control over signal integrity and interfacing.
- Commercial-grade availability Designed for standard commercial operating conditions (0 °C to 70 °C) with a standard 5.0 V supply range for legacy and mixed-voltage systems.
Why Choose EPF10K30RC240-3?
The EPF10K30RC240-3 positions itself as a versatile mid-density FPGA from the FLEX 10K family, offering a practical mix of logic elements, embedded memory, and I/O for embedded system and interface designs. Its 240-BFQFP exposed-pad package and 5.0 V supply compatibility make it a straightforward fit for commercial applications that require board-level integration and in-field configurability.
Engineers and procurement teams benefit from a well-documented series architecture—incorporating in-circuit reconfiguration, JTAG boundary-scan, and dedicated arithmetic/cascade resources—allowing scalable designs and straightforward migration within the FLEX 10K family.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time details for the EPF10K30RC240-3.

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