EPF10K30RC240-3

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP Exposed Pad

Quantity 1,218 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30RC240-3 – FLEX-10K® FPGA IC, 1,728 Logic Elements, 12,288-bit RAM, 240-BFQFP

The EPF10K30RC240-3 is an Intel FLEX 10K family field-programmable gate array (FPGA) offered in a 240-pin BFQFP exposed-pad package. It combines a dedicated logic array and embedded memory resources to enable System-on-a-Programmable-Chip (SOPC) integration for embedded and control applications.

With 1,728 logic elements, 12,288 bits of on-chip RAM, and 189 user I/O pins, this commercial-grade, surface-mount device targets designs that require flexible logic/memory partitioning, in-circuit reconfigurability, and standard 5.0 V supply operation.

Key Features

  • Core architecture  FLEX 10K embedded programmable logic family architecture with a separate logic array and embedded array blocks for implementing both general logic and megafunctions.
  • Logic capacity  Approximately 1,728 logic elements and a maximum system gate count of 69,000 provide a balance of density for medium-complexity designs.
  • Embedded memory  Total on-chip RAM of 12,288 bits and embedded array blocks (EABs) for efficient implementation of memory and specialized functions.
  • I/O and package  189 user I/O pins in a 240-BFQFP exposed-pad package (supplier package 240-RQFP 32×32), surface-mount mounting type suited to standard PCB assembly.
  • Power and temperature  Designed for 5.0 V operation with a specified supply range of 4.75 V to 5.25 V and an operating temperature range of 0 °C to 70 °C (commercial grade).
  • Configuration and test  Series features include in-circuit reconfigurability (ICR) via external configuration device, intelligent controller, or JTAG; built-in JTAG boundary-scan test (IEEE Std. 1149.1-1990) available without consuming device logic.
  • System-level features  FLEX 10K series capabilities include FastTrack interconnect, dedicated carry and cascade chains for arithmetic and high-fan-in functions, multiple global clock and clear signals, and programmable I/O options such as slew-rate control and open-drain outputs.
  • Regulatory status  RoHS compliant.

Typical Applications

  • Embedded control systems  Use the EPF10K30RC240-3 to consolidate glue logic, state machines, and interface control in mid-density embedded products.
  • Peripheral and bus interfaces  Implement custom bus controllers or protocol bridges leveraging the device’s I/O count and series support for PCI Local Bus Specification where applicable.
  • Memory and buffering functions  Deploy embedded array blocks and on-chip RAM for FIFOs, buffering, and small on-chip storage to simplify external memory requirements.
  • User interface and I/O aggregation  Aggregate multiple peripheral signals, handle debouncing, and implement interface logic across the device’s 189 I/O pins.

Unique Advantages

  • Balanced logic and memory  The combination of 1,728 logic elements and 12,288 bits of RAM supports mixed logic-plus-memory functions without offloading to external devices.
  • Flexible package options  Available in a 240-BFQFP exposed-pad package suitable for compact board designs requiring a high pin count.
  • In-system reprogrammability  ICR and JTAG support permit field updates and boundary-scan testing without consuming user logic resources.
  • Comprehensive I/O control  Programmable output slew-rate, open-drain option, and per-pin tri-state enable give precise control over signal integrity and interfacing.
  • Commercial-grade availability  Designed for standard commercial operating conditions (0 °C to 70 °C) with a standard 5.0 V supply range for legacy and mixed-voltage systems.

Why Choose EPF10K30RC240-3?

The EPF10K30RC240-3 positions itself as a versatile mid-density FPGA from the FLEX 10K family, offering a practical mix of logic elements, embedded memory, and I/O for embedded system and interface designs. Its 240-BFQFP exposed-pad package and 5.0 V supply compatibility make it a straightforward fit for commercial applications that require board-level integration and in-field configurability.

Engineers and procurement teams benefit from a well-documented series architecture—incorporating in-circuit reconfiguration, JTAG boundary-scan, and dedicated arithmetic/cascade resources—allowing scalable designs and straightforward migration within the FLEX 10K family.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time details for the EPF10K30RC240-3.

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