EPF10K30RC208-4

IC FPGA 147 I/O 208RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP Exposed Pad

Quantity 723 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O147Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30RC208-4 – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 147 I/O, 12,288‑bit RAM, 1,728 Logic Elements, 208‑BFQFP Exposed Pad

The EPF10K30RC208-4 is a FLEX‑10K family field programmable gate array offering a medium-density, embedded programmable logic solution for commercial electronic designs. It combines 1,728 logic elements with 12,288 bits of on-chip RAM and approximately 69,000 gates to address applications that require integrated logic, memory and flexible I/O in a single surface‑mount device.

Designed for system-level integration, the device supports in‑circuit reconfigurability and the FLEX 10K family architecture features that enable implementation of megafunctions and specialized memory/logic blocks for embedded designs.

Key Features

  • Logic Capacity — 1,728 logic elements providing medium-density programmable logic for glue‑logic, control and custom datapath implementations.
  • Embedded Memory — 12,288 bits of on‑chip RAM for local buffering, FIFOs and small data stores without external memory.
  • Gate Count — Approximately 69,000 system gates for combined logic and RAM resources.
  • I/O Resources — 147 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
  • Power and Supply — Specified operating supply range of 4.75 V to 5.25 V for 5.0‑V system compatibility.
  • Package and Mounting — 208‑pin BFQFP package with exposed pad, surface mount mounting type for board-level integration.
  • Operating Range and Grade — Commercial grade operation from 0 °C to 70 °C.
  • Boundary-Scan and Reconfiguration — Built‑in JTAG boundary‑scan circuitry and support for in‑circuit reconfigurability via external configuration devices or the JTAG port.
  • Family-Level Architecture — FLEX 10K family features such as embedded arrays for megafunctions, dedicated carry and cascade chains, and low‑skew clock distribution (as documented for the FLEX 10K family).
  • Compliance — RoHS compliant.

Typical Applications

  • System Integration / SOPC — Implement megafunctions and on‑chip memory to consolidate glue logic and peripheral functions into a single device.
  • Interface Bridging — Use available I/O resources to translate and aggregate signals between subsystems or legacy peripherals.
  • Embedded Control — Implement custom control logic, state machines and timing-critical functions leveraging dedicated carry and cascade resources.
  • Prototyping and Development — Medium-density FPGA resource set suitable for validating hardware logic and small-scale designs before production.

Unique Advantages

  • Balanced Integration: Combines 1,728 logic elements with 12,288 bits of embedded RAM to reduce external components and simplify board design.
  • 5 V System Compatibility: Device is specified for 4.75 V to 5.25 V operation, aligning with 5.0‑V logic systems.
  • Flexible I/O Count: 147 user I/O pins enable multiple peripheral connections without immediate need for I/O expanders.
  • Packaged for Production: 208‑BFQFP exposed pad package supports standard surface‑mount assembly and thermal conduction at the package level.
  • In‑Circuit Reconfigurability: JTAG and external configuration support allow updates and iterative development without board redesign.
  • Family Design Support: FLEX 10K family development tools and architecture features (place‑and‑route and megafunction support) are documented for this device family.

Why Choose EPF10K30RC208-4?

The EPF10K30RC208-4 provides a practical balance of logic density, embedded RAM and I/O for commercial embedded designs that require on‑chip memory and reprogrammable logic in a 208‑pin surface mount package. Its FLEX 10K family heritage delivers architecture features—like dedicated arithmetic chains and embedded array support—that streamline implementation of common megafunctions and control logic.

This part is well suited to designers seeking a medium‑density FPGA with 5 V system compatibility, on‑chip RAM, and boundary‑scan reconfiguration options. The device aligns with documented FLEX 10K family development workflows for quicker integration and iterative design cycles.

If you would like pricing, availability or a formal quote for EPF10K30RC208-4, submit a product inquiry or request a quote and our team will respond with the next steps.

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