EPF10K30ETI144-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 24576 1728 144-LQFP |
|---|---|
| Quantity | 398 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K30ETI144-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC, 102 I/O, 24,576-bit RAM, 1,728 Logic Elements, 144-LQFP
The EPF10K30ETI144-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel, offering embedded programmable logic for system-level integration. This device combines a logic array with on-chip embedded memory to implement megafunctions and general-purpose logic in a single surface-mount IC.
With 1,728 logic elements, approximately 24,576 bits of embedded RAM, and 102 user I/O pins in a 144-pin LQFP package, the EPF10K30ETI144-2 targets industrial embedded designs that require moderate logic density, integrated memory, and configurable I/O in a compact package.
Key Features
- Logic Capacity 1,728 logic elements and approximately 119,000 gates provide a balanced mix of combinational and sequential resources for mid-range FPGA functions.
- Embedded Memory Approximately 24,576 bits of on-chip RAM suitable for implementing FIFOs, small buffers, and megafunctions without external memory.
- I/O Count and Flexibility 102 user I/O pins accommodate peripheral interfaces and board-level signals; series-level features include individual tri-state control, open-drain options, and programmable output slew-rate control.
- System and Test Support Built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990 is available without consuming device logic.
- Clocking and Timing Low-skew clock distribution and series-level ClockLock and ClockBoost options help manage clock delay and support clock multiplication where required.
- Power and Operating Range Specified supply range of 2.375 V to 2.625 V and industrial operating temperature range of -40 °C to 85 °C.
- Package and Mounting 144-LQFP package (supplier device package listed as 144-TQFP, 20×20) in a surface-mount form factor for compact board designs.
- Environmental Compliance RoHS compliant.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) Integrate control logic and embedded memory to consolidate functions traditionally handled by multiple ICs.
- Embedded Control Implement control logic, state machines, and peripheral interfaces in industrial embedded systems operating across the device’s -40 °C to 85 °C range.
- Prototyping and Development Use the programmable fabric and on-chip RAM to rapidly iterate hardware functions and validate megafunctions without extensive external components.
- Peripheral Bridging and Interface Logic Leverage the device’s I/O count and configurable I/O behavior for protocol conversion, glue logic, and bus interfacing tasks.
Unique Advantages
- Balanced Mid-Range Capacity: Combines 1,728 logic elements and ~24,576 bits of embedded RAM for designs that need moderate logic and local memory without external devices.
- Integrated Testability: JTAG boundary-scan support enables board-level testing and in-system debug without consuming user logic resources.
- Flexible I/O Behavior: Programmable slew rates, tri-state control, and open-drain options simplify signal integrity tuning and interface compatibility.
- Industrial-Grade Operating Range: Specified for -40 °C to 85 °C, making it suitable for industrial embedded applications.
- Compact Surface-Mount Package: 144-pin LQFP packaging provides a small footprint for space-constrained PCBs while offering a substantial I/O count.
- Standards-Based Family Features: Series-level support for low-skew clocks and SOPC-style integration simplifies migration and reuse across FLEX 10K designs.
Why Choose EPF10K30ETI144-2?
The EPF10K30ETI144-2 is positioned for designers who need a compact, mid-density FPGA with embedded memory and comprehensive I/O in an industrial-grade, surface-mount package. Its combination of logic elements, on-chip RAM, and integrated test and clocking features lets you consolidate functions, reduce external BOM, and streamline prototype-to-product workflows.
This part is a practical choice for embedded and industrial applications where moderate logic capacity, reliable operation across a broad temperature range, and RoHS compliance are required. The FLEX-10KE family characteristics enable predictable integration into systems that benefit from programmable logic and embedded memory.
Request a quote or submit a quote request to evaluate EPF10K30ETI144-2 for your next embedded design.

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