EPF10K30ETI144-2

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 24576 1728 144-LQFP

Quantity 398 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K30ETI144-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC, 102 I/O, 24,576-bit RAM, 1,728 Logic Elements, 144-LQFP

The EPF10K30ETI144-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel, offering embedded programmable logic for system-level integration. This device combines a logic array with on-chip embedded memory to implement megafunctions and general-purpose logic in a single surface-mount IC.

With 1,728 logic elements, approximately 24,576 bits of embedded RAM, and 102 user I/O pins in a 144-pin LQFP package, the EPF10K30ETI144-2 targets industrial embedded designs that require moderate logic density, integrated memory, and configurable I/O in a compact package.

Key Features

  • Logic Capacity 1,728 logic elements and approximately 119,000 gates provide a balanced mix of combinational and sequential resources for mid-range FPGA functions.
  • Embedded Memory Approximately 24,576 bits of on-chip RAM suitable for implementing FIFOs, small buffers, and megafunctions without external memory.
  • I/O Count and Flexibility 102 user I/O pins accommodate peripheral interfaces and board-level signals; series-level features include individual tri-state control, open-drain options, and programmable output slew-rate control.
  • System and Test Support Built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990 is available without consuming device logic.
  • Clocking and Timing Low-skew clock distribution and series-level ClockLock and ClockBoost options help manage clock delay and support clock multiplication where required.
  • Power and Operating Range Specified supply range of 2.375 V to 2.625 V and industrial operating temperature range of -40 °C to 85 °C.
  • Package and Mounting 144-LQFP package (supplier device package listed as 144-TQFP, 20×20) in a surface-mount form factor for compact board designs.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) Integrate control logic and embedded memory to consolidate functions traditionally handled by multiple ICs.
  • Embedded Control Implement control logic, state machines, and peripheral interfaces in industrial embedded systems operating across the device’s -40 °C to 85 °C range.
  • Prototyping and Development Use the programmable fabric and on-chip RAM to rapidly iterate hardware functions and validate megafunctions without extensive external components.
  • Peripheral Bridging and Interface Logic Leverage the device’s I/O count and configurable I/O behavior for protocol conversion, glue logic, and bus interfacing tasks.

Unique Advantages

  • Balanced Mid-Range Capacity: Combines 1,728 logic elements and ~24,576 bits of embedded RAM for designs that need moderate logic and local memory without external devices.
  • Integrated Testability: JTAG boundary-scan support enables board-level testing and in-system debug without consuming user logic resources.
  • Flexible I/O Behavior: Programmable slew rates, tri-state control, and open-drain options simplify signal integrity tuning and interface compatibility.
  • Industrial-Grade Operating Range: Specified for -40 °C to 85 °C, making it suitable for industrial embedded applications.
  • Compact Surface-Mount Package: 144-pin LQFP packaging provides a small footprint for space-constrained PCBs while offering a substantial I/O count.
  • Standards-Based Family Features: Series-level support for low-skew clocks and SOPC-style integration simplifies migration and reuse across FLEX 10K designs.

Why Choose EPF10K30ETI144-2?

The EPF10K30ETI144-2 is positioned for designers who need a compact, mid-density FPGA with embedded memory and comprehensive I/O in an industrial-grade, surface-mount package. Its combination of logic elements, on-chip RAM, and integrated test and clocking features lets you consolidate functions, reduce external BOM, and streamline prototype-to-product workflows.

This part is a practical choice for embedded and industrial applications where moderate logic capacity, reliable operation across a broad temperature range, and RoHS compliance are required. The FLEX-10KE family characteristics enable predictable integration into systems that benefit from programmable logic and embedded memory.

Request a quote or submit a quote request to evaluate EPF10K30ETI144-2 for your next embedded design.

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