EPF10K30AQC240-3N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 12288 1728 240-BFQFP |
|---|---|
| Quantity | 921 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30AQC240-3N – FLEX-10KA Field Programmable Gate Array, 1,728 logic elements, 240-BFQFP
The EPF10K30AQC240-3N is an embedded programmable logic device in the FLEX-10KA family designed for system integration and configurable logic tasks. It combines 1,728 logic elements with approximately 12,288 bits of embedded RAM and a 189-pin I/O interface to address glue logic, peripheral bridging, and moderate-density programmable functions.
This surface-mount FPGA is supplied in a 240-BFQFP (240-PQFP 32×32) package, operates from 3 V to 3.6 V and is specified for commercial temperature operation from 0 °C to 70 °C. It is RoHS compliant and intended for applications that require reconfigurable logic, on-chip memory and a high I/O count in a compact package.
Key Features
- Programmable Logic Core — 1,728 logic elements provide flexible routing and logic resources for mid-range integration and custom logic implementation.
- On-chip Memory — Approximately 12,288 bits of embedded RAM enable storage for FIFOs, small buffers and megafunction implementations without external memory.
- I/O Capacity — Up to 189 user I/O pins support parallel interfaces, peripheral connections and board-level I/O routing.
- System Gates — Rated for 69,000 gates (typical system gate count) to quantify overall logic and memory capacity.
- Supply and Temperature — Operates from 3 V to 3.6 V with a commercial operating range of 0 °C to 70 °C.
- Package & Mounting — Supplied in a 240-BFQFP (240-PQFP 32×32) package designed for surface-mount PCB assembly.
- Reconfiguration & Test — Supports in-circuit reconfigurability and includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990 for device programming and board-level testing.
- Family-Level Capabilities — FLEX 10K family features such as FastTrack interconnect, dedicated carry and cascade chains, and clock distribution options (ClockLock/ClockBoost) support common FPGA design needs.
- Compliance — RoHS compliant for regulatory material requirements.
Typical Applications
- System Glue Logic: Implement board-level interfacing, bus bridging and protocol adaptation using the device's logic elements and high I/O count.
- Embedded Functions and Megafunctions: Use on-chip RAM and programmable logic to implement FIFOs, lookup tables and specialized logic blocks for embedded designs.
- Peripheral & I/O Control: Manage multiple parallel and serial peripherals where flexible I/O and reconfigurability simplify design variants and platform updates.
- Prototyping and Development: Suitable for prototype systems that require reconfigurable logic and in-circuit reprogramming for iterative development.
- PCI/Legacy Peripheral Integration: (Family-level capability) FLEX 10K family support for PCI-related system features can assist designs that integrate legacy or PCI-based peripherals.
Unique Advantages
- Balanced Logic and Memory: Combines 1,728 logic elements with approximately 12,288 bits of embedded RAM to support both control logic and small data storage on-chip, reducing external component count.
- High I/O Density in a Compact Package: 189 user I/O pins in a 240-BFQFP package enable dense external interfacing while keeping board area compact.
- Reconfigurability and Test Support: In-circuit reconfigurability and IEEE 1149.1-compliant JTAG boundary-scan simplify field updates and board-level testing workflows.
- Family-Level Design Options: Architecture features such as dedicated carry/cascade chains and configurable clock options provide designers with predictable arithmetic performance and flexible clocking strategies.
- Commercial-Grade Operation: Specified for 0 °C to 70 °C operation and RoHS compliance to meet common commercial product requirements.
Why Choose EPF10K30AQC240-3N?
The EPF10K30AQC240-3N positions itself as a mid-density FLEX-10KA device that combines configurable logic, embedded RAM and a substantial I/O count in a single surface-mount package. Its mix of 1,728 logic elements and approximately 12,288 bits of on-chip memory suits designs that require moderate logic capacity, local buffering and flexible peripheral interfacing.
This part is well suited to engineering teams developing system integration functions, peripheral controllers, and prototype platforms that benefit from in-circuit reconfigurability, JTAG-based testability and a compact 240-BFQFP footprint. The FLEX-10KA family features provide additional architectural options to tailor clocking and arithmetic performance to application needs.
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