EPF10K30AQC208-2

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP

Quantity 210 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level6 (Time on Label)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AQC208-2 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC, 1,728 logic elements, 12,288-bit RAM, 208-BFQFP

The EPF10K30AQC208-2 is a FLEX-10KA family field-programmable gate array (FPGA) manufactured by Intel. It combines an embedded array for megafunctions with a general-purpose logic array to deliver mid-density programmable logic suitable for system integration and custom logic implementations.

Designed for commercial applications, the device targets mid-range designs requiring on-chip embedded memory, a substantial I/O count, and in-circuit reconfiguration for iterative development and system-level integration.

Key Features

  • Core and Capacity — 1,728 logic elements and 216 LABs providing the programmable logic needed for mid-density designs; the device lists approximately 69,000 system gates.
  • Embedded Memory — Approximately 12,288 bits of on-chip RAM suitable for implementing small buffers, FIFOs, and megafunction memory structures.
  • I/O and Interfaces — 147 user I/O pins, with family-level support for boundary-scan (JTAG) for device test and in-circuit configuration.
  • Configuration and System Features — Supports in‑circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; family includes low-skew clock distribution and dedicated carry/cascade chains for arithmetic and high-fan-in logic.
  • Power and Voltage — Operates from a 3.0 V to 3.6 V supply, consistent with 3.3 V family operation.
  • Package and Mounting — 208‑BFQFP surface-mount package (supplier device package: 208‑PQFP, 28×28 mm) for PCB designs requiring a leaded PQFP footprint.
  • Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • SOPC and System Integration — Implement system-on-a-programmable-chip (SOPC) modules where embedded memory and custom logic blocks accelerate integration of peripherals and control logic.
  • Interface and Bus Logic — Mid-density interface bridging, protocol translation, and glue-logic tasks where a high I/O count and reconfigurability are valuable.
  • Embedded Function Acceleration — Offload specialized functions or small datapath accelerators using the embedded RAM and dedicated arithmetic/cascade resources.
  • Development and Prototyping — In-circuit reconfigurability and JTAG support enable iterative hardware development and on-board debug.

Unique Advantages

  • Balanced mid-range capacity: 1,728 logic elements with approximately 69,000 system gates and 12,288 bits of RAM provide a practical balance of logic and memory for many embedded designs.
  • High I/O density: 147 user I/Os enable complex peripheral interfacing without requiring larger, higher-cost devices.
  • Flexible configuration options: In-circuit reconfigurability and JTAG boundary-scan support speed development cycles and simplify board-level testing.
  • Compact, serviceable package: 208‑BFQFP (28×28 mm) surface-mount package fits mid-density designs while remaining compatible with PQFP assembly flows.
  • Standards-aligned family features: FLEX 10K family capabilities such as dedicated carry/cascade chains and clock distribution simplify implementation of arithmetic and timing-sensitive logic.
  • RoHS-compliant commercial device: Suitable for commercial production environments with a defined 0 °C to 70 °C operating range.

Why Choose EPF10K30AQC208-2?

The EPF10K30AQC208-2 offers a practical, mid-density FPGA solution for designers who need a mix of programmable logic, embedded memory, and significant I/O in a compact PQFP package. Its combination of 1,728 logic elements, embedded RAM, and in-circuit reconfiguration features makes it well suited to prototyping, interface logic, and embedded function acceleration in commercial products.

Choosing this device provides a clear upgrade path within the FLEX 10K family and leverages family-level system features—such as JTAG configuration support and dedicated arithmetic/cascade resources—helpful for reducing design iterations and simplifying board-level integration.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for EPF10K30AQC208-2.

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