EPF10K30AQC208-2
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP |
|---|---|
| Quantity | 210 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 6 (Time on Label) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30AQC208-2 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC, 1,728 logic elements, 12,288-bit RAM, 208-BFQFP
The EPF10K30AQC208-2 is a FLEX-10KA family field-programmable gate array (FPGA) manufactured by Intel. It combines an embedded array for megafunctions with a general-purpose logic array to deliver mid-density programmable logic suitable for system integration and custom logic implementations.
Designed for commercial applications, the device targets mid-range designs requiring on-chip embedded memory, a substantial I/O count, and in-circuit reconfiguration for iterative development and system-level integration.
Key Features
- Core and Capacity — 1,728 logic elements and 216 LABs providing the programmable logic needed for mid-density designs; the device lists approximately 69,000 system gates.
- Embedded Memory — Approximately 12,288 bits of on-chip RAM suitable for implementing small buffers, FIFOs, and megafunction memory structures.
- I/O and Interfaces — 147 user I/O pins, with family-level support for boundary-scan (JTAG) for device test and in-circuit configuration.
- Configuration and System Features — Supports in‑circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; family includes low-skew clock distribution and dedicated carry/cascade chains for arithmetic and high-fan-in logic.
- Power and Voltage — Operates from a 3.0 V to 3.6 V supply, consistent with 3.3 V family operation.
- Package and Mounting — 208‑BFQFP surface-mount package (supplier device package: 208‑PQFP, 28×28 mm) for PCB designs requiring a leaded PQFP footprint.
- Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Compliance — RoHS compliant.
Typical Applications
- SOPC and System Integration — Implement system-on-a-programmable-chip (SOPC) modules where embedded memory and custom logic blocks accelerate integration of peripherals and control logic.
- Interface and Bus Logic — Mid-density interface bridging, protocol translation, and glue-logic tasks where a high I/O count and reconfigurability are valuable.
- Embedded Function Acceleration — Offload specialized functions or small datapath accelerators using the embedded RAM and dedicated arithmetic/cascade resources.
- Development and Prototyping — In-circuit reconfigurability and JTAG support enable iterative hardware development and on-board debug.
Unique Advantages
- Balanced mid-range capacity: 1,728 logic elements with approximately 69,000 system gates and 12,288 bits of RAM provide a practical balance of logic and memory for many embedded designs.
- High I/O density: 147 user I/Os enable complex peripheral interfacing without requiring larger, higher-cost devices.
- Flexible configuration options: In-circuit reconfigurability and JTAG boundary-scan support speed development cycles and simplify board-level testing.
- Compact, serviceable package: 208‑BFQFP (28×28 mm) surface-mount package fits mid-density designs while remaining compatible with PQFP assembly flows.
- Standards-aligned family features: FLEX 10K family capabilities such as dedicated carry/cascade chains and clock distribution simplify implementation of arithmetic and timing-sensitive logic.
- RoHS-compliant commercial device: Suitable for commercial production environments with a defined 0 °C to 70 °C operating range.
Why Choose EPF10K30AQC208-2?
The EPF10K30AQC208-2 offers a practical, mid-density FPGA solution for designers who need a mix of programmable logic, embedded memory, and significant I/O in a compact PQFP package. Its combination of 1,728 logic elements, embedded RAM, and in-circuit reconfiguration features makes it well suited to prototyping, interface logic, and embedded function acceleration in commercial products.
Choosing this device provides a clear upgrade path within the FLEX 10K family and leverages family-level system features—such as JTAG configuration support and dedicated arithmetic/cascade resources—helpful for reducing design iterations and simplifying board-level integration.
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