EPF10K30AFC484-3
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 246 12288 1728 484-BBGA |
|---|---|
| Quantity | 250 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 246 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30AFC484-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 246 12288 1728 484-BBGA
The EPF10K30AFC484-3 is a FLEX 10KA embedded programmable logic device from Intel, delivered in a 484-BBGA package for surface-mount applications. It combines a configurable logic array with embedded memory and a rich I/O set to support system-level integration in commercial embedded designs.
Designed for System-on-a-Programmable-Chip (SOPC) integration, this device targets applications that require moderate logic density, on-chip RAM, and flexible I/O at a 3.0–3.6 V supply and 0 °C to 70 °C operating range.
Key Features
- Logic Capacity Approximately 1,728 logic elements with 216 logic array blocks (LABs), enabling a range of medium-complexity combinational and sequential logic implementations.
- Embedded Memory Approximately 12,288 bits of on-chip RAM suitable for FIFOs, small data buffers, and state storage.
- I/O and Voltage Up to 246 user I/O pins with a specified voltage supply range of 3 V to 3.6 V for common 3.3 V systems.
- Gate Count Maximum system gates listed as 69,000, providing a reference for overall design capacity and integration scope.
- Packaging and Mounting 484-ball BBGA package (supplier package: 484-FBGA, 23×23), surface-mount mounting type for compact PCB implementations.
- Temperature and Grade Commercial grade operation from 0 °C to 70 °C for mainstream embedded applications.
- In-circuit Reconfigurability Supports in-circuit reconfiguration via external configuration devices, intelligent controllers, or the JTAG port as documented for the FLEX 10K family.
- System and Test Features Built-in IEEE 1149.1 JTAG boundary-scan test circuitry and family-level features for SOPC integration, clock distribution options, and low-skew clock trees.
- Interconnect and Arithmetic Support FastTrack interconnect with dedicated carry and cascade chains to implement arithmetic and high-fan-in logic functions as used by family megafunctions.
- Compliance RoHS compliant.
Typical Applications
- System Integration SOPC and embedded system integration where on-chip memory and configurable logic reduce external component count.
- Peripheral and Interface Logic Glue logic, protocol bridging, and custom peripheral interfaces taking advantage of the device’s extensive I/O and configurable I/O features.
- Memory and Buffering On-chip RAM for small FIFOs, buffering, and data-path staging in embedded designs.
- Prototyping and Custom Logic Medium-density programmable logic for use in development platforms and custom control logic in commercial products.
Unique Advantages
- Balanced Logic and Memory Combines 1,728 logic elements with approximately 12,288 bits of embedded RAM to support mixed logic and storage requirements on a single device.
- Flexible I/O 246 user I/O pins accommodate a wide range of external interfaces and signals without immediate need for external I/O expanders.
- Compact, Board-Friendly Package 484-BBGA surface-mount package (23×23 FBGA footprint) maximizes board space efficiency for high-density PCBs.
- In-System Reconfigurability Supports multiple configuration methods including JTAG for field updates and design iteration without device removal.
- Testability Integrated IEEE 1149.1 boundary-scan simplifies board-level test and manufacturing validation.
- Standards-Based Design Support Family-level features and megafunction support streamline implementation of common functions and arithmetic via dedicated carry/cascade resources.
Why Choose EPF10K30AFC484-3?
The EPF10K30AFC484-3 positions itself as a commercially graded, medium-density FLEX 10KA FPGA for designs that need a balance of logic resources, embedded RAM, and extensive I/O in a compact BGA package. Its on-chip RAM and dedicated interconnect resources make it suitable for embedded controllers, interface logic, and SOPC-style integration.
For engineering teams targeting commercial embedded systems that require reconfigurability, board-level testability, and a compact footprint, this device delivers a clear combination of integration and flexibility backed by the FLEX 10K family architecture.
Request a quote or submit an inquiry to receive pricing and availability information for EPF10K30AFC484-3 and to discuss how this device can fit your project requirements.

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