EPF10K30AFC484-3

IC FPGA 246 I/O 484FBGA
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 246 12288 1728 484-BBGA

Quantity 250 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O246Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AFC484-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 246 12288 1728 484-BBGA

The EPF10K30AFC484-3 is a FLEX 10KA embedded programmable logic device from Intel, delivered in a 484-BBGA package for surface-mount applications. It combines a configurable logic array with embedded memory and a rich I/O set to support system-level integration in commercial embedded designs.

Designed for System-on-a-Programmable-Chip (SOPC) integration, this device targets applications that require moderate logic density, on-chip RAM, and flexible I/O at a 3.0–3.6 V supply and 0 °C to 70 °C operating range.

Key Features

  • Logic Capacity  Approximately 1,728 logic elements with 216 logic array blocks (LABs), enabling a range of medium-complexity combinational and sequential logic implementations.
  • Embedded Memory  Approximately 12,288 bits of on-chip RAM suitable for FIFOs, small data buffers, and state storage.
  • I/O and Voltage  Up to 246 user I/O pins with a specified voltage supply range of 3 V to 3.6 V for common 3.3 V systems.
  • Gate Count  Maximum system gates listed as 69,000, providing a reference for overall design capacity and integration scope.
  • Packaging and Mounting  484-ball BBGA package (supplier package: 484-FBGA, 23×23), surface-mount mounting type for compact PCB implementations.
  • Temperature and Grade  Commercial grade operation from 0 °C to 70 °C for mainstream embedded applications.
  • In-circuit Reconfigurability  Supports in-circuit reconfiguration via external configuration devices, intelligent controllers, or the JTAG port as documented for the FLEX 10K family.
  • System and Test Features  Built-in IEEE 1149.1 JTAG boundary-scan test circuitry and family-level features for SOPC integration, clock distribution options, and low-skew clock trees.
  • Interconnect and Arithmetic Support  FastTrack interconnect with dedicated carry and cascade chains to implement arithmetic and high-fan-in logic functions as used by family megafunctions.
  • Compliance  RoHS compliant.

Typical Applications

  • System Integration  SOPC and embedded system integration where on-chip memory and configurable logic reduce external component count.
  • Peripheral and Interface Logic  Glue logic, protocol bridging, and custom peripheral interfaces taking advantage of the device’s extensive I/O and configurable I/O features.
  • Memory and Buffering  On-chip RAM for small FIFOs, buffering, and data-path staging in embedded designs.
  • Prototyping and Custom Logic  Medium-density programmable logic for use in development platforms and custom control logic in commercial products.

Unique Advantages

  • Balanced Logic and Memory  Combines 1,728 logic elements with approximately 12,288 bits of embedded RAM to support mixed logic and storage requirements on a single device.
  • Flexible I/O  246 user I/O pins accommodate a wide range of external interfaces and signals without immediate need for external I/O expanders.
  • Compact, Board-Friendly Package  484-BBGA surface-mount package (23×23 FBGA footprint) maximizes board space efficiency for high-density PCBs.
  • In-System Reconfigurability  Supports multiple configuration methods including JTAG for field updates and design iteration without device removal.
  • Testability  Integrated IEEE 1149.1 boundary-scan simplifies board-level test and manufacturing validation.
  • Standards-Based Design Support  Family-level features and megafunction support streamline implementation of common functions and arithmetic via dedicated carry/cascade resources.

Why Choose EPF10K30AFC484-3?

The EPF10K30AFC484-3 positions itself as a commercially graded, medium-density FLEX 10KA FPGA for designs that need a balance of logic resources, embedded RAM, and extensive I/O in a compact BGA package. Its on-chip RAM and dedicated interconnect resources make it suitable for embedded controllers, interface logic, and SOPC-style integration.

For engineering teams targeting commercial embedded systems that require reconfigurability, board-level testability, and a compact footprint, this device delivers a clear combination of integration and flexibility backed by the FLEX 10K family architecture.

Request a quote or submit an inquiry to receive pricing and availability information for EPF10K30AFC484-3 and to discuss how this device can fit your project requirements.

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