EPF10K30AQC208-1N

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP

Quantity 557 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AQC208-1N – FLEX-10KA Field Programmable Gate Array (FPGA) IC, 208-BFQFP

The EPF10K30AQC208-1N is a FLEX 10KA family field programmable gate array (FPGA) in a 208-pin BFQFP package. It combines a logic array and embedded array blocks to implement general logic and memory-intensive megafunctions for commercial electronic designs.

Designed for mid-range integration, the device provides 1,728 logic elements, 12,288 bits of embedded RAM, and up to 147 user I/O pins while operating from a 3.0 V to 3.6 V supply at a commercial grade operating range of 0 °C to 70 °C.

Key Features

  • Core Architecture  FLEX 10KA family architecture with 1,728 logic elements and 216 logic array blocks (LABs) for implementing combinational and sequential logic.
  • Embedded Memory  12,288 total RAM bits of embedded memory suitable for on-chip buffers and small data structures.
  • I/O and Voltage  147 user I/O pins with MultiVolt I/O support; device operates from 3.0 V to 3.6 V and FLEX 10KA devices include 5.0-V tolerant input capability as documented for the family.
  • Programmability and Test  In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; includes JTAG boundary-scan circuitry compliant with IEEE Std. 1149.1-1990.
  • Clock and Timing  Built-in low-skew clock distribution trees with ClockLock and ClockBoost options (family features) and support for multiple global clock and clear signals.
  • Dedicated Arithmetic and Logic Chains  Dedicated carry and cascade chains in the fabric to implement adders, counters, comparators, and high-fan-in logic functions efficiently.
  • I/O Control Options  Per-pin tri-state output enable, open-drain option, and programmable output slew-rate control to help manage interface behavior and switching noise.
  • Package and Mounting  208-BFQFP (208-PQFP, 28 × 28 mm outline) surface-mount package for high-density PCB integration; RoHS compliant.
  • Power and Grade  Commercial grade device with typical low-power standby behavior reported for the family; supply range of 3.0 V–3.6 V.

Typical Applications

  • System Integration / SOPC  System-on-a-Programmable-Chip (SOPC) integration and glue logic where embedded memory and reconfigurable logic simplify board-level design.
  • Interface and Bus Bridging  Custom peripheral or bus interface logic, including PCI-compatible implementations supported by the FLEX 10K family.
  • Embedded Control and Glue Logic  Control functions, protocol handling, and timing-critical logic that benefit from dedicated carry/cascade chains and low-skew clock distribution.
  • Memory-Dependent Logic  Functions requiring on-chip buffers or small embedded storage using the device’s 12,288 bits of RAM.

Unique Advantages

  • Balanced Integration:  Combines 1,728 logic elements with 12,288 bits of embedded RAM to implement both logic and memory functions on a single device, reducing external component count.
  • Flexible I/O Support:  MultiVolt I/O and family support for 5.0-V tolerant inputs enable interfacing across common commercial voltage domains.
  • Reconfigurability and Testability:  In-circuit reconfigurability and IEEE 1149.1-compliant JTAG boundary-scan simplify configuration, debug, and production test flows.
  • Deterministic Timing Resources:  Low-skew clock trees, ClockLock/ClockBoost options, and dedicated arithmetic chains assist in meeting timing for performance-sensitive logic.
  • Compact Surface-Mount Package:  208-BFQFP (28 × 28 mm) package provides a high pin-count solution in a surface-mount form factor suitable for dense boards.
  • Regulatory Compliance:  RoHS-compliant construction supports modern manufacturing and environmental requirements.

Why Choose EPF10K30AQC208-1N?

The EPF10K30AQC208-1N offers a mid-range FLEX 10KA FPGA option for designers who need a combination of reconfigurable logic, embedded RAM, and substantial I/O in a commercial-grade, surface-mount package. Its family-level features—such as MultiVolt I/O, JTAG boundary-scan, embedded array blocks, and dedicated arithmetic chains—make it suitable for a wide range of commercial electronic designs requiring on-chip memory and flexible interfacing.

This device is well suited to teams developing system integration logic, custom interfaces, and memory-backed control functions where compact packaging, reprogrammability, and adherence to common supply and temperature ranges (3.0 V–3.6 V, 0 °C–70 °C) are important for product delivery and lifecycle support.

If you would like pricing, availability, or to request a quote for EPF10K30AQC208-1N, submit a quote request or inquiry and our team will respond with details to support your purchasing and integration planning.

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