EPF10K30AFC256-2

The EPF10K30AFC256-2 is a FLEX 10KA family field programmable gate array (FPGA) in a 256-ball BGA package designed for embedded programmable logic applications. It combines a mid-range logic capacity with embedded RAM and flexible I/O to support system-level integration and reconfigurable designs.

This device targets applications that require in-system configurability and compact board-level integration, offering a balance of logic resources, embedded memory, and a 3.0–3.6 V supply range for commercial-temperature systems.

Key Features

• Logic Capacity — Provides 1,728 logic elements and approximately 69,000 gates of logic, suitable for moderate-complexity control and glue-logic implementations.
• Embedded Memory — Includes 12,288 total RAM bits, enabling on-chip storage for state machines, FIFOs, and small data buffers without external memory.
• I/O and Interface — Offers 191 user I/O pins to support multiple peripheral interfaces and board-level connections while preserving flexibility in signal routing.
• Configuration and Test — Supports in-circuit reconfigurability via external configuration devices or JTAG; includes IEEE 1149.1 boundary-scan test circuitry for board-level testability.
• Power and Operating Range — Rated for a 3.0 V to 3.6 V supply and commercial operating temperature range of 0 °C to 70 °C, appropriate for standard commercial electronics.
• Package and Mounting — Supplied in a 256-FBGA (17 × 17) surface-mount package for dense board layouts and efficient PCB area usage.
• Compliance and Quality — RoHS compliant and 100% functionally tested as part of the FLEX 10K family quality practices.
• System Features from FLEX 10K Family — Family-level capabilities include embedded arrays for megafunctions, ClockLock and ClockBoost options, dedicated carry and cascade chains, and low-skew clock distribution trees.

Typical Applications

• System Integration and SOPC — Implement system-on-a-programmable-chip functions and consolidate glue logic, peripheral interfaces, and control functions on a single device.
• Interface and Bridge Logic — Use the extensive I/O count to implement protocol translators, bus interfaces, and board-level glue for mixed-signal or mixed-voltage systems.
• Embedded Control and State Machines — Leverage the on-chip RAM and logic elements for finite-state controllers, sequencers, and small embedded processing tasks.
• Prototyping and Development — Suitable for iterative hardware design and in-circuit reconfiguration during development and validation phases.

Unique Advantages

• Balanced Logic and Memory: Combines 1,728 logic elements with 12,288 bits of embedded RAM to handle moderate logic density and local storage without external components.
• High I/O Count: 191 user I/O pins provide connectivity for multiple peripherals and board-level interfaces, reducing the need for additional I/O expanders.
• Compact BGA Package: 256-FBGA (17×17) package enables board area savings and supports dense PCB layouts for space-constrained designs.
• Designed for In-System Flexibility: In-circuit reconfigurability and JTAG boundary-scan support facilitate field updates and board-level testing.
• Commercial Temperature and Standard Voltage: Operates across a 3.0–3.6 V supply range and 0 °C to 70 °C, aligning with common commercial electronic product requirements.
• Family-Level Design Support: Part of the FLEX 10K family, which includes architectural features such as dedicated carry/cascade chains and clock management options for predictable timing and arithmetic efficiency.

Why Choose EPF10K30AFC256-2?

The EPF10K30AFC256-2 is positioned for designers who need a mid-range, reconfigurable logic device that balances logic elements, embedded memory, and a substantial I/O footprint in a compact BGA package. Its FLEX 10KA family features—such as in-circuit reconfigurability, built-in test support, and dedicated routing resources—help simplify board-level integration and speed development cycles.

This device suits commercial embedded systems, interface consolidation, and prototype-to-production workflows where moderate logic capacity, on-chip RAM, and flexible I/O deliver practical integration and design agility. Family-level toolchain and architecture support further enhance scalability and maintainability across related FLEX 10K designs.

Request a quote or submit your project details to receive pricing and availability information for the EPF10K30AFC256-2.