EPF10K30ABC356-2

The EPF10K30ABC356-2 is a FLEX-10KA family embedded programmable logic device optimized for system-level integration. It combines a logic array and embedded memory blocks to implement megafunctions, glue logic, and user-defined digital functions for commercial applications.

With 1,728 logic elements, approximately 12,288 bits of on-chip RAM, up to 246 user I/O pins and a 356-LBGA package, this device targets designs that require integrated programmable logic, flexible I/O and on-chip memory within a commercial temperature range.

Key Features

• Core Logic  1,728 logic elements arranged across 216 logic array blocks for implementing combinational and sequential user logic.
• Embedded Memory  Approximately 12,288 total RAM bits provided by embedded array blocks for local storage and megafunction implementation.
• Gate Density  Typical and system gate counts consistent with the FLEX 10K family, with this device specifying 69,000 gates.
• I/O Capacity  246 user I/O pins to support broad interfacing requirements from external peripherals and buses.
• Power and Supply  Operates from a 3.0 V to 3.6 V supply, suitable for 3.3 V system domains.
• Package and Mounting  Surface-mount 356-LBGA package (356-BGA, 35×35) for board-space-efficient integration.
• Commercial Temperature Grade  Specified for 0 °C to 70 °C operating temperature.
• Embedded System Features  Family-level capabilities include in-circuit reconfigurability (ICR), JTAG boundary-scan compliant with IEEE Std. 1149.1-1990, and options such as ClockLock and ClockBoost for advanced clocking control.
• Flexible Interconnect and Arithmetic Support  FastTrack continuous routing, dedicated carry and cascade chains support efficient implementation of adders, counters and high-fan-in logic.
• Low-Power Standby  Family data indicates low standby current (typical specification less than 0.5 mA for most devices), enabling lower-power system states.
• RoHS Compliant  Device is RoHS-compliant for regulatory and environmental alignment.

Typical Applications

• System Integration and SOPC  Implement embedded megafunctions, glue logic and system-on-a-programmable-chip (SOPC) functions using the device’s combined logic array and embedded memory blocks.
• Peripheral and I/O Subsystems  Use the 246 I/O pins to interface with complex peripheral buses and external devices in commercial electronic products.
• On-Board Memory and Buffers  Leverage the embedded RAM blocks for local buffering, FIFOs or small data stores within data-path and control logic.
• Boundary-Scan Test and In-System Reconfiguration  Use the IEEE 1149.1 JTAG boundary-scan and in-circuit reconfiguration to simplify board-level test and field updates.

Unique Advantages

• Balanced Logic and Memory  Combines 1,728 logic elements with approximately 12,288 bits of embedded memory for compact implementation of control and storage functions.
• High I/O Count in a Compact Package  246 I/O pins in a 356-LBGA (35×35) package reduce PCB routing overhead while preserving interface density.
• Commercial-Grade Reliability  Specified for 0 °C to 70 °C operation and RoHS compliance for commercial deployments.
• System-Level Features  JTAG boundary-scan and in-circuit reconfiguration enable streamlined testing and field upgrades without consuming device logic.
• Efficient Arithmetic and High-Fan-In Logic  Dedicated carry and cascade chains accelerate implementation of adders, counters and complex logic structures for deterministic performance.
• Flexible Clocking  ClockLock and ClockBoost options (family-level features) provide enhanced clock management for reduced skew and clock multiplication where required.

Why Choose EPF10K30ABC356-2?

The EPF10K30ABC356-2 offers a practical combination of programmable logic, embedded memory and a high I/O count in a compact 356-LBGA package, making it well suited for commercial embedded designs that require on-chip megafunctions, flexible interfacing and in-system configurability. Its family-level features—such as JTAG boundary-scan, in-circuit reconfiguration and dedicated arithmetic chains—help reduce external components and simplify board-level testing and updates.

This device is ideal for engineering teams designing commercial electronics that need scalable logic capacity, integrated RAM for local data storage, and a board-friendly package format, backed by the FLEX 10K family’s system-oriented features.

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