EPF10K30A3NTI144-3
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP |
|---|---|
| Quantity | 1,075 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30A3NTI144-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP
The EPF10K30A3NTI144-3 is a FLEX-10KA family FPGA offering reprogrammable logic and embedded memory for system-level integration. Built around an array of 1,728 logic elements and 12,288 bits of embedded RAM, this device targets applications requiring on-chip memory, flexible I/O and in-circuit reconfigurability.
With up to 102 user I/O pins, surface-mount packaging and industrial operating range, the device suits embedded designs that need configurable logic, megafunction implementation and robust supply/temperature margins.
Key Features
- Logic Capacity — 1,728 logic elements organized across 216 logic array blocks for implementing combinational and sequential logic.
- Embedded Memory — Approximately 12,288 bits of on-chip RAM for buffering, small FIFOs and simple memory structures without external components.
- I/O and System Integration — 102 user I/O pins with programmable output slew-rate control, individual tri-state control and options for open-drain operation.
- Package and Mounting — 144-LQFP surface-mount package (supplier device package: 144-TQFP, 20×20) for standard board assembly processes.
- Supply and Temperature — Operates from 3 V to 3.6 V and specified for industrial temperatures from −40 °C to 85 °C.
- Series-Level System Features — FLEX 10K/10KA family capabilities including embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, and JTAG boundary-scan support.
- Reconfiguration and Clock Options — In-circuit reconfigurability via external configuration device or JTAG; series features include ClockLock and ClockBoost options and low-skew clock distribution trees.
- Compliance and Mounting — RoHS compliant and supplied in a surface-mount package suitable for industrial applications.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) — Integrate custom logic and megafunctions on-chip to consolidate system functions and reduce board-level component count.
- Embedded Memory and Buffering — Use the on-chip RAM for small data buffers, FIFOs or scratch memory to improve system responsiveness without external SRAM.
- Peripheral and Bus Interfaces — Implement protocol bridges, custom peripheral interfacing or PCI-compatible logic leveraging the series support for PCI Local Bus and flexible I/O.
- Prototyping and In-Circuit Reconfiguration — Modify logic in-circuit using external configuration devices or JTAG for iterative development and field updates.
Unique Advantages
- Compact Logic-plus-Memory Integration: 1,728 logic elements combined with 12,288 bits of embedded RAM reduce dependence on external memory and simplify board design.
- Flexible I/O for Mixed Systems: 102 user I/O pins with programmable output characteristics enable interfacing with a wide range of digital peripherals.
- Industrial Temperature Range: Rated for −40 °C to 85 °C, supporting deployment in industrial environments.
- In-Circuit Reconfigurability: Support for JTAG-based configuration and external configuration devices allows field updates and iterative design changes without hardware replacement.
- Series-Proven Architectural Features: FastTrack interconnect, dedicated carry/cascade chains and low-skew clock distribution from the FLEX 10K/10KA family help simplify implementation of arithmetic and high-fan-in functions.
- RoHS Compliant Packaging: Surface-mount 144-LQFP (supplier 144-TQFP, 20×20) meets modern environmental and assembly requirements.
Why Choose EPF10K30A3NTI144-3?
The EPF10K30A3NTI144-3 positions itself as a practical choice for designers needing mid-density FPGA resources with embedded memory and flexible I/O in an industrial-rated package. Its combination of 1,728 logic elements, approximately 12 Kbits of RAM and 102 I/O pins provides a balanced platform for SOPC integration, peripheral bridging and in-field reconfiguration.
Backed by the FLEX 10K/10KA family architecture and series-level features such as FastTrack interconnect, dedicated arithmetic chains and JTAG support, the device delivers predictable implementation characteristics and design flexibility for a range of embedded applications.
Request a quote or submit a pricing inquiry to evaluate EPF10K30A3NTI144-3 for your next design and confirm availability and lead times.

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