EPF10K30A3NTI144-3

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP

Quantity 1,075 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30A3NTI144-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 12288 1728 144-LQFP

The EPF10K30A3NTI144-3 is a FLEX-10KA family FPGA offering reprogrammable logic and embedded memory for system-level integration. Built around an array of 1,728 logic elements and 12,288 bits of embedded RAM, this device targets applications requiring on-chip memory, flexible I/O and in-circuit reconfigurability.

With up to 102 user I/O pins, surface-mount packaging and industrial operating range, the device suits embedded designs that need configurable logic, megafunction implementation and robust supply/temperature margins.

Key Features

  • Logic Capacity — 1,728 logic elements organized across 216 logic array blocks for implementing combinational and sequential logic.
  • Embedded Memory — Approximately 12,288 bits of on-chip RAM for buffering, small FIFOs and simple memory structures without external components.
  • I/O and System Integration — 102 user I/O pins with programmable output slew-rate control, individual tri-state control and options for open-drain operation.
  • Package and Mounting — 144-LQFP surface-mount package (supplier device package: 144-TQFP, 20×20) for standard board assembly processes.
  • Supply and Temperature — Operates from 3 V to 3.6 V and specified for industrial temperatures from −40 °C to 85 °C.
  • Series-Level System Features — FLEX 10K/10KA family capabilities including embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, and JTAG boundary-scan support.
  • Reconfiguration and Clock Options — In-circuit reconfigurability via external configuration device or JTAG; series features include ClockLock and ClockBoost options and low-skew clock distribution trees.
  • Compliance and Mounting — RoHS compliant and supplied in a surface-mount package suitable for industrial applications.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate custom logic and megafunctions on-chip to consolidate system functions and reduce board-level component count.
  • Embedded Memory and Buffering — Use the on-chip RAM for small data buffers, FIFOs or scratch memory to improve system responsiveness without external SRAM.
  • Peripheral and Bus Interfaces — Implement protocol bridges, custom peripheral interfacing or PCI-compatible logic leveraging the series support for PCI Local Bus and flexible I/O.
  • Prototyping and In-Circuit Reconfiguration — Modify logic in-circuit using external configuration devices or JTAG for iterative development and field updates.

Unique Advantages

  • Compact Logic-plus-Memory Integration: 1,728 logic elements combined with 12,288 bits of embedded RAM reduce dependence on external memory and simplify board design.
  • Flexible I/O for Mixed Systems: 102 user I/O pins with programmable output characteristics enable interfacing with a wide range of digital peripherals.
  • Industrial Temperature Range: Rated for −40 °C to 85 °C, supporting deployment in industrial environments.
  • In-Circuit Reconfigurability: Support for JTAG-based configuration and external configuration devices allows field updates and iterative design changes without hardware replacement.
  • Series-Proven Architectural Features: FastTrack interconnect, dedicated carry/cascade chains and low-skew clock distribution from the FLEX 10K/10KA family help simplify implementation of arithmetic and high-fan-in functions.
  • RoHS Compliant Packaging: Surface-mount 144-LQFP (supplier 144-TQFP, 20×20) meets modern environmental and assembly requirements.

Why Choose EPF10K30A3NTI144-3?

The EPF10K30A3NTI144-3 positions itself as a practical choice for designers needing mid-density FPGA resources with embedded memory and flexible I/O in an industrial-rated package. Its combination of 1,728 logic elements, approximately 12 Kbits of RAM and 102 I/O pins provides a balanced platform for SOPC integration, peripheral bridging and in-field reconfiguration.

Backed by the FLEX 10K/10KA family architecture and series-level features such as FastTrack interconnect, dedicated arithmetic chains and JTAG support, the device delivers predictable implementation characteristics and design flexibility for a range of embedded applications.

Request a quote or submit a pricing inquiry to evaluate EPF10K30A3NTI144-3 for your next design and confirm availability and lead times.

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