EPF10K250AGC599-3

The EPF10K250AGC599-3 is a commercial-grade FLEX-10K® field programmable gate array (FPGA) in a 599-BCPGA through-hole package. It delivers a balanced combination of programmable logic, on-chip RAM and a high I/O count for mid-range custom digital designs.

With 12,160 logic elements, approximately 40,960 bits of embedded RAM and 470 I/O pins, this device targets applications that require moderate logic density, substantial I/O connectivity and board-level robustness provided by a through-hole 599-BCPGA package.

Key Features

• Core Logic 12,160 logic elements and approximately 310,000 gates for implementing custom digital functions and state machines.
• Embedded Memory Approximately 40,960 bits of on-chip RAM to support small FIFOs, buffers and temporary data storage.
• I/O Density 470 user I/O pins suitable for designs that require large numbers of external interfaces or parallel connections.
• Package and Mounting 599-BCPGA package in a through-hole mounting format; supplier device package listed as 599-CPGA (62.48 × 62.48 mm) for board-level integration.
• Power Single-supply operation from 3 V to 3.6 V to match common system power rails.
• Operating Range Commercial temperature rating with an operating range of 0 °C to 70 °C.
• Environmental Compliance RoHS compliant for alignment with lead-free manufacturing and regulatory requirements.

Typical Applications

• I/O-Intensive Interface Modules High pin count (470 I/O) enables protocol bridging, bus expansion and glue-logic functions between multiple subsystems.
• Custom Digital Controllers Moderate logic density and on-chip RAM support control logic, sequencing and local buffering for embedded systems.
• Prototyping and Development Boards Through-hole 599-BCPGA packaging and flexible programmable logic make the device suitable for board-level prototypes and development platforms.

Unique Advantages

• Balanced Logic and Memory: 12,160 logic elements combined with embedded RAM provide sufficient resources for a wide range of mid-range designs without unnecessary overhead.
• Extensive I/O Capacity: 470 I/O pins reduce the need for external I/O expanders and simplify system-level wiring for multi-signal interfaces.
• Robust Board Integration: Through-hole 599-BCPGA package offers secure mounting and predictable mechanical retention for board environments that benefit from through-hole components.
• Standard Power and Temperature Requirements: Operates on a 3 V–3.6 V supply and a 0 °C–70 °C commercial range, making it straightforward to integrate into common electronic systems.
• Regulatory Alignment: RoHS compliance supports lead-free manufacturing processes and regulatory conformity.

Why Choose EPF10K250AGC599-3?

The EPF10K250AGC599-3 offers a practical mix of programmable logic, embedded RAM and high I/O density in a through-hole 599-BCPGA package, making it well suited for mid-range custom digital applications, interface-heavy modules and board-level prototypes. Its commercial-grade temperature range and 3 V–3.6 V supply compatibility simplify integration into standard electronic systems.

Choose this FPGA when you need a cost-conscious, RoHS-compliant programmable device that delivers significant I/O capacity and moderate logic/memory resources for flexible hardware implementation and rapid design iteration.

Request a quote or submit a parts inquiry to receive pricing and availability for the EPF10K250AGC599-3.