EPF6010ATC100-2

IC FPGA 71 I/O 100TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 71 880 100-TQFP

Quantity 1,296 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-TQFPNumber of I/O71Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs88Number of Logic Elements/Cells880
Number of Gates10000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6010ATC100-2 – FLEX 6000 Field Programmable Gate Array (FPGA), 71 I/O, 100‑TQFP

The EPF6010ATC100-2 is a FLEX 6000 family FPGA offered in a 100‑pin TQFP (14×14) surface-mount package. It uses a register-rich, look-up table (LUT) based OptiFLEX architecture and is positioned as a low-cost, reprogrammable alternative for gate-array and prototyping applications.

With 880 logic elements and approximately 10,000 typical gates, this commercial-grade device targets designs that require flexible logic integration, in-circuit reconfigurability, and mixed-voltage I/O support within a 3.0–3.6 V supply envelope and a 0 °C to 85 °C operating range.

Key Features

  • Core architecture: Register-rich LUT-based OptiFLEX architecture delivering approximately 10,000 typical gates implemented as 880 logic elements for compact, reprogrammable logic designs.
  • I/O capability: 71 available I/O pins with individual tri-state control and programmable output slew-rate control for reduced switching noise and flexible interfacing.
  • Configuration & test: Supports in-circuit reconfigurability (ICR) via an external configuration device or intelligent controller and includes IEEE 1149.1 JTAG boundary-scan circuitry without consuming user logic.
  • Interconnect & arithmetic support: Dedicated carry and cascade chains and a continuous routing structure for predictable interconnect delays and efficient implementation of arithmetic and high-fan-in logic.
  • Supply & thermal: Operates from 3.0 V to 3.6 V and is specified for commercial operation from 0 °C to 85 °C; suitable for 3.3 V system deployments.
  • Package & mounting: Surface-mount 100‑TQFP (14×14) package, enabling compact board-level integration.
  • Standards & compliance: RoHS compliant.
  • Development ecosystem: Supported by Altera/FLEX 6000 family design tools and common industry EDA tool flows for design entry, synthesis, and place-and-route.

Typical Applications

  • Gate-array replacement and low-volume production: Use as a programmable alternative to fixed gate-array designs to reduce NRE and enable late-stage design changes.
  • Prototyping and design testing: Reprogrammability and in-circuit configuration allow rapid iteration during prototyping and validation cycles.
  • Mixed-voltage interfacing: MultiVolt I/O capability enables bridging between systems operating at different logic levels for flexible system integration.
  • Glue logic and control functions: Implement custom glue logic, interfaces, and control functions where moderate density (880 logic elements) and up to 71 I/O pins meet system requirements.

Unique Advantages

  • Reprogrammable flexibility: In-circuit reconfigurability and LUT-based architecture let teams iterate designs without replacing silicon.
  • Compact logic density: 880 logic elements and about 10,000 typical gates provide a balanced density for replacing small gate-array designs or consolidating discrete logic.
  • Robust test and debug support: Built-in IEEE 1149.1 JTAG boundary-scan enables board-level test and device debug without consuming user logic.
  • Predictable arithmetic and routing: Dedicated carry and cascade chains plus continuous routing support efficient implementation of adders, counters, and high-fan-in logic.
  • Industry tool support: Integration with Altera/FLEX toolchains and common EDA flows speeds design entry, simulation, and place-and-route.
  • Regulatory and environmental readiness: RoHS compliance supports modern assembly and environmental requirements.

Why Choose EPF6010ATC100-2?

The EPF6010ATC100-2 combines the FLEX 6000 family’s OptiFLEX LUT architecture with a practical pin count and package footprint for compact, reprogrammable logic implementations. Its balance of 880 logic elements, 71 I/O pins, and in-circuit reconfigurability makes it well suited for teams seeking a low-cost programmable alternative to gate-array designs, rapid prototyping, or flexible interface logic within commercial temperature environments.

Backed by family-level tool support and on-chip test features like IEEE 1149.1 boundary-scan, this device offers a dependable platform for designs that require iterative development and board-level testability while maintaining a small PCB footprint in a 100‑TQFP surface-mount package.

Request a quote or submit an inquiry to check availability and pricing for the EPF6010ATC100-2 and to learn how it can fit into your next design.

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