EPF6010AFC256-3

IC FPGA 171 I/O 256FBGA
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 880 256-BGA

Quantity 999 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs88Number of Logic Elements/Cells880
Number of Gates10000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/A

Overview of EPF6010AFC256-3 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 880 256-BGA

The EPF6010AFC256-3 is a FLEX 6000 series FPGA offering a register-rich, LUT-based architecture (OptiFLEX) for reprogrammable logic in commercial applications. It targets low-cost gate-array replacements, prototyping and design testing where in-circuit reconfigurability and flexible I/O are required.

Key on-chip resources include 880 logic elements and approximately 10,000 typical gates, a built-in low-skew clock distribution tree, and support for JTAG boundary-scan. The device ships in a 256-ball BGA (17×17) package and is RoHS compliant.

Key Features

  • Core architecture  Register-rich, LUT-based OptiFLEX architecture designed to increase device area efficiency and support fast design changes.
  • Logic capacity  880 logic elements and approximately 10,000 typical gates suitable for compact programmable logic designs.
  • I/O and interfacing  171 I/O pins with individual tri-state output enable control and programmable output slew-rate to manage signal integrity.
  • In-system configurability  In-circuit reconfigurability (ICR) via external configuration device or intelligent controller for iterative prototyping and field updates.
  • Testability and tools  Built-in JTAG boundary-scan test (IEEE Std. 1149.1-1990) and 100% functional device testing reduce board-level debug time.
  • Clock and arithmetic support  Built-in low-skew clock distribution and dedicated carry/cascade chains for efficient implementation of adders, counters and high-fan-in logic.
  • Interconnect  FastTrack continuous routing structure for predictable interconnect delays and automatic use of dedicated chains by design tools.
  • Package and assembly  256-ball BGA (256-FBGA, 17×17) surface-mount package for compact PCB footprints and high pin density.
  • Power & voltage  Supply voltage range 3 V to 3.6 V; commercial-grade operation across 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Prototyping & design validation  Use the device for rapid iteration and functional testing of logic designs with in-circuit reconfiguration and JTAG support.
  • Low-cost gate-array replacement  Replace fixed gate-array parts with a reprogrammable solution to enable late-stage changes and reduce NRE risk.
  • Interface bridging  Implement glue logic and voltage-domain bridging using flexible I/O and programmable output slew control.
  • Control and sequencing logic  Implement compact control functions, state machines, and arithmetic operations using the device’s logic elements and dedicated chains.

Unique Advantages

  • Reconfigurability for fast iteration: In-circuit reconfiguration lets you update functionality without replacing hardware, speeding prototyping and field fixes.
  • Compact, efficient architecture: OptiFLEX and LUT-based design delivers area efficiency that supports competitive gate counts in a small package.
  • Proven testability: 100% functional testing and integrated JTAG boundary-scan reduce board bring-up time and simplify production test.
  • Predictable timing and arithmetic support: Low-skew global paths plus dedicated carry and cascade chains simplify implementation of timing-sensitive logic and arithmetic units.
  • High I/O density in a compact package: 171 I/O pins in a 256-ball FBGA (17×17) enable dense signal routing while minimizing PCB area.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial designs.

Why Choose EPF6010AFC256-3?

The EPF6010AFC256-3 is positioned for design teams seeking a reprogrammable, commercially graded FPGA that balances logic capacity, I/O density, and board-level testability. Its OptiFLEX architecture, dedicated arithmetic chains, and comprehensive JTAG support make it suitable for prototyping, low-cost gate-array replacement, and compact control logic implementations.

Supported by Altera’s development tool ecosystem and automatic place-and-route flows, the device is aimed at engineers who need fast design iteration, predictable routing, and a compact BGA footprint for space-constrained PCBs.

Request a quote or submit an RFQ for the EPF6010AFC256-3 to get pricing, availability, and lead-time information for your next design.

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