EPF10K70RC240-4N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 18432 3744 240-BFQFP Exposed Pad

Quantity 4 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs468Number of Logic Elements/Cells3744
Number of Gates118000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of EPF10K70RC240-4N – FLEX-10K Field Programmable Gate Array, 240‑BFQFP (Exposed Pad)

The EPF10K70RC240-4N is a FLEX 10K family field programmable gate array (FPGA) from Intel, delivered in a 240-pin BFQFP package with an exposed pad. It combines a dedicated logic array and embedded memory resources to implement megafunctions and general-purpose logic for embedded and system-level integration.

Targeted for commercial applications, this device operates from a 4.75 V to 5.25 V supply and supports in-circuit reconfigurability and JTAG boundary-scan for flexible development and testing workflows.

Key Features

  • Logic Capacity – 3,744 logic elements with an available gate budget of 118,000 gates, providing substantial programmable logic resource for medium-complexity designs.
  • Logic Array Blocks (LABs) – 468 LABs for structured placement of logic functions and predictable routing.
  • Embedded Memory – 18,432 bits of total on-chip RAM (approximately 18 Kbits) suitable for implementing buffers, FIFOs, and other megafunction memory needs.
  • I/O and Package – 189 user I/O pins in a surface-mount 240‑BFQFP exposed pad package (supplier package: 240‑RQFP, 32×32), enabling dense board integration and thermal anchoring via the exposed pad.
  • Supply and Operating Range – Designed for 5.0-V systems with a specified supply range of 4.75 V to 5.25 V and commercial operating temperature from 0 °C to 70 °C.
  • Reconfiguration and Test – Supports in-circuit reconfigurability via external configuration devices or JTAG; includes IEEE Std. 1149.1-compliant boundary-scan (JTAG) circuitry for board-level test access.
  • Family-Level System Features – FLEX 10K family functions such as dedicated carry and cascade chains, low-skew clock distribution, and options for clock delay/skew control are available on this device family.
  • RoHS Compliant – Device is RoHS compliant for lead-free assembly processes.

Typical Applications

  • Embedded System Integration – Implement SOPC-style functions and custom control logic where embedded memory and reconfigurable logic reduce external component count.
  • Interface and Glue Logic – Bridge between legacy and modern interfaces or consolidate discrete logic into a single programmable device using abundant I/O and LAB resources.
  • Memory-Intensive Megafunctions – Use the device’s embedded RAM for FIFOs, small buffers, and other localized storage needs within custom datapaths.
  • Prototyping and Development – Leverage in-circuit reconfigurability and JTAG boundary-scan to iterate hardware designs and validate board-level interconnects.

Unique Advantages

  • Substantial Logic Density: 3,744 logic elements and 118,000 gates enable compact implementation of medium-complexity systems without partitioning across multiple devices.
  • Integrated Memory Resources: 18,432 bits of on-chip RAM reduce the need for small external memories and simplify datapath design.
  • Flexible Packaging: 240‑BFQFP with exposed pad offers a high pin count and thermal benefit for board-level assembly while maintaining a compact footprint.
  • Development and Test Friendly: JTAG boundary-scan and support for in-circuit reconfiguration streamline debugging, production test, and iterative development cycles.
  • Commercial Supply Compatibility: 5.0-V supply range (4.75–5.25 V) aligns with common commercial digital systems and power rails.

Why Choose EPF10K70RC240-4N?

The EPF10K70RC240-4N positions itself as a flexible, mid-density FPGA solution for designers who need integrated memory, a substantial number of logic elements, and a high pin count in a commercial-grade device. Its family-level features—including dedicated carry/cascade chains, low-skew clock distribution, and support for in-circuit reconfiguration—help accelerate implementation of system-level functions and megafunctions.

This device is well suited to teams building embedded systems, interface logic, and prototype platforms that require on-chip RAM, robust testability via JTAG, and a 5.0‑V supply domain. Combined with available software design support for the FLEX 10K family, it provides a practical path from concept to production for commercial applications.

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