EPF10K70RC240-3

The EPF10K70RC240-3 is a FLEX 10K family field-programmable gate array (FPGA) designed for commercial embedded programmable logic applications. It combines a logic array and embedded array blocks to support System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as efficient on-chip memory and specialized logic.

With 3,744 logic elements and 468 LABs, approximately 18,432 bits of embedded RAM, and 189 user I/O pins, this device targets designs that require moderate logic density, on-chip memory, flexible I/O and in-circuit reconfigurability while operating from a 4.75 V to 5.25 V supply.

Key Features

• FLEX 10K architecture  Embedded programmable-logic family architecture that separates an embedded array for megafunctions and a logic array for general logic functions, enabling SOPC integration.
• Logic capacity  3,744 logic elements (468 LABs) with a maximum system gates rating of 118,000, providing substantial combinational and sequential logic resources for mid-density designs.
• On-chip memory  Approximately 18,432 bits of embedded RAM across EABs to implement buffers, small memories or other megafunctions without consuming general logic.
• I/O flexibility  189 user I/O pins with family-level I/O features including individual tri-state control, open-drain option and programmable output slew-rate for adaptable interfacing (features described at the family level in the datasheet).
• Configuration and test  In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port and built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990.
• Clocking and interconnect  Family features include low-skew clock distribution, ClockLock/ClockBoost options and FastTrack interconnect with dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic functions (family-level capabilities).
• Power and supply  Designed for 5 V operation with a specified voltage supply range of 4.75 V to 5.25 V.
• Package and mounting  240-pin BFQFP with exposed pad (supplier package: 240-RQFP 32×32), surface-mount mounting type and commercial grade operating temperature from 0 °C to 70 °C.
• Environmental compliance  RoHS compliant.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) integration  Implement megafunctions and custom system logic where embedded arrays and logic arrays are combined to reduce external components.
• Bus and interface bridging  Use the device’s configurable I/O and family-level peripheral support to implement custom bus logic and interface translation for mid-density designs.
• On-chip memory functions  Leverage the approximately 18,432 bits of embedded RAM for small buffers, FIFOs or table storage without consuming logic elements.
• In-circuit configurable designs  Applications that benefit from in-field reconfiguration or JTAG-based configuration and boundary-scan test capabilities.

Unique Advantages

• Balanced logic and memory resources: 3,744 logic elements paired with embedded RAM provide designers the flexibility to implement both control and memory-intensive functions on a single device.
• Flexible I/O and interfacing: 189 user I/O pins and family-level I/O features simplify integration with external peripherals and custom signaling requirements.
• Reconfigurable in-system: In-circuit reconfigurability and JTAG boundary-scan support enable iterative development, field updates and manufacturing test without consuming device logic.
• Package choices for board-level design: 240-BFQFP with exposed pad and surface-mount mounting support compact board layouts while providing thermal and mechanical compatibility for commercial designs.
• RoHS compliance: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose EPF10K70RC240-3?

The EPF10K70RC240-3 delivers a practical combination of logic density, embedded memory and flexible I/O in a commercial-grade FLEX 10K FPGA package. Its family-level features—such as in-circuit reconfigurability, JTAG boundary-scan, dedicated arithmetic chains and configurable clocking—make it well suited for applications that require system integration, on-chip megafunctions and iterative development.

This device is ideal for design teams seeking mid-range FPGA resources with explicit 5 V supply support, surface-mount packaging, and commercial temperature operation. Its mix of LEs, LABs and embedded RAM provides a scalable option for embedded control, interface logic and SOPC-style integration while maintaining environmental compliance.

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