EPF10K50VRI240-4
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 374 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VRI240-4 – FLEX-10K® Field Programmable Gate Array (FPGA), 2,880 LEs, 20,480‑bit RAM, 240‑BFQFP
The EPF10K50VRI240-4 is an Intel FLEX-10K® family FPGA offered in a 240‑pin BFQFP exposed‑pad surface‑mount package. It combines a mid-range logic resource set with embedded memory and flexible I/O to support industrial applications requiring on‑chip programmable logic and system integration.
Built for industrial temperature operation and RoHS compliance, this device is suited for designs that need approximately 2,880 logic elements, 20,480 bits of embedded RAM, and a broad I/O complement while operating from a 3.0–3.6 V supply.
Key Features
- Core & Logic — Approximately 2,880 logic elements and up to 116,000 system gates provide mid‑range programmable logic capacity for custom control and glue‑logic functions.
- Logic Array Blocks (LABs) — 360 LABs enable structured placement of logic for predictable resource allocation and partitioning.
- Embedded Memory — Approximately 20,480 bits of on‑chip RAM suitable for small buffers, FIFOs, and state storage without external memory.
- I/O Capability — 189 user I/O pins provide flexible interfacing to peripherals, sensors, and external logic while supporting common board‑level topologies.
- Power & Voltage — Single supply operation from 3.0 V to 3.6 V matches standard 3.3 V system rails for straightforward power integration.
- Package & Mounting — 240‑BFQFP exposed pad (supplier package 240‑RQFP, 32×32) in a surface‑mount form factor simplifies board assembly and thermal conduction to PCB.
- Temperature & Grade — Industrial grade operation across −40 °C to 85 °C for deployment in factory, plant, and commercial industrial environments.
- Test & Configuration Support (Family Level) — FLEX 10K family devices include JTAG boundary‑scan test circuitry and in‑circuit reconfigurability options to aid debugging and production testing.
Typical Applications
- Industrial Control — Deterministic programmable logic for motor control, sequencing, and machine‑level I/O aggregation within industrial temperature ranges.
- Embedded System Integration — On‑chip RAM and logic resources make the device suitable for consolidating glue logic, protocol bridging, and custom peripheral interfaces.
- Prototyping & Development — Reconfigurable FPGA fabric supports iterative hardware development and system prototyping before ASIC transition or as a permanent programmable solution.
- Data Path & Peripheral Handling — Useful for implementing small buffers, serializers/ deserializers, and timing control where compact on‑chip memory and multiple I/O are required.
Unique Advantages
- Balanced logic and memory mix: Combines ~2,880 logic elements with ~20,480 bits of embedded RAM to implement control logic alongside small data buffers without external memory.
- Industrial temperature rating: Specified operation from −40 °C to 85 °C for reliable performance in demanding industrial environments.
- 3.3 V‑class supply compatibility: 3.0–3.6 V supply simplifies integration into standard 3.3 V systems and power rails.
- Exposed‑pad BFQFP package: 240‑pin surface‑mount package with exposed pad supports board‑level thermal management and dense I/O routing.
- Production and test support: Family features such as JTAG boundary‑scan and in‑circuit reconfigurability support manufacturing test, field updates, and debugging.
Why Choose EPF10K50VRI240-4?
The EPF10K50VRI240-4 delivers a practical combination of logic density, embedded RAM, and I/O count in a compact 240‑pin BFQFP package targeted at industrial and embedded designs. Its operating range, package style, and family‑level configuration and test features make it a fitting choice for customers implementing mid‑range programmable logic, peripheral interfacing, and system consolidation tasks.
This part is well suited to development teams and procurement engineers seeking a flexible, reconfigurable device that aligns with common 3.3 V system architectures and industrial temperature requirements while retaining on‑chip memory and structured logic resources for efficient board‑level integration.
If you would like pricing, availability, or to request a formal quote for EPF10K50VRI240-4, submit your inquiry and our team will respond with detailed ordering information and lead‑time options.

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