EPF10K50VRI240-3

The EPF10K50VRI240-3 is a FLEX-10K family FPGA optimized for mid-density embedded logic and system integration. It combines a dense logic array, on-chip embedded memory, and flexible I/O in a 240-pin exposed-pad surface-mount package for industrial applications.

Typical use cases include system-on-a-programmable-chip (SOPC) integration, on-board protocol and interface logic, and embedded control functions where moderate logic capacity, embedded RAM, and robust thermal/voltage tolerances are required.

Key Features

• Logic Capacity  2,880 logic elements organized across 360 logic array blocks, supporting a maximum system gate count of 116,000 for complex user logic implementation.
• Embedded Memory  20,480 bits of on-chip RAM delivered via embedded array blocks to implement buffers, FIFOs, and small data stores without external memory.
• I/O and Connectivity  189 user I/O pins providing flexible external interfacing for peripherals, sensors, and bus connections; per-pin output control options are supported by the FLEX 10K architecture.
• Power Supply  Operates from a 3.0 V to 3.6 V supply range suitable for 3.3 V system domains.
• Package & Mounting  240-pin BFQFP with exposed pad (supplier package: 240-RQFP 32×32) in a surface-mount form factor for PCB-level thermal dissipation and compact board designs.
• Industrial Temperature Range  Rated for −40 °C to 85 °C operation, aligning with industrial environments and embedded control applications.
• System Features  In-circuit reconfigurability via external configuration device or JTAG boundary-scan (IEEE 1149.1) is supported; on-chip resources include dedicated carry and cascade chains and clock distribution options referenced in the FLEX 10K family documentation.
• Compliance  RoHS-compliant construction supports environmentally conscious assembly and regulatory requirements.

Typical Applications

• Embedded Control & Industrial Automation  Use the EPF10K50VRI240-3 for programmable control logic, I/O aggregation, and state-machine implementations in industrial systems operating across −40 °C to 85 °C.
• System Integration / SOPC  Integrate megafunctions and custom logic alongside embedded RAM to consolidate peripheral functions and reduce external component count.
• Interface & Protocol Conversion  Implement protocol bridging, I/O buffering, and custom interface logic using the device’s plentiful I/O and on-chip memory resources.

Unique Advantages

• Balanced Logic and Memory  2,880 logic elements paired with 20,480 bits of embedded RAM enable mixed control and data-buffering tasks without relying on external memory.
• industrial-ready thermal range  Specified −40 °C to 85 °C operation and an exposed-pad package help manage thermal performance in industrial deployments.
• Compact, PCB-friendly Package  The 240-BFQFP exposed-pad surface-mount package provides a space-efficient footprint with improved board-level heat dissipation.
• Flexible Reconfiguration  Supports in-circuit reconfigurability and JTAG boundary-scan for development, field upgrades, and testability without consuming user logic.
• Regulatory and Assembly Friendly  RoHS compliance eases environmental compliance and assembly considerations for production deployments.

Why Choose EPF10K50VRI240-3?

The EPF10K50VRI240-3 positions itself as a mid-density, industrial-temperature FPGA that brings together a practical balance of logic elements, embedded RAM, and extensive I/O in a compact surface-mount package. It is suited to designers seeking SOPC-style integration, reliable in-field reconfigurability, and a clear upgrade path within the FLEX 10K family.

Selection of this device benefits teams focused on reducing external components, consolidating interface logic, and deploying designs that must operate across a wide temperature range while remaining RoHS compliant.

Request a quote or submit a procurement inquiry to obtain pricing, lead-time, and availability details for the EPF10K50VRI240-3.