EPF10K50VRC240-4N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad

Quantity 543 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VRC240-4N – FLEX-10K FPGA — 2,880 logic elements, 20,480-bit embedded RAM, 189 I/O, 240-BFQFP

The EPF10K50VRC240-4N is a FLEX 10K family field programmable gate array (FPGA) offering embedded programmable logic with an integrated array architecture suitable for system-level integration. It combines 2,880 logic elements and approximately 20,480 bits of embedded RAM with 189 user I/O pins in a 240-pin BFQFP exposed pad package.

Designed for commercial-grade applications, this device supports in-circuit reconfigurability and system-level features from the FLEX 10K family to enable flexible implementation of memory, specialized logic, and general-purpose logic functions while operating from a 3.0 V to 3.6 V supply and a 0 °C to 70 °C temperature range.

Key Features

  • Core Logic  2,880 logic elements and a maximum system gate count of 116,000, enabling medium-density logic implementations for embedded control and glue-logic tasks.
  • Logic Array Blocks (LABs)  360 logic array blocks for structured routing and resource allocation within the logic fabric.
  • Embedded Memory  Approximately 20,480 bits of on-chip RAM (embedded array blocks) to support buffers, FIFOs, and small on-chip data storage.
  • I/O and Interfacing  189 user I/O pins for flexible external interfacing; individual pin options such as tri-state control and programmable output slew-rate are available in the FLEX 10K family.
  • Package & Mounting  240-BFQFP exposed pad package (supplier device package: 240-RQFP, 32×32) with surface-mount compatibility for standard PCB assembly.
  • Power & Temperature  Voltage supply range 3.0 V to 3.6 V and commercial operating temperature from 0 °C to 70 °C to match common embedded system environments.
  • System-Level Features  Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; includes family-level features such as built-in JTAG boundary-scan test circuitry.
  • Environmental Compliance  RoHS compliant to meet common lead-free assembly requirements.

Typical Applications

  • Embedded Control  Implement control logic, state machines, and peripheral glue for mid-complexity embedded systems using on-chip logic and RAM.
  • Interface Bridging  Use the device’s 189 I/O pins to bridge and adapt signals between multiple digital interfaces and legacy peripherals.
  • Memory-Integrated Logic  Leverage approximately 20,480 bits of embedded RAM for buffering, small FIFOs, or storage used by data-path logic and custom accelerators.
  • Prototyping & Development  Rapidly iterate hardware functionality with in-circuit reconfigurability through external configuration options or the JTAG port.

Unique Advantages

  • Balanced logic and memory resources: Combines 2,880 logic elements with roughly 20,480 bits of embedded RAM to support control and small-data applications without external memory in many designs.
  • High I/O density: 189 user I/O pins provide flexibility for multi-signal interfaces and board-level integration.
  • Reconfigurability: In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG enables design updates and iterative development.
  • Commercial temperature and 3.3 V-class power: Operates from 3.0 V to 3.6 V and across a 0 °C to 70 °C range to match standard commercial embedded product requirements.
  • RoHS compliant: Meets lead-free assembly requirements for modern production processes.
  • Exposed-pad BFQFP package: 240-pin BFQFP with exposed pad offers thermal and soldering characteristics suitable for surface-mount PCB designs.

Why Choose EPF10K50VRC240-4N?

The EPF10K50VRC240-4N positions itself as a versatile medium-density FPGA option within the FLEX 10K family, combining structured logic resources, embedded RAM, and a high I/O count in a compact 240-pin BFQFP package. It is suited to engineers building mid-complexity embedded systems, interface logic, and prototypes that benefit from on-chip memory and in-circuit reconfiguration.

With family-level system features and RoHS compliance, this device offers a practical balance of integration, configurability, and production-ready packaging for commercial applications where 3.0–3.6 V operation and a 0–70 °C temperature range are appropriate.

Request a quote or submit a purchase inquiry to receive pricing and availability for the EPF10K50VRC240-4N. Provide your quantity and delivery requirements to get a tailored response.

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