EPF10K50VRC240-4N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 543 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VRC240-4N – FLEX-10K FPGA — 2,880 logic elements, 20,480-bit embedded RAM, 189 I/O, 240-BFQFP
The EPF10K50VRC240-4N is a FLEX 10K family field programmable gate array (FPGA) offering embedded programmable logic with an integrated array architecture suitable for system-level integration. It combines 2,880 logic elements and approximately 20,480 bits of embedded RAM with 189 user I/O pins in a 240-pin BFQFP exposed pad package.
Designed for commercial-grade applications, this device supports in-circuit reconfigurability and system-level features from the FLEX 10K family to enable flexible implementation of memory, specialized logic, and general-purpose logic functions while operating from a 3.0 V to 3.6 V supply and a 0 °C to 70 °C temperature range.
Key Features
- Core Logic 2,880 logic elements and a maximum system gate count of 116,000, enabling medium-density logic implementations for embedded control and glue-logic tasks.
- Logic Array Blocks (LABs) 360 logic array blocks for structured routing and resource allocation within the logic fabric.
- Embedded Memory Approximately 20,480 bits of on-chip RAM (embedded array blocks) to support buffers, FIFOs, and small on-chip data storage.
- I/O and Interfacing 189 user I/O pins for flexible external interfacing; individual pin options such as tri-state control and programmable output slew-rate are available in the FLEX 10K family.
- Package & Mounting 240-BFQFP exposed pad package (supplier device package: 240-RQFP, 32×32) with surface-mount compatibility for standard PCB assembly.
- Power & Temperature Voltage supply range 3.0 V to 3.6 V and commercial operating temperature from 0 °C to 70 °C to match common embedded system environments.
- System-Level Features Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; includes family-level features such as built-in JTAG boundary-scan test circuitry.
- Environmental Compliance RoHS compliant to meet common lead-free assembly requirements.
Typical Applications
- Embedded Control Implement control logic, state machines, and peripheral glue for mid-complexity embedded systems using on-chip logic and RAM.
- Interface Bridging Use the device’s 189 I/O pins to bridge and adapt signals between multiple digital interfaces and legacy peripherals.
- Memory-Integrated Logic Leverage approximately 20,480 bits of embedded RAM for buffering, small FIFOs, or storage used by data-path logic and custom accelerators.
- Prototyping & Development Rapidly iterate hardware functionality with in-circuit reconfigurability through external configuration options or the JTAG port.
Unique Advantages
- Balanced logic and memory resources: Combines 2,880 logic elements with roughly 20,480 bits of embedded RAM to support control and small-data applications without external memory in many designs.
- High I/O density: 189 user I/O pins provide flexibility for multi-signal interfaces and board-level integration.
- Reconfigurability: In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG enables design updates and iterative development.
- Commercial temperature and 3.3 V-class power: Operates from 3.0 V to 3.6 V and across a 0 °C to 70 °C range to match standard commercial embedded product requirements.
- RoHS compliant: Meets lead-free assembly requirements for modern production processes.
- Exposed-pad BFQFP package: 240-pin BFQFP with exposed pad offers thermal and soldering characteristics suitable for surface-mount PCB designs.
Why Choose EPF10K50VRC240-4N?
The EPF10K50VRC240-4N positions itself as a versatile medium-density FPGA option within the FLEX 10K family, combining structured logic resources, embedded RAM, and a high I/O count in a compact 240-pin BFQFP package. It is suited to engineers building mid-complexity embedded systems, interface logic, and prototypes that benefit from on-chip memory and in-circuit reconfiguration.
With family-level system features and RoHS compliance, this device offers a practical balance of integration, configurability, and production-ready packaging for commercial applications where 3.0–3.6 V operation and a 0–70 °C temperature range are appropriate.
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