EPF10K50VRI240-4N

The EPF10K50VRI240-4N is a FLEX 10K family Field Programmable Gate Array (FPGA) device designed for embedded programmable logic applications. It combines a dedicated logic array and embedded memory to support system-level integration in industrial-grade designs.

With 2,880 logic elements, 20,480 bits of on-chip RAM and 189 user I/O pins in a 240-pin BFQFP exposed-pad package, this device targets embedded control, communications interface, and other systems that require mid-range logic density and programmable I/O in a surface-mount industrial package.

Key Features

• Core Logic  Provides 2,880 logic elements and 360 logic array blocks (LABs) for implementing combinational and sequential logic functions.
• On-chip Memory  Includes 20,480 bits of embedded RAM to support FIFOs, small data buffers and lookup tables without external memory.
• Logic Capacity  Rated with up to 116,000 system gates for mid-range gate-count designs within the FLEX 10K family.
• I/O and Interfaces  189 user I/O pins in the 240-BFQFP exposed-pad package, offering flexible pinout for peripheral and sensor interfacing; per-family features include programmable output slew-rate and individual tri-state control.
• Power  Operates from a 3.0 V to 3.6 V supply range appropriate for 3.3 V system domains.
• Package and Mounting  240-BFQFP exposed pad (supplier device package 240-RQFP 32×32), surface-mount mounting for standard PCB assembly and thermal coupling through the exposed pad.
• Industrial Temperature Range  Specified for −40 °C to 85 °C operation, meeting industrial environmental requirements.
• In-circuit Reconfigurability & Test  Family-level features include in-circuit reconfigurability via external configuration devices or JTAG and built-in IEEE 1149.1 boundary-scan test circuitry (series documentation).
• System-Level Integration  Part of the FLEX 10K family architecture that supports embedded array blocks and system-on-a-programmable-chip integration for consolidating specialized functions and memory alongside general logic.

Typical Applications

• Industrial Control  Use for motor control, sequencers and PLC peripherals where industrial temperature range, flexible I/O and on-chip RAM simplify system design.
• Embedded Interfaces  Ideal for protocol bridging, custom interface logic and I/O aggregation that require mid-range logic density and numerous user I/Os.
• Communications Equipment  Suitable for control-plane logic, packet buffering and protocol preprocessing using the device’s embedded RAM and logic elements.
• Prototyping and Custom SoC Integration  Useful in development platforms and custom system integration where reconfigurability and embedded memory speed time-to-market for new logic functions.

Unique Advantages

• Balanced Logic and Memory:  2,880 logic elements paired with 20,480 bits of embedded RAM allow compact implementation of mixed logic and storage functions on a single device.
• Industrial-ready Operating Range:  Rated for −40 °C to 85 °C, enabling deployment in harsh or variable temperature environments.
• Flexible I/O Count in a Compact Package:  189 user I/Os in a 240-pin BFQFP exposed-pad package provide ample external connectivity while retaining a small board footprint.
• Surface-mount Exposed-pad Package:  Exposed pad enhances thermal performance and simplifies PCB thermal management for continuous operation.
• Reconfigurability and Test Support:  Supports in-circuit reconfiguration and IEEE 1149.1 boundary-scan test capability (family-level feature), aiding development, manufacturing test and field updates.

Why Choose EPF10K50VRI240-4N?

The EPF10K50VRI240-4N positions itself as a mid-range FLEX 10K FPGA that combines a practical balance of logic elements, embedded memory and I/O in an industrial-grade, surface-mount package. It is well suited for engineering teams needing on-chip RAM and programmable logic density for control, interface and embedded processing tasks without moving to larger, more costly devices.

Selecting this device provides designers with a FLEX 10K family architecture and series-level capabilities such as reconfigurability and boundary-scan test support, enabling scalable designs and streamlined integration into existing development workflows.

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