EPF10K70RC240-3N

The EPF10K70RC240-3N is a member of the FLEX 10K embedded programmable logic family, delivering mid-density FPGA capability for commercial embedded designs. It combines a logic array and embedded memory resources to enable system-on-a-programmable-chip integration for applications that require programmable logic, on-chip RAM, and flexible I/O.

Designed for 5.0 V systems, this surface-mount device in a 240-pin BFQFP exposed-pad package targets commercial temperature-range applications and board-level integration where reconfigurable logic and substantial I/O are required.

Key Features

• Logic Capacity — 3,744 logic elements implemented across 468 LABs, providing capacity for medium-complexity logic functions.
• Embedded Memory — 18,432 total RAM bits of on-chip RAM for implementing FIFOs, small frame buffers, or other megafunctions without external memory.
• Gate Density — Maximum system gates up to 118,000, enabling substantial combinational and sequential logic integration.
• I/O and Packaging — 189 user I/O pins in a 240-BFQFP exposed-pad (240-RQFP, 32×32) surface-mount package, facilitating dense board routing and thermal conduction via the exposed pad.
• Power and Temperature — Operates from 4.75 V to 5.25 V and rated for commercial ambient temperatures from 0 °C to 70 °C.
• Reconfiguration and Test — Family-level support for in-circuit reconfigurability via external configuration devices, intelligent controllers, or JTAG; includes IEEE Std. 1149.1 boundary-scan test circuitry available without consuming device logic.
• Flexible Interconnect and Arithmetic Support — FastTrack continuous routing, dedicated carry and cascade chains, and multiple global clock/clear resources for structured, high-performance designs.
• Compliance — RoHS compliant, suitable for lead-free assembly processes.

Typical Applications

• Embedded Systems — Implements control logic, protocol bridging, and custom finite-state machines where integrated RAM and logic reduce external component count.
• I/O-Intensive Interfaces — Supports designs requiring a high pin count for sensor aggregation, data multiplexing, or front-end I/O conditioning.
• System Integration / SOPC — Leverages embedded arrays and logic array to build megafunctions and system-level blocks on a single device.
• Board-Level Prototyping and Low-Volume Products — Commercial-grade temperature range and a BFQFP package make this device appropriate for prototyping and commercial products where reconfigurability is required.
• PCI-Based Designs — Family-level support for PCI Local Bus Specification (Revision 2.2) makes the device suitable for PCI-related system designs where FLEX 10K family features are required.

Unique Advantages

• Integrated Memory and Logic: On-chip 18,432 bits of RAM plus 3,744 logic elements reduce the need for external RAM and discrete logic, simplifying BOM and board area.
• Substantial I/O in a Compact Package: 189 user I/Os in a 240-pin BFQFP streamline board-level integration while providing ample connectivity for complex designs.
• Reconfigurability and Testability: In-circuit reconfiguration options and built-in JTAG boundary-scan accelerate development cycles and streamline production test.
• Family Interoperability: FLEX 10K family pin-compatibility within the same package enables migration or scaling across device densities without wholesale PCB redesign.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 70 °C operation and RoHS compliant to support lead-free manufacturing processes.

Why Choose EPF10K70RC240-3N?

The EPF10K70RC240-3N positions itself as a practical mid-density FPGA solution for commercial embedded designs that need a balance of logic capacity, embedded RAM, and substantial I/O in a compact, surface-mount package. Its FLEX 10K family architecture provides flexible routing, dedicated arithmetic chains, and reconfiguration capabilities that streamline system-level integration.

Choose this device when you need scalable, reprogrammable logic for prototyping, system integration, or I/O-rich commercial products where 5.0 V operation, package-level thermal management, and on-chip memory resources deliver tangible design simplification and reduced external component requirements.

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