EPF10K70RC240-2N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 18432 3744 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 550 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 468 | Number of Logic Elements/Cells | 3744 | ||
| Number of Gates | 118000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of EPF10K70RC240-2N – FLEX-10K Field Programmable Gate Array (240-BFQFP Exposed Pad)
The EPF10K70RC240-2N is an Intel FLEX-10K family FPGA offering a balanced mix of logic capacity, embedded memory, and I/O density in a 240-pin exposed-pad BFQFP package. It is designed for system-level programmable logic applications where in-circuit reconfigurability, on-chip memory blocks and flexible interconnect are required.
Targeted applications include SOPC-style integration, embedded memory and specialized logic megafunctions, and designs that require a 5.0 V supply domain (operating range 4.75 V to 5.25 V) with commercial temperature operation.
Key Features
- Logic Capacity Provides 3,744 logic elements and a maximum system gates rating of 118,000, enabling medium-density programmable logic implementations.
- Embedded Memory Includes 18,432 total RAM bits and support for embedded array blocks as part of the FLEX-10K architecture for efficient on-chip storage and megafunction implementation.
- I/O and Connectivity Offers 189 user I/O pins (package-specific) to support a broad range of external interfaces and board-level connectivity.
- Supply and Temperature Designed for 5.0 V operation with a specified voltage supply range of 4.75 V to 5.25 V and commercial operating temperature range of 0 °C to 70 °C.
- Reconfiguration and Test Supports in-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port; includes built-in IEEE 1149.1 JTAG boundary-scan test circuitry.
- FLEX-10K Family Architecture Leverages the FLEX-10K architecture features such as dedicated carry and cascade chains, FastTrack interconnect, and multiple global clock/clear signals for predictable timing and arithmetic performance.
- Package and Mounting Supplied in a 240-BFQFP exposed-pad package (supplier device package: 240-RQFP 32×32) suitable for surface-mount assembly.
- Regulatory RoHS compliant.
Typical Applications
- System Integration and SOPC Use the device to consolidate specialized logic and embedded memory into a programmable system-on-a-chip design.
- Embedded Memory Functions Implement on-chip RAM-based buffers, FIFOs, or small embedded data stores using the device’s 18,432 RAM bits and embedded array blocks.
- PCI and Peripheral Interfaces Deploy the FPGA in systems that require flexible I/O and programmable interface logic for peripheral bus implementations compatible with 5.0 V domains.
- Prototyping and Reconfigurable Systems Take advantage of in-circuit reconfigurability and JTAG for iterative hardware development and field updates.
Unique Advantages
- Balanced Logic and Memory: 3,744 logic elements combined with 18,432 RAM bits let you implement both control logic and embedded data functions without external memory in many designs.
- System-Level Integration: FLEX-10K family features support megafunctions and SOPC-style integration to reduce BOM count and simplify board-level architecture.
- Predictable Timing Structures: FastTrack interconnect, dedicated carry and cascade chains, and multiple global clocks help produce consistent timing for arithmetic and high-fan-in logic structures.
- Field Reconfigurability and Test: In-circuit reconfiguration pathways and built-in JTAG boundary-scan enable field updates and board-level test without consuming user logic.
- 5.0 V Supply Compatibility: Designed to operate from a 4.75 V to 5.25 V supply, supporting legacy 5.0 V system domains.
- Commercial Temperature and Surface-Mount Packaging: Commercial grade operation (0 °C to 70 °C) and a 240-pin BFQFP exposed-pad surface-mount package ease integration into standard PCB assemblies.
Why Choose EPF10K70RC240-2N?
The EPF10K70RC240-2N positions itself as a practical medium-density FPGA solution within the FLEX-10K family, combining 3,744 logic elements, embedded memory, and flexible I/O in a compact 240-pin exposed-pad package. It is well suited to designers who need in-system reconfigurability, on-chip RAM for megafunctions, and predictable timing resources delivered on a 5.0 V platform.
This part benefits development and production teams looking for scalable programmable logic that integrates logic, memory and testability while remaining within commercial temperature and surface-mount packaging constraints. The FLEX-10K family architecture and built-in reconfiguration/test capabilities support iterative hardware design and long-term maintainability.
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