EPF10K70RC240-2N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 18432 3744 240-BFQFP Exposed Pad

Quantity 550 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs468Number of Logic Elements/Cells3744
Number of Gates118000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of EPF10K70RC240-2N – FLEX-10K Field Programmable Gate Array (240-BFQFP Exposed Pad)

The EPF10K70RC240-2N is an Intel FLEX-10K family FPGA offering a balanced mix of logic capacity, embedded memory, and I/O density in a 240-pin exposed-pad BFQFP package. It is designed for system-level programmable logic applications where in-circuit reconfigurability, on-chip memory blocks and flexible interconnect are required.

Targeted applications include SOPC-style integration, embedded memory and specialized logic megafunctions, and designs that require a 5.0 V supply domain (operating range 4.75 V to 5.25 V) with commercial temperature operation.

Key Features

  • Logic Capacity  Provides 3,744 logic elements and a maximum system gates rating of 118,000, enabling medium-density programmable logic implementations.
  • Embedded Memory  Includes 18,432 total RAM bits and support for embedded array blocks as part of the FLEX-10K architecture for efficient on-chip storage and megafunction implementation.
  • I/O and Connectivity  Offers 189 user I/O pins (package-specific) to support a broad range of external interfaces and board-level connectivity.
  • Supply and Temperature  Designed for 5.0 V operation with a specified voltage supply range of 4.75 V to 5.25 V and commercial operating temperature range of 0 °C to 70 °C.
  • Reconfiguration and Test  Supports in-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port; includes built-in IEEE 1149.1 JTAG boundary-scan test circuitry.
  • FLEX-10K Family Architecture  Leverages the FLEX-10K architecture features such as dedicated carry and cascade chains, FastTrack interconnect, and multiple global clock/clear signals for predictable timing and arithmetic performance.
  • Package and Mounting  Supplied in a 240-BFQFP exposed-pad package (supplier device package: 240-RQFP 32×32) suitable for surface-mount assembly.
  • Regulatory  RoHS compliant.

Typical Applications

  • System Integration and SOPC  Use the device to consolidate specialized logic and embedded memory into a programmable system-on-a-chip design.
  • Embedded Memory Functions  Implement on-chip RAM-based buffers, FIFOs, or small embedded data stores using the device’s 18,432 RAM bits and embedded array blocks.
  • PCI and Peripheral Interfaces  Deploy the FPGA in systems that require flexible I/O and programmable interface logic for peripheral bus implementations compatible with 5.0 V domains.
  • Prototyping and Reconfigurable Systems  Take advantage of in-circuit reconfigurability and JTAG for iterative hardware development and field updates.

Unique Advantages

  • Balanced Logic and Memory:  3,744 logic elements combined with 18,432 RAM bits let you implement both control logic and embedded data functions without external memory in many designs.
  • System-Level Integration:  FLEX-10K family features support megafunctions and SOPC-style integration to reduce BOM count and simplify board-level architecture.
  • Predictable Timing Structures:  FastTrack interconnect, dedicated carry and cascade chains, and multiple global clocks help produce consistent timing for arithmetic and high-fan-in logic structures.
  • Field Reconfigurability and Test:  In-circuit reconfiguration pathways and built-in JTAG boundary-scan enable field updates and board-level test without consuming user logic.
  • 5.0 V Supply Compatibility:  Designed to operate from a 4.75 V to 5.25 V supply, supporting legacy 5.0 V system domains.
  • Commercial Temperature and Surface-Mount Packaging:  Commercial grade operation (0 °C to 70 °C) and a 240-pin BFQFP exposed-pad surface-mount package ease integration into standard PCB assemblies.

Why Choose EPF10K70RC240-2N?

The EPF10K70RC240-2N positions itself as a practical medium-density FPGA solution within the FLEX-10K family, combining 3,744 logic elements, embedded memory, and flexible I/O in a compact 240-pin exposed-pad package. It is well suited to designers who need in-system reconfigurability, on-chip RAM for megafunctions, and predictable timing resources delivered on a 5.0 V platform.

This part benefits development and production teams looking for scalable programmable logic that integrates logic, memory and testability while remaining within commercial temperature and surface-mount packaging constraints. The FLEX-10K family architecture and built-in reconfiguration/test capabilities support iterative hardware design and long-term maintainability.

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