EPF10K70RC240-2
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 18432 3744 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,188 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 468 | Number of Logic Elements/Cells | 3744 | ||
| Number of Gates | 118000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of EPF10K70RC240-2 – FLEX-10K® FPGA, 3,744 Logic Elements, 18,432 bits RAM, 189 I/O, 240-BFQFP Exposed Pad
The EPF10K70RC240-2 is a FLEX 10K series field-programmable gate array (FPGA) in a 240-BFQFP exposed-pad package designed for commercial embedded and system-level applications. It combines a dedicated logic array with embedded memory resources to enable System-on-a-Programmable-Chip (SOPC) integration, making it suitable for custom logic, interface, and control functions.
This device provides 3,744 logic elements, 18,432 bits of on-chip RAM, and 189 user I/O pins, operating from a 4.75 V to 5.25 V supply and within a 0 °C to 70 °C commercial temperature range.
Key Features
- Core Architecture FLEX 10K embedded programmable-logic architecture combining a logic array with embedded array blocks for implementing both general logic and efficient megafunctions.
- Logic Capacity 3,744 logic elements enabling mid-density programmable logic implementations and custom control functions.
- On-Chip Memory 18,432 bits of embedded RAM for data buffering, state storage, and small memory-intensive functions.
- I/O and Interfaces 189 user I/O pins to support multiple external interfaces and peripheral connections in a single device.
- Supply Voltage Designed for a 5.0 V supply range (4.75 V to 5.25 V) to match legacy 5 V system domains.
- Package 240-BFQFP exposed pad (supplier package: 240-RQFP, 32×32) for surface-mount PCB designs requiring a thermal/exposed pad option.
- Temperature & Grade Commercial grade operation from 0 °C to 70 °C.
- Configuration & Test Supports in-circuit reconfigurability via external configuration device or JTAG; includes JTAG boundary-scan test circuitry compliant with IEEE 1149.1 (series-level feature).
- Series-Level System Features FLEX 10K family features such as embedded megafunction arrays, low standby current behavior for many devices, and options for clock management (series-level features described in the FLEX 10K data sheet).
- RoHS Compliant Device is compliant with RoHS environmental requirements.
Typical Applications
- Embedded Control Implement custom control logic, state machines, and interface glue in industrial or commercial embedded systems.
- Peripheral & Interface Bridging Consolidate multiple peripheral interfaces or perform protocol translation using available I/O and on-chip logic.
- Custom Acceleration Offload specialized bit-level or arithmetic functions into dedicated programmable logic and embedded RAM.
- Prototyping and System Integration Rapidly prototype SOPC elements and validate system-level functions before production design handoff.
Unique Advantages
- Balanced Logic and Memory 3,744 logic elements paired with 18,432 bits of embedded RAM provide a practical balance for mid-density designs requiring both logic and local storage.
- High I/O Count 189 user I/O pins enable flexible system connectivity and reduce the need for external interface components.
- 5 V System Compatibility Native 4.75 V to 5.25 V supply support simplifies integration into legacy 5 V platforms.
- Package with Exposed Pad The 240-BFQFP exposed-pad footprint supports thermal management and compact surface-mount implementations.
- Series-Level Tool Support FLEX 10K family design support includes vendor-provided place-and-route and development tools (series documentation), helping accelerate design implementation.
- Test and Configuration Options Built-in JTAG boundary-scan and in-circuit reconfigurability options streamline board-level testing and field updates.
Why Choose EPF10K70RC240-2?
The EPF10K70RC240-2 positions itself as a mid-density, commercial-grade FPGA option within the FLEX 10K family, delivering a practical combination of 3,744 logic elements, 18,432 bits of embedded RAM, and 189 I/O in a 240-BFQFP exposed-pad package. Its 5 V supply compatibility and JTAG/configuration features make it well suited for embedded designers and system integrators working on interface-rich or SOPC-style solutions.
Choose this device when you need a programmable, tested platform with a balance of logic, memory, and I/O to consolidate functions, reduce board-level component count, and accelerate development using the FLEX 10K series design tools and configuration options.
Request a quote or submit an inquiry for pricing and availability of the EPF10K70RC240-2 to move your design forward.

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