EPF10K70RC240-2

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 18432 3744 240-BFQFP Exposed Pad

Quantity 1,188 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs468Number of Logic Elements/Cells3744
Number of Gates118000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of EPF10K70RC240-2 – FLEX-10K® FPGA, 3,744 Logic Elements, 18,432 bits RAM, 189 I/O, 240-BFQFP Exposed Pad

The EPF10K70RC240-2 is a FLEX 10K series field-programmable gate array (FPGA) in a 240-BFQFP exposed-pad package designed for commercial embedded and system-level applications. It combines a dedicated logic array with embedded memory resources to enable System-on-a-Programmable-Chip (SOPC) integration, making it suitable for custom logic, interface, and control functions.

This device provides 3,744 logic elements, 18,432 bits of on-chip RAM, and 189 user I/O pins, operating from a 4.75 V to 5.25 V supply and within a 0 °C to 70 °C commercial temperature range.

Key Features

  • Core Architecture FLEX 10K embedded programmable-logic architecture combining a logic array with embedded array blocks for implementing both general logic and efficient megafunctions.
  • Logic Capacity 3,744 logic elements enabling mid-density programmable logic implementations and custom control functions.
  • On-Chip Memory 18,432 bits of embedded RAM for data buffering, state storage, and small memory-intensive functions.
  • I/O and Interfaces 189 user I/O pins to support multiple external interfaces and peripheral connections in a single device.
  • Supply Voltage Designed for a 5.0 V supply range (4.75 V to 5.25 V) to match legacy 5 V system domains.
  • Package 240-BFQFP exposed pad (supplier package: 240-RQFP, 32×32) for surface-mount PCB designs requiring a thermal/exposed pad option.
  • Temperature & Grade Commercial grade operation from 0 °C to 70 °C.
  • Configuration & Test Supports in-circuit reconfigurability via external configuration device or JTAG; includes JTAG boundary-scan test circuitry compliant with IEEE 1149.1 (series-level feature).
  • Series-Level System Features FLEX 10K family features such as embedded megafunction arrays, low standby current behavior for many devices, and options for clock management (series-level features described in the FLEX 10K data sheet).
  • RoHS Compliant Device is compliant with RoHS environmental requirements.

Typical Applications

  • Embedded Control Implement custom control logic, state machines, and interface glue in industrial or commercial embedded systems.
  • Peripheral & Interface Bridging Consolidate multiple peripheral interfaces or perform protocol translation using available I/O and on-chip logic.
  • Custom Acceleration Offload specialized bit-level or arithmetic functions into dedicated programmable logic and embedded RAM.
  • Prototyping and System Integration Rapidly prototype SOPC elements and validate system-level functions before production design handoff.

Unique Advantages

  • Balanced Logic and Memory 3,744 logic elements paired with 18,432 bits of embedded RAM provide a practical balance for mid-density designs requiring both logic and local storage.
  • High I/O Count 189 user I/O pins enable flexible system connectivity and reduce the need for external interface components.
  • 5 V System Compatibility Native 4.75 V to 5.25 V supply support simplifies integration into legacy 5 V platforms.
  • Package with Exposed Pad The 240-BFQFP exposed-pad footprint supports thermal management and compact surface-mount implementations.
  • Series-Level Tool Support FLEX 10K family design support includes vendor-provided place-and-route and development tools (series documentation), helping accelerate design implementation.
  • Test and Configuration Options Built-in JTAG boundary-scan and in-circuit reconfigurability options streamline board-level testing and field updates.

Why Choose EPF10K70RC240-2?

The EPF10K70RC240-2 positions itself as a mid-density, commercial-grade FPGA option within the FLEX 10K family, delivering a practical combination of 3,744 logic elements, 18,432 bits of embedded RAM, and 189 I/O in a 240-BFQFP exposed-pad package. Its 5 V supply compatibility and JTAG/configuration features make it well suited for embedded designers and system integrators working on interface-rich or SOPC-style solutions.

Choose this device when you need a programmable, tested platform with a balance of logic, memory, and I/O to consolidate functions, reduce board-level component count, and accelerate development using the FLEX 10K series design tools and configuration options.

Request a quote or submit an inquiry for pricing and availability of the EPF10K70RC240-2 to move your design forward.

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