EPF10K70RC240-4

The EPF10K70RC240-4 is a FLEX-10K family field programmable gate array (FPGA) optimized for commercial embedded designs requiring on-chip memory and configurable logic. It combines a mid-range logic capacity with embedded memory resources and a 240-pin BFQFP exposed-pad package for surface-mount board integration.

This device is suited to system-on-a-programmable-chip (SOPC) integration, implementing megafunctions and specialized logic while providing a balance of I/O density, memory, and reconfigurability for a variety of commercial embedded applications.

Key Features

• Logic Capacity — 3,744 logic elements delivering approximately 118,000 gates of logic capacity for medium-complexity designs.
• Embedded Memory — 18,432 bits of on-chip RAM to implement buffers, FIFOs, and other megafunctions without consuming logic elements.
• I/O Resources — 189 user I/O pins to support parallel interfaces, GPIO expansion, and system-level connectivity.
• Configuration and Test — Built-in JTAG boundary-scan (IEEE Std. 1149.1) for device programming and board-level test without using device logic.
• Dedicated Arithmetic and High-Fan-In Support — Family-level support for dedicated carry and cascade chains and low-skew clock distribution for efficient implementation of adders, counters, and high fan-in logic.
• Power Supply — Designed for a 5.0 V supply range (4.75 V to 5.25 V) appropriate for 5 V system domains.
• Package & Mounting — 240-BFQFP exposed pad (supplier device package: 240-RQFP 32×32) in a surface-mount form factor for compact board layouts and thermal conduction through the exposed pad.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operating temperature for commercial applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• System Integration & SOPC — Use the EPF10K70RC240-4 to integrate multiple system functions, on-chip memory, and custom logic for compact embedded systems.
• Memory-Intensive Logic — Implement buffering, packet staging, or small data caches using the device’s 18,432-bit embedded RAM.
• I/O Expansion and Interface Bridging — Leverage 189 I/O pins for parallel peripherals, custom interface bridging, or control-plane logic in consumer and communications equipment.
• Board-Level Test and Programming — Built-in JTAG boundary-scan enables straightforward in-circuit programming and boundary-scan test during production.

Unique Advantages

• Balanced Logic and Memory — Combines 3,744 logic elements with 18,432 bits of embedded RAM to implement both control logic and data buffering on a single device, reducing external component count.
• High I/O Count — 189 user I/Os provide flexible connectivity options for complex board-level interfacing without additional GPIO expanders.
• Production-Friendly Package — 240-BFQFP with exposed pad supports surface-mount assembly and thermal dissipation for consistent board-level performance.
• JTAG-Enabled Development and Test — On-chip IEEE 1149.1 boundary-scan simplifies device programming and enables standard board test flows.
• Commercial Temperature Suitability — Specified 0 °C to 70 °C operation for mainstream commercial product deployment.
• Regulatory Compliance — RoHS compliance supports environmentally conscious product designs.

Why Choose EPF10K70RC240-4?

The EPF10K70RC240-4 positions itself as a versatile mid-range FLEX-10K FPGA for commercial embedded systems that require a combination of configurable logic, on-chip memory, and substantial I/O. Its 3,744 logic elements and 18,432 bits of RAM let designers implement megafunctions and specialized logic while minimizing external components.

Engineers building consumer, communications, or general-purpose embedded solutions will find this device appropriate where a 5 V supply domain and commercial temperature operation are standard, and where board-level testability and reconfigurability via JTAG are valuable for manufacturing and field updates.

Request a quote or submit an inquiry to discuss availability, pricing, and lead time for the EPF10K70RC240-4. Our team can provide additional ordering and technical details to support your design cycle.