EPF6010AFC256-1

The EPF6010AFC256-1 is a FLEX 6000 family field-programmable gate array delivering 880 logic elements (approximately 10,000 typical gates) in a compact 256-ball FBGA (17×17) surface-mount package. The device is built on a register-rich, LUT-based OptiFLEX architecture and targets low-cost gate-array replacement, rapid prototyping, and reconfigurable system functions.

Designed for commercial applications, the device supports 171 I/O pins, a 3.0–3.6 V supply range, and an operating temperature range of 0 °C to 85 °C. It combines flexible configuration and test features with dedicated routing resources for predictable timing and arithmetic performance.

Key Features

• Core architecture  Register-rich, look-up table (LUT)-based OptiFLEX architecture that minimizes die area while providing reprogrammable logic.
• Logic capacity  Approximately 880 logic elements and about 10,000 typical gates as characterized for the FLEX 6000 family device.
• I/O and signaling  171 general-purpose I/O pins with individual tri-state output enable control and programmable output slew-rate to help manage signal integrity and system interfacing.
• Clock and routing  Built-in low-skew clock distribution and four low-skew global paths, plus the FastTrack interconnect structure for predictable routing delays.
• Arithmetic and high-fan-in logic  Dedicated carry chain and cascade chain resources for efficient adders, counters, comparators, and high-fan-in logic functions.
• Configuration and test  Supports in-circuit reconfigurability via external configuration device or intelligent controller and includes IEEE Std. 1149.1 JTAG boundary-scan test circuitry without consuming additional device logic.
• Supply and power  Operates from 3.0 V to 3.6 V. Family documentation notes low-power standby behavior for reduced idle current.
• Package and environmental  256-FBGA (17×17) surface-mount package, commercial grade, RoHS compliant, and specified for 0 °C to 85 °C operation.
• Quality and compatibility  Devices are 100% functionally tested prior to shipment and the FLEX 6000 family provides SameFrame pin-compatibility across densities and pin counts.

Typical Applications

• Prototyping and design validation  Reprogrammable SRAM-based logic and in-circuit reconfiguration let development teams iterate firmware and hardware quickly during prototyping and testing phases.
• Gate-array replacement  Offers a lower-cost, reprogrammable alternative to fixed gate-array designs for medium-complexity logic integration and volume transitions.
• Glue logic and interface bridging  High I/O count and programmable I/O controls enable protocol adaptation, bus bridging, and custom interface functions between subsystems.
• Control and timing-critical functions  Dedicated carry and cascade chains plus low-skew global clocks support fast arithmetic and timing-sensitive control logic.

Unique Advantages

• Reconfigurable during development  SRAM-based device architecture and in-circuit reconfigurability simplify iterative design changes and late-stage updates without PCB rework.
• Predictable routing and timing  FastTrack interconnect, dedicated carry/cascade resources, and a low-skew clock tree help reduce timing uncertainty for critical paths.
• High I/O flexibility  171 I/O pins with individual tri-state control and programmable slew-rate improve interoperability with diverse voltage domains and peripheral devices.
• Compact, production-ready package  256-FBGA (17×17) surface-mount package minimizes board area while supporting production assembly processes for commercial electronics.
• Tested and compatible  100% functional testing at shipment and SameFrame pin-compatibility across the FLEX 6000 family reduce qualification effort when scaling designs across densities.
• RoHS compliant  Environmentally compliant for systems requiring lead-free component selection.

Why Choose EPF6010AFC256-1?

The EPF6010AFC256-1 brings a practical combination of reprogrammability, predictable routing, and a compact FBGA package for commercial embedded designs that require medium-density logic integration. Its OptiFLEX architecture and dedicated arithmetic/cascade structures deliver efficient use of silicon area while providing the flexibility needed during prototyping and product iterations.

This device is well suited for teams looking to replace fixed gate-array logic with a reprogrammable solution, implement complex interface logic with abundant I/O, or accelerate development cycles via in-circuit reconfiguration and family-level pin compatibility.

Request a quote or submit an RFQ to evaluate the EPF6010AFC256-1 for your next design.